By simplifying the LED component manufacturing process and improving LED package quality, the PoW LED package technology is expected to contribute significantly to the growth of the LED lighting industry.
Samsung has already applied its PoW technology to 4-inch wafers in flash LED packages for mobile devices since several years ago. Samsung also plans to utilize the PoW technology for its new CSP product line-up for lighting applications by the end of this year.
Samsung will showcase the new CSP products and technologies at the Light + Building 2016 event under the theme “Lighting & Beyond” in Frankfurt, Germany, March 13th – 18th. Visit Booth B04, Hall6.2 to learn more about Samsung’s differentiated LED technologies and innovative component solutions.
The full line-up of Samsung’s CSP includes:
|Products||Light Efficacy||Production Schedule||
|LM101A||149lm/W||Mass production in January 2016||Bulb, High Bay, Spot, D/L|
|LM102A||135lm/W||Mass production in March 2016||Bulb, High Bay, Spot, D/L|
|LH181A||162lm/W||Q2 2016||Street, Tunnel, High Bay|
|124lm/W, 127lm/W||Q2 2016||MR, PAR, D/L|
|PoW||8in Wafer technology||Q4 2016||All|