A*STAR’S IME and Industry Partners to Enable High Density / Low-Cost Packaging Technology for System Scaling within Smart Devices

5.    JSR Corporation

JSR Corporation is a multinational company employing a little less than 6,000 people worldwide and a leading materials supplier in a variety of technology driven markets. JSR's global network is headquartered in Tokyo (Japan) and has factories and offices in Europe, US, China, Taiwan, Korea, Singapore and Thailand. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are a key to the present and future welfare of human society: life-sciences, energy storage, synthetic rubbers, electronic materials, display and optical materials.  

6.    Kingyoup Optronics

Kingyoup Optronics Co., Ltd. (KYO) is a world-class supplier of temporary bonding/de-bonding and thin film coating equipment and services for the semiconductor, flat panel display, solar photovoltaic, and touch panel industries. Being spun off in 2013 from Kingyoup Enterprises Co., Ltd., a 41-year distributor for precision equipments in Taiwan, KYO establishes joint-development cooperation with IBM to provide innovative bonding/de-bonding system for FOWLP, 2.5D/3D IC, and MEMS applications. Its thin film coating equipment supports production of some well-known consumer electronic products. Headquartered in Taipei, Taiwan, KYO has distributor network over all continents and operation facilities in Taiwan and China.

For more information on Kingyoup Optronics, please visit http://www.kyopt.com.

7.    KLA-Tencor

KLA-Tencor Corporation, a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor, LED and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for more than 35 years. Headquartered in Milpitas, California, KLA-Tencor has dedicated customer operations and service centers around the world. For more information on KLA-Tencor, please visit www.kla-tencor.com.

8.    Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, advanced SMT, wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. ( www.kns.com)


Kulicke & Soffa Industries, Inc.
Joseph Elgindy
Investor Relations & Strategic Planning
P: +1-215-784-7518
F: +1-215-784-6180
Email Contact

Sheila Frese
Public Relations
P: +1-949-399-2930
F: +1-949-660-0444
Email Contact

9.     NANIUM
NANIUM is a world-class provider of semiconductor assembly, packaging, test, engineering and manufacturing services. The company started as Siemens Semiconductors back in 1996 and nowadays is a leader in 300mm Wafer-Level Packaging (WLP), both Fan-In/WLCSP and Fan-Out/eWLB. NANIUM offers in-house capabilities for the entire development chain, from design to multiple Wafer-Level Packaging technologies, and the flexibility to tailor and test solutions that respond to the most demanding customer requirements. The company is based near Porto, Portugal, and has sales offices in Dresden, Germany and Boston, USA. More information on NANIUM is available at www.nanium.com.

10. NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable Secure Connections for a Smarter World. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the application areas Connected Car, Security, Portable & Wearable and Internet of Things. NXP has operations in more than 25 countries, and posted revenue of $5.65 billion in 2014. Find out more at  www.nxp.com

11.  Orbotech Ltd.

Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. With the acquisition of SPTS Technologies, Orbotech is able to offer a broader range of process solutions for Advanced Packaging applications. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit  www.orbotech.com and www.spts.com.

12. STATS ChipPAC Ltd.

STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com.

13. Tokyo Ohka Kogyo

Tokyo Ohka Kogyo (TOK) Co., Ltd. was established in 1940. It has subsidiaries in Singapore, Taiwan, Europe, USA, Korea and China. TOK’s main business domain lies in the manufacturing of materials, mainly photoresists and high purity chemicals for photolithography process of semiconductor and liquid crystal display. Microprocess technology, such as photoresist, is supporting advancement in the electronics field. From micrometer to cutting-edge nanometer features, TOK provides optimal photoresists and related equipment tailored to the production of various semiconductor devices.

For more information, visit www.tok.co.jp/


[1] The worldwide combined shipments of devices (PCs, tablets, ultramobiles and mobile phones) for 2015 are estimated to reach 2.5 billion units, an increase of 3.9 per cent over 2014.

Source: http://www.gartner.com/newsroom/id/2954317


Lynn Hong
Senior Officer, Corporate Communications
Agency for Science, Technology and Research 
Tel: +65 6419 6597

« Previous Page 1 | 2             

Review Article Be the first to review this article


Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Acquiring Mentor: Four Good Ideas, One Great
More Editorial  
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
Upcoming Events
SEMICON Europe at Grenoble France - Oct 25 - 27, 2016
ARM TechCon 2016 at Santa Clara Convention Center Santa Clara CA - Oct 25 - 27, 2016
Call For Proposals Now Open! at Santa Clara Convention Center, Santa Clara, CA California CA - Oct 25 - 27, 2016
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
S2C: FPGA Base prototyping- Download white paper

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy