Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology

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Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies that redefine the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems, and semiconductor and LED solutions. We are also leading in the Internet of Things space with the open platform SmartThings, our broad range of smart devices, and through proactive cross-industry collaboration. We employ 319,000 people across 84 countries with annual sales of US $196 billion. To discover more, and for the latest news, feature articles and press material, please visit the Samsung Newsroom at news.samsung.com.

* Editors’ Note 1: Samsung’s chip-scale package (CSP) is combination of advanced flip chip technology and phosphor dispensing technology. A CSP chip can be created by flipping over blue LED chips and then immediately coating them with a phosphor substance.

** Editor’s Note 2: Flip chip technology is a technology that mounts the LED dies upside down so that its top side faces down, in contrast to  wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to electric boards.

*** Editor’s Note 3: Luminous flux is the measured parameter of the perceived power of  light on human eye, and uses lumen (lm) as unit in LED industry. One lumen is defined as the luminous flux of light produced by a light source that emits one  candela of  luminous intensity over a solid angle of one square radian.



Contact:

Samsung Device Solutions Americas
John E. Lucas, APR, 408-712-7856
Sr. Mgr., Public Relations
Email Contact



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