Cadence and TSMC Expand Collaboration Efforts on Integrated Design Flow for InFO Technology

Highlights:

SAN JOSE, Calif., March 15, 2016 — (PRNewswire) — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it is expanding its collaboration with TSMC on an integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology. The flow integrates IC-level with package design tools to provide a seamless flow with enhanced features for InFO technology, reducing overall design turnaround time. TSMC's InFO technology can enable much more tightly coupled co-design and co-validation, simplifying heterogeneous integration of multiple dies.

Cadence Logo. (PRNewsFoto/Cadence Design Systems, Inc.) (PRNewsFoto/CADENCE DESIGN SYSTEMS_ INC_)

Under the expanded collaboration, the companies are working together on the InFO design flow which includes the following Cadence® implementation, signoff and electrical/thermal tools:

  • Physical Verification System: Includes advanced technologies and rule decks to support design rule checking (DRC), layout versus schematic (LVS), in-design rule checking and inter-die DRC/LVS
  • Cadence System-in-Package (SiP) Layout: Supports all popular package interconnect and assembly methodologies and provides a complete constraint- and rules-driven substrate layout environment, including full 3D design visualization, verification and editing capabilities
  • Sigrity™ IC package analysis and 3D modeling: Provides a complete solution for assessment and modeling of IC packages and is comprised of industry-leading Sigrity technologies that enable signal- and Power Delivery Network (PDN)-performance assessment, 2D and 3D analysis, electrical model extraction and signoff report generation for IC packages
  • Voltus™ IC Power Integrity Solution: Cell-level power integrity tool that supports comprehensive electromigration and IR-drop (EM/IR) design rules and requirements while providing full-chip system-on-chip (SoC) power signoff accuracy

For more information on the TSMC InFO design flow, visit: www.cadence.com/news/TSMCInFOTech.

"The InFO design flow is an example of another important collaboration between Cadence and TSMC that our customers appreciate and benefit from," said Steve Durrill, senior product engineering group director at Cadence. "We are continuing to work together to develop the seamlessly integrated implementation and signoff InFO solution so designers can meet increasingly tight market windows as they target TSMC's most advanced manufacturing processes."

"The current InFO advanced wafer-level packaging technology provides cost-effective system scaling to increase system bandwidth," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "We are working closely with Cadence to provide additional benefits to our joint customers with faster design turnaround time due to the smooth integration of signoff analysis tools."

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.

© 2016 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence and the Cadence logo are registered trademarks and Sigrity and Voltus are trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
408-944-7039
Email Contact

Logo - http://photos.prnewswire.com/prnh/20140102/SF39436LOGO

 

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/cadence-and-tsmc-expand-collaboration-efforts-on-integrated-design-flow-for-info-technology-300236275.html

SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
Web: http://www.cadence.com




Review Article Be the first to review this article
 True Circuits: Ultra PLL

Aldec Simulator Evaluate Now

Featured Video
Jobs
Senior DSP Firmware Engineer for Cirrus Logic, Inc. at Austin, TX
Design Verification Engineer for intersil at Morrisville, NC
Senior PIC Test Development Engineer for Infinera Corp at Sunnyvale, CA
DSP Tools Engineer for Cirrus Logic, Inc. at Austin, TX
Design Verification Engineer for Cirrus Logic, Inc. at Austin, TX
RF IC Design Engineering Manager for Intel at Santa Clara, CA
Upcoming Events
IC Open Innovation Panel During REUSE 2017 at Santa Clara Convention Center 5001 Great America Parkway Santa Clara CA - Dec 14, 2017
Essentials of Electronic Technology: A Crash Course at Columbia MD - Jan 16 - 18, 2018
Essentials of Digital Technology at MD - Feb 13 - 14, 2018
CST: Webinar series
TrueCircuits: IoTPLL



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise