New Version of Virtual Fabrication Platform Addresses More Demanding Process Challenges and Provides Usability and Performance Enhancements
CARY, NC-- June 30, 2015 - Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the immediate availability of SEMulator3D® 5.0 - the newest version of its coreVirtual Fabrication software platform. Version 5.0 of SEMulator3D adds support for new process capabilities and is re-architected for a more streamlined learning, deployment and modeling process.
The 5.0 version of theintegrated modeling platformincludes several process, usability and automation improvements. Process improvements include new, advanced capabilities for handling dopants, including new process models for ion implant, thermal diffusion and in-situ doped deposition and epitaxy. Along with these dopant-modeling capabilities, come new dopant concentration visualization features in the SEMulator3D Viewer. Additional improvements in deposition and etch models capture visibility-limited effects and off-axis processes to predict effects of specific process equipment and variation. All these capabilities are added while improving the modeling performance significantly, enabling faster modeling turn-around or more parallelism for broader DOE results.
SEMulator3D 5.0 includes a completely revampedgraphical user interface (GUI) for the Process Editor, which will enable faster process development for novice and advanced users alike. Coventor continues to add to the library of supported interface types to/from SEMulator3D, to interface with Parasitic Extraction (PEX) tools and device simulation tools such as the Gold Standard Simulation (GSS) Garandplatform. Expeditor, the SEMulator3D batch execution engine, continues to expand, now representing the dominant methodology for modeling design and process variation in 3D semiconductor technologies.
"SEMulator3D 5.0 can support an even wider range of processesnow, which expands the usage of this platform. SEMulator3D is still the fastest, most predictive and robust semiconductor process modeling platform, and with 5.0 these advantages can be applied to even more projects," said David Fried, CTO - Semiconductor for Coventor. “With the new features in 5.0 along with significant usability and automation improvements, we can stretch further into device-process optimization and serve the need of our equipment manufacturer customers better. This is especially important,since virtual fabrication is becoming the methodology of choice to address the time and cost issues associated with the most demanding development challenges.”
Performance and Productivity Enhancements
The newest version of Coventor’s SEMulator3D Virtual Fabrication Platform enables process modeling for FinFETs, 3D NAND Flash, BEOL, Nanowires, 3D-IC, FDSOI, DRAM, and other next generation processes. In addition it includes the following features that enable new capabilities and performance levels:
- Modeling Performance Enhancements
- Dopant Handling Capabilities: Implant, Diffusion, Doped Deposition
- Dopant Concentration Visualization
- Visibility-Effects in Deposition and Etch with off-axis processing
- New GUI for the Process Editor
- Makes process setup, development and maintenance simpler
- More configurable for broader deployment across large organizations
- Adaptive Incremental Re-Build in Expeditor
- Dramatically reduces the time to run broad process/design DOEs
Coventor, Inc. is the market leader in automated design solutions for developing semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Its SEMulator3D modeling and analysis platform is used for fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Its MEMS design solutions are used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. The company is headquartered in Cary, North Carolina and has offices in California’s Silicon Valley, Waltham, Massachusetts, and Paris, France. More information is available at