Implementation of ARM(R) Cortex(R) core on process qualification vehicle for UMC's 14nm FinFET process technology.HSINCHU, Taiwan, June 22, 2015 — (PRNewswire) — United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node. The 14nm cooperation expands on the two companies' successful effort to develop and offer ARM Artisan® Physical IP on UMC's volume production 28nm High-K/Metal Gate process.
The validation of the UMC 14nm FinFET process technology kickstarts the enablement process for the rest of IP ecosystem needed for UMC's FinFET technology, including the need for foundation IP and ARM processor physical design.
"ARM and UMC share a long history of successful collaboration through multiple technology generations," said Will Abbey, general manager, physical design group, ARM. "We are highly encouraged by the test chip tape-out of a Cortex-A family core using UMC's 14nm FinFet process. ARM will continue its close partnership with UMC during the development of this advanced process node."
"As UMC prepares to make available our 14nm FinFET process to customers, it is important that we build a strong design support foundation to enhance our overall 14nm platform offering," said Steve Wang, vice president of UMC's IP and Design Support division. "ARM is a world-leading provider of advanced IP for leading-edge processes and we are excited to expand upon our past successes with them to develop Artisan Physical IP and Cortex-based solutions for our 14nm technology."
UMC's 14nm FinFET process has already demonstrated favorable 128mb SRAM yields and is expected to be ready for customer tape-out by late 2015.
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's robust foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q11 Grade-0 automotive industry manufacturing capabilities. UMC's 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.
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SOURCE United Microelectronics Corporation
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