Wirepas Joins ARM mbed Ecosystem

HELSINKI — (BUSINESS WIRE) — November 12, 2015 — Wirepas has joined the ARM®mbed™Partner ecosystem. Finnish based Wirepas provides advanced wireless communication solutions for connecting devices to the Internet. Wirepas PINO™ is highly scalable, energy-efficient, and fully self-configuring network protocol. With PINO™ customers can create wireless multi-hop mesh networks for most demanding applications and realize the full potential the Internet of Things (IoT) has to offer.

The ARM mbed IoT Device Platform is a software platform and operating system to simplify and speed up the creation and deployment of low-power, connected and secure IoT devices at scale. mbed is built around open standards and will bring Internet protocols, security and standards-based manageability into one integrated solution optimized for energy and cost-constrained devices.

"We are proud to be part of ARM mbed ecosystem and we believe that Wirepas and at the end of the day its customers will benefit from this partnership. Pino and ARM mbed OS complement each other perfectly. Pino optimizes mesh network performance at the lower layers of the protocol stack whilst ARM mbed OS provides high-end IP stack for things, common platform for developers, and the most efficient use of the underlying hardware." says Ville Kaseva, Wirepas CTO.

“The continued growth of the IoT market requires the integration of standards-based technologies and services,” said Simon Ford, vice president of products, IoT business, ARM. ”Wirepas has proven expertise in wireless communication solutions and with their Pino solution they will offer a compelling solution for commercial IoT deployments.”

Wirepas and PINO™ in brief

Wirepas is making Internet of Things happen. Wirepas PINO™ creates a wireless network of interconnected devices easily and without any investments to infrastructure. With PINO™, the connected devices are the network - easy as that. Wirepas has its headquarters in Tampere, Finland and offices in France and the United States.

This information was brought to you by Cision http://news.cision.com



Contact:

Wirepas
Teppo Hemiä
CEO
+358 (0)50 561 0198
teppo.hemia(at).wirepas.com
or
Sebastian Linko
Vice President, Marketing and Communications
+358 (0)40 023 6607
sebastian.linko(at)wirepas.com




Review Article Be the first to review this article
Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Job Openings: Can EDA Predict the Future
More Editorial  
Jobs
Engr, Elec Des 2 for KLA-Tencor at Milpitas, CA
Timing Design Engineer(Job Number: 17001757) for Global Foundaries at Santa Clara, CA
ASIC Design Engineer 2 for Ambarella at Santa Clara, CA
Verification Engineer for Ambarella at Santa Clara, CA
Technical Support Engineer for EDA Careers at Freemont, CA
Upcoming Events
CDNLive Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Apr 11 - 12, 2017
10th Anniversary of Cyber-Physical Systems Week at Pittsburgh, PA, USA PA - Apr 18 - 21, 2017
DVCon 2017 China, April 19, 2017, Parkyard Hotel Shanghai, China at Parkyard Hotel Shanghai Shanghai China - Apr 19, 2017
Zuken Innovation World 2017 at Hilton Head Marriott Resort & Spa Hilton Head Island NC - Apr 24 - 26, 2017
S2C: FPGA Base prototyping- Download white paper



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy