Simberian Inc. will participate in the DesignCon 2016 conference and exhibition, January 19 - 21 at the Santa Clara Convention Center. Simberian will be featuring demonstrations of updated Simbeor THz electromagnetic signal integrity software and 3-hour tutorial on systematic approach to modeling dielectrics and conductors for interconnect design at 10-50 Gbps data rates.
Simberian Inc., an industry leader in electromagnetic simulation technology, will demonstrate
updated Simbeor THz electromagnetic signal integritysoftware at Booth #422 at DesignCon 2016. Demonstration will include pre and post layout analysis of typical PCB interconnects operating up to 33 Gbps with cross-talk, broadband dielectric and conductor roughness model identification with GMS-parameters and SPP technique up to 50 GHz, and unique electromagnetic field visualization for typical PCB structures.
The tutorial “ A Material World: Modeling Dielectrics and Conductors for Interconnects Operating at 10-50 GBPS”, will be held on January 19, from 9 am - 12 pm at Ballroom EF. C. Nwachukwu from Isola, S. McMorrow from Samtec-Teraspeed and Y. Shlepnev from Simberian will discuss theory of broadband modelling of composite PCB/packaging dielectrics and conductor roughness, manufacturing aspects and material model identification with multiple practical comparative examples.
Simbeor THz is two-time DesignVision award-winning software for physical design of PCB and packaging interconnects operating up to THz frequency range. Simbeor THz provides unique systematic approach to the interconnect analysis that starts from the material model identification and guaranties the analysis to measurement correlation at the end. Updated Simbeor THz is available for customers and trials at www.simberian.com.
About DesignCon: DesignCon, produced by UBM Canon, is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com/santaclara/. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business.