Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology

By simplifying the LED component manufacturing process and improving LED package quality, the PoW LED package technology is expected to contribute significantly to the growth of the LED lighting industry.

Samsung has already applied its PoW technology to 4-inch wafers in flash LED packages for mobile devices since several years ago. Samsung also plans to utilize the PoW technology for its new CSP product line-up for lighting applications by the end of this year.

Samsung will showcase the new CSP products and technologies at the Light + Building 2016 event under the theme “Lighting & Beyond” in Frankfurt, Germany, March 13th – 18th. Visit Booth B04, Hall6.2 to learn more about Samsung’s differentiated LED technologies and innovative component solutions.


The full line-up of Samsung’s CSP includes:

Products   Light Efficacy   Production Schedule  


LM101A 149lm/W Mass production in January 2016 Bulb, High Bay, Spot, D/L
LM102A 135lm/W Mass production in March 2016 Bulb, High Bay, Spot, D/L
LH181A 162lm/W Q2 2016 Street, Tunnel, High Bay



124lm/W, 127lm/W Q2 2016 MR, PAR, D/L
PoW   8in Wafer technology   Q4 2016   All

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