Building on its 3D Memory Manufacturing Leadership, Ultratech's 4G+ Inspection System's Low Cost-of-Ownership and Upgradability Earns Selection for Leading-edge 3D FinFET TechnologySAN JOSE, Calif., Jan. 21, 2016 — (PRNewswire) — Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today announced that its Superfast 4G+ was selected by a major leading foundry for the development of its 3D inspection and process control of its leading-edge FinFET processes. Ultratech's Superfast 4G+ system builds on the field leadership of the Superfast 4G, and provides the industry's highest-productivity for volume manufacturing in a low cost solution. The Superfast 4G+ system's patented coherent gradient sensing (CGS) technology enables Ultratech customers to use a single type of 3D wafer inspection tool to measure patterned wafers across the entire fab line at a low cost.
The Superfast 4G+ leads the foundry 3D process control with capabilities including:
- Improved overlay from over two years of Lithography DFF (Displacement Feed Forward) experience
- Foundry-critical, in-house, high-temperature annealing knowledge of distortion
- Rapid algorithm development enabling customization of its 3D inspection to foundry requirements
- A system architecture empowering field upgradability for multiple nodes
David Owen, Ultratech CTO for Inspection Systems, said, "It is exciting to see Superfast being selected by this leading foundry. The CGS technology is the best equipped in providing the low cost, 3D process control capabilities required by advanced foundry FinFETs. Combining 3D structures with high-temperature annealing requires the inline 3D topography and stress control in which Superfast excels. This foundry partnership and the ability to customize our algorithm to FinFET requirements led to this selection. I look forward to our FinFET process control collaboration and the development of new inspection modes."
Ultratech's Superfast 4G+ Inspection System
Based on patented CGS technology, Ultratech's Superfast 4G+ inspection system provides the industry's highest throughput (150 wph) with the lowest cost-of-ownership compared to competing systems. The direct, front-side 3D topography measurement capability is well-suited for patterned wafer applications such as lithography feed-forward overlay distortion and edge-defocus control as well as thin-film deposition stress and planarization control. Delivering a 2X improvement in performance with fleet matching TMU (Total Measurement Uncertainty), along with the ability to measure opaque and transparent stacks on patterned wafers, the Superfast 4G+ provides cost-effective technology to address the critical needs of its global customers. In addition, leveraging the same breakthrough CGS optical module, the Superfast 4G+ is available as a field upgrade of the Superfast 4G.
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About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: frontend semiconductor, backend semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
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SOURCE Ultratech, Inc.
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