Multiple Dimensions (booth 1253) announces major investments to meet volume 3D-MID demands. Adding multiple new laser direct structuring systems, Multiple Dimensions is now the leading European volume producer of custom 3D-Molded Interconnect Devices serving diverse markets from automotive, consumer, security housings, and more. Anywhere plastics and electronics meet, 3D-MID belongs in the designer's toolkit.
National Instruments (booth 711) will be featuring several technologies: a higher performance model of the VirtualBench all-in-one instrument, PXI-based software designed instruments with user-programmable FPGAs, as well as NI Multisim™ circuit design software.
Neoconix (booth 529) is proud to introduce its FPConnected™ family, which integrates its novel connector products into high performance FPC assemblies. The U31C Series simplifies USB Type C implementation and terminates onboard with a low profile X-Beam connection. The XFPC Series incorporates X-Beam terminations at each end of a customer-chosen FPC length.
Optellent, Inc. (booth 300) will be demonstrating its cost-effective compact 28 Gb/s bit-error-rate tester (OPBX280). Operating at 25-28 Gb/s and 10 Gb/s (optional), OPBX280 is suitable for bench-top and production environments. The OPBX280 is the latest among Optellent's test solutions targeting 40 Gb/s and 100 Gb/s applications.
Oupiin America (booth 518) will be showcasing their high-power edge card, bus bar connectors, PCI Express and power connectors up to 150 amps as well as their complete line of back plane connectors.
PacketMicro (booth 753) announces and demonstrates two new rugged probes with performance up to 20 GHz, four new fixed-arm and flex-arm positioners to cover all the needs of fine-pitch RF probing, the first USB3.1 Type-C test fixtures, and SFD de-embedding software.
PFC Flexible Circuits (booth 1255), DuPont and Taconic will be presenting the white paper, "Lower Loss and Process Friendly Multi-layer Flexible Interconnect."
Polliwog (booth 215) is proud to announce a brand-new EDA tool called PollEx SI/PI Explorer for pre & post frequency and time domain signal integrity analysis with a DDR bus analyzer and transmission line analyzer.
Quadcept (booth 216) is proud to announce a new interface with Digi-Key. Now users can select Digi-Key parts in Quadcept and generate a BOM as well as order Digi-Key parts via Quadcept.
Robson Technologies, Inc. (RTI) (booth 105) updated their ERP tool for improved job management and introduced an in-house laser engraver to offload and streamline CNC manufacture of parts. RTI is showcasing new custom engineered test hardware products and turn-key solutions, including pneumatic test fixtures.
Samtec, Inc. (booth 619) will feature Silicon-to-Silicon product demonstrations featuring Flyover QSFP System, Z-Ray® One-Piece Interposer, ExaMAX® High-Speed Backplane and SEARAY™ Open Pin Field Array interconnects. Other demonstrations include Channelyzer™, an online full channel simulation/analysis tool, and the Augmented Reality App to examine ExaMAX® as a real-time 3D image.
Sarokal Test Systems (T4) is proud to Introduce X-STEP™ Intruder. It is a physical-layer latency and error injection tool used for modeling real-life cable connection distances and signal degradation to test the robustness of a base station or network system.
Siglent Technologies (booth 1248) will be showcasing our new SSA3032X Spectrum Analyzer. With a frequency range of 9 KHz - 3.2 GHz, 10 Hz resolution bandwidth, low phase noise and low noise floor, the SSA3032X is provides the highest performance / dollar ratio of any spectrum analyzer in its class.
Simberian Inc. (booth 422) will showcase Simbeor THz electromagnetic signal integrity software. The cost-effective software further increases accuracy of interconnect analysis and productivity of signal integrity engineers.
SiSoft (booth 935) is announcing OptimEye™, which automatically co-optimizes SerDes TX and RX equalization to maximize margin for high-speed serial channels. OptimEye replaces traditional "blind sweeps" with an automated process that runs quickly enough to generate custom equalization settings for each individual channel in a large system with thousands of links.
SPISim (T6) will showcase both of its flagship EDA products, SPIPro, the free version and SPILite. SI functions from post-layout data review, schematic channel builder, IBIS, S-Parameter, Transmission line modeling, waveform analysis and optimization will all be demoed.
Taconic (booth 1139) introduces fastRise™ EZp, a low temperature cur¬ing , low loss flexible bondply for complex rigid/flex PWBs containing polyimide, LCP or PTFE cores without excessive movement. fastRise™ EZp bonds well to difficult-to-bond-to substrates, can be sequentially laminated, bonds better to copper than other RF prepregs and yields higher peel in foil laminations.
Top Dog Test (booth 1154) is launching and introducing to the market a new line of Data Loggers by Graphtec Corporation. Data logging capabilities and sensors can be used with the various platforms and are seemingly endless - everything from basic voltage measurements to CO2 concentration and DC strain.
Ventec International Group (booth 118) announces the launch of their 'tec-speed' brand, which unites one of the most comprehensive range of products in high-speed/low-loss PCB material technology and better positions the range under a single identity. The launch is driven by a growing demand for high-reliability and high-speed computing & storage applications.
Wurth Electronics Midcom (booth 1041) announces the availability of the SOCRATES™ Evaluation Kit for SHDSL Ethernet First Mile Modems. This kit provides the ability to test the capabilities of Lantiq's SOCRATES™ in single-pair SHDSL applications. This allows customers to test the SOCRATES™ chipset in a variety of applications.
Yamaichi Electronics (booth 849) introduces the CFP8 connector. The CFP8 is a new plugable optical module form factor established by CFP-MSA for 400GbEthernet. The connector is capable for up to 16 channels of 28GBaud electrical signal for CDAUI-16 and CDAUI-8, and also 56GBaud electrical signal for future demand.
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DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.
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