Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology

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* Editors’ Note 1: Samsung’s chip-scale package (CSP) is combination of advanced flip chip technology and phosphor dispensing technology. A CSP chip can be created by flipping over blue LED chips and then immediately coating them with a phosphor substance.

** Editor’s Note 2: Flip chip technology is a technology that mounts the LED dies upside down so that its top side faces down, in contrast to  wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to electric boards.

*** Editor’s Note 3: Luminous flux is the measured parameter of the perceived power of  light on human eye, and uses lumen (lm) as unit in LED industry. One lumen is defined as the luminous flux of light produced by a light source that emits one  candela of  luminous intensity over a solid angle of one square radian.


Samsung Device Solutions Americas
John E. Lucas, APR, 408-712-7856
Sr. Mgr., Public Relations
Email Contact

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