eSilicon to Present Real-World 2.5D Results at the 3D ASIP Conference

SAN JOSE, CA -- (Marketwired) -- Dec 08, 2015 -- eSilicon, a leading semiconductor design and manufacturing solutions provider, will present at the 2015 3D Architectures for Semiconductor Integration and Packaging (ASIP) Conference held in Redwood City, Calif., December 15-17, 2015.

What:
Afternoon session: Tutorial - Design of ICs using interposers or wafer-level packaging

eSilicon will describe its real-world methodology and experience in designing and manufacturing 2.5D interposers and discuss what can be done to maximize signal and power integrity in 2.5D ASICs.

Who:
Bill Isaacson, eSilicon's director, ASIC product marketing, will present Interposer design and its impact on the system

When:
Tuesday, December 15, 2015
1:10-1:30

Where:
Sofitel San Francisco Bay
223 Twin Dolphin Drive
Redwood City, CA 94065

About 3D ASIP
3D ASIP, now in its 12th year, is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the techno-market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena. For more information, visit the 3D ASIP conference website.

About eSilicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com

The right chip. Right now™

Contacts: 
Sally Slemons
eSilicon Corporation
408-635-6409

Email Contact

Susan Cain
Cain Communications
408-393-4794

Email Contact 





Review Article Be the first to review this article
Featured Video
Editorial
More Editorial  
Jobs
Engr, Elec Des 2 for KLA-Tencor at Milpitas, CA
ASIC Design Engineer 2 for Ambarella at Santa Clara, CA
Senior FPGA Designer for Fidus Electronic Product Development at Fremont, CA
Technical Support Engineer Germany/UK for EDA Careers at San Jose, CA
Timing Design Engineer(Job Number: 17001757) for Global Foundaries at Santa Clara, CA
Verification Engineer for Ambarella at Santa Clara, CA
Upcoming Events
CDNLive Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Apr 11 - 12, 2017
10th Anniversary of Cyber-Physical Systems Week at Pittsburgh, PA, USA PA - Apr 18 - 21, 2017
DVCon 2017 China, April 19, 2017, Parkyard Hotel Shanghai, China at Parkyard Hotel Shanghai Shanghai China - Apr 19, 2017
Zuken Innovation World 2017 at Hilton Head Marriott Resort & Spa Hilton Head Island NC - Apr 24 - 26, 2017
S2C: FPGA Base prototyping- Download white paper



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy