UMC’s Automotive Semiconductor Revenue Doubles YoY on Strong Customer Adoption

Accelerated growth as customers migrate additional auto grade 1 and grade 0 products to UMC 

Hsinchu, Taiwan, November 17, 2015 -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that revenue from its manufacture of semiconductors used in automotive applications has doubled (YoY) from 2014 to 2015. Full-year 2015 revenue for automotive ICs at UMC is expected to be hundreds of millions of US dollars. The explosive growth has primarily been fueled by top-tier customers migrating devices from consumer grade products to more stringent grade 1 and grade 0 semiconductors that are used for critical automotive functions, as well as increased demand from IDM and fabless auto semiconductor companies.

“As customer gain increased confidence in UMC’s automotive manufacturing capabilities, we are committed to continuously improving and enhancing our foundry automotive solutions,” said Po Wen Yen, CEO of UMC. “With our comprehensive UMC AutoSM technology platform consisting of AEC-Q100 qualified technology solutions and robust manufacturing that meets rigorous ISO TS-16949 automotive quality standards, UMC is well-positioned to further enable auto chip designers to take advantage of the increasing silicon content in vehicles.”

UMC manufactures semiconductors used in automotive applications for customers that include Japan-based suppliers such as Shindengen, TDK Corporation, New Japan Radio and Ricoh Electronic Devices, as well as other global companies in the U.S. and Europe. Products include a wide range of applications ranging from infotainment, heads-up display (HUD), advanced driver assistance systems (ADAS) and millimeter wave radar to essential engine, drivetrain, power management and navigation functions.

UMC has a successful history as an automotive IC supplier, being the first foundry to receive ISO 22301 certification for business continuity management and implementing a comprehensive “Automotive Service Package” that incorporates zero-defect practices within its manufacturing procedures. In addition, UMC is developing certified design models, IP and Foundry Design Kits specific to the UMC Auto platform in order to fulfill the increasing pace of evolvement of the auto industry supply chain. Automotive ICs manufactured at UMC have been widely adopted by the world’s most well-known carmakers in Japan, Europe, Asia and the United States.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC’s robust foundry solutions enable chip designers to leverage the company’s sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q100 Grade-0 automotive industry manufacturing capabilities. UMC’s 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S.  Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions.  Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.


Richard Yu
(886) 2-2658-9168 ext. 16951
Email Contact

Review Article Be the first to review this article
Downstream : Solutuions for Post processing PCB Designs

Featured Video
More Editorial  
Technical Support Engineer Germany/UK for EDA Careers at San Jose, CA
Verification Engineer for Ambarella at Santa Clara, CA
Lead Java Platform Engineer IOT-WEB for EDA Careers at San Francisco Area, CA
Engr, Elec Des 2 for KLA-Tencor at Milpitas, CA
ASIC Design Engineer for Ambarella at Santa Clara, CA
Timing Design Engineer(Job Number: 17001757) for Global Foundaries at Santa Clara, CA
Upcoming Events
CDNLive Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Apr 11 - 12, 2017
10th Anniversary of Cyber-Physical Systems Week at Pittsburgh, PA, USA PA - Apr 18 - 21, 2017
DVCon 2017 China, April 19, 2017, Parkyard Hotel Shanghai, China at Parkyard Hotel Shanghai Shanghai China - Apr 19, 2017
Zuken Innovation World 2017 at Hilton Head Marriott Resort & Spa Hilton Head Island NC - Apr 24 - 26, 2017
DownStream: Solutions for Post Processing PCB Designs
Verific: SystemVerilog & VHDL Parsers

Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy