Reverse Costing Analysis of STMicroelectronics's HTS221 Humidity Sensor

DUBLIN, Sept. 28, 2015 — (PRNewswire) —

Research and Markets ( http://www.researchandmarkets.com/research/g4vgrl/stmicroelectronics) has announced the addition of the "STMicroelectronics HTS221 - Reverse Costing Analysis" report to their offering.

600769

The HTS221 humidity sensor is the first environment sensor from STMicroelectronics which follows the train of new open cavity combos. Assembled in a 6-pins LGA 2 x 2 x 0.9mm package; the HTS221 is a digital humidity and temperature sensor equipped with a sensor die and an ASIC. It has operating ranges of -40+125°C, 0100 % relative humidity for 16bit output data for temperature and humidity.

The relative humidity sensor uses a polymer dielectric planar capacitor digital measurement technology which allows a precise response in very compact size. The integrated heater allows a high ODR.

This device uses a new type of package built around an original holed cap developed by STMicroelectronics for mobile phones and for industrial application with a temperature range from -40 °C to +120 °C.

The report presents deep technology and cost analysis of HTS221 with an exhaustive package analysis. It also includes a technology and production cost comparison with Bosch BME280 humidity and pressure sensor and with Sensirion SHTC1 humidity MEMS.

Key Topics Covered:

1. Glossary

2. Overview/Introduction, Companies Profile

3. Physical Analysis

4.Package
- Package Views & Dimensions
- Package Opening
- Wire bonding Process
- Package Cross-Section

5. ASIC Die
- View, Dimensions & Marking
- ASIC Delayering
- ASIC main blocks identification
- ASIC Process
- ASIC Die Cross-Section

6. Pressure & Humidity Die
- View, Dimensions & Marking
- MEMS Humidity Sensing Area
- Cap
- MEMS Humidity Cross-Section
- MEMS processes

7.Comparison with Bosch BME280 and Sensirion SCHTC1 pressure sensor

8. Manufacturing Process Flow

9. ASIC Front-End Process
- MEMS humidity Process Flow
- Wafer Fabrication Units
- Packaging Process Flow & Assembly Unit

10. Cost Analysis

11. Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing
- ASIC Front-End Cost
- MEMS HumidityWafer & Die Cost
- MEMS HumidityFront-End Cost
- MEMS Humidity Back-End 0 : Probe Test & Dicing
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost
- BME280 Component Cost

12. Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/g4vgrl/stmicroelectronics

Media Contact: Laura Wood , +353-1-481-1716, Email Contact

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/reverse-costing-analysis-of-stmicroelectronicss-hts221-humidity-sensor-300149796.html

SOURCE Research and Markets

Contact:
Research and Markets
Web: http://www.researchandmarkets.com




Review Article Be the first to review this article
CST: Webinar September 14, 2017

Aldec

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Real Intent: Leveraging on Investments
More Editorial  
Jobs
FPGA Engineer for Teradyne Inc at San Jose, CA
Senior R&D Engineer...Timing Closure Specialist for EDA Careers at San Jose or Anywhere, CA
Field Application Engineer for Teradyne Inc at San Jose, CA
Senior Front-End RTL Design AE for EDA Careers at San Jose, CA
Technical Support Engineer EU/Germany/UK for EDA Careers at N/A, United Kingdom
Analog Hardware Engineer for Teradyne Inc at San Jose, CA
Upcoming Events
CODES+ISSS 2017, Oct 15-20, 2017, Lotte Hotel, Seoul, South Korea at Lotte Hotel Seoul Korea (North) - Oct 15 - 20, 2017
DVCon 2017 Europe, Oct 16 - 17, 2017, Munich, Germany at Holiday Inn Munich City Centre Munich Germany - Oct 16 - 17, 2017
11th International Symposium on Networks-on-Chip (NOCS 2017) at Seoul Korea (South) - Oct 19 - 20, 2017
Verific: SystemVerilog & VHDL Parsers
TrueCircuits: IoTPLL



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise