Z-Ray® Ultra Low Profile, Ultra High Density Interposers Provide Ultimate Design Flexibility

Samtec’s Z-Ray ® one piece arrays are ultra-low profile, high density and highly customizable. These compression contact arrays are used as interposers or as board level interconnects. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance.

The new 1.00 mm pitch arrays (ZA1 Series) expand the Z-Ray ® interposers product line with the choice of dual compression contacts or single compression with solder balls. With up to 400 total BeCu micro-formed contacts, the arrays feature low 25 g normal force with .008" (0.20 mm) contact deflection. Z-Ray ® is a one piece design assembled into a rugged low profile single layer FR4 substrate to achieve a 1.00 mm stack height. Screw down and alignment holes are standard for use with press fit alignment hardware (ZD/ZSO/ZHSI Series) for precise alignment, compression and retention.

A variety of custom capabilities are available including the overall shape of the interposer, multiple pitches, higher pin counts in any pattern and stack heights from 0.305 mm to 4 mm. Design flexibility also includes features such as latches, thermal spreaders and quick-release spring constraints for more rugged applications. Quick-turn customizations are available and require minimal NRE and tooling charges. A customizable interposer with multi-layer FR4, for pitch spreaders and other embedded interconnect circuitry, is in development.

The Z-Ray® family of interposers includes a 0.80 mm pitch array (ZA8 Series) for micro pitch applications. In development is a 0.80 mm pitch 34 AWG twinax cable system (ZRDP/ZCI/ZCC Series) in an ultra low profile design with mating micro interposer and rugged metal cage.


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