Call for Papers for DesignCon 2016 will open in MaySAN FRANCISCO, March 20, 2015 — (PRNewswire) — DesignCon, the premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, today announced the winners of the Best Paper Awards from the blockbuster 2015 program. Recognizing outstanding contributions to the educational goals of the DesignCon program, the awards serve to acknowledge the authors as leading practitioners in semiconductor and electronic design. DesignCon's 20th anniversary event was held January 27-30 in Santa Clara, CA. To view the full list of winners, visit: ubm.io/DC15PaperWinners.
Papers were judged on merit as well as presentation quality during DesignCon 2015. All papers are reviewed for originality, relevance, impact and quality by the DesignCon Technical Program Committee, comprised of leading experts from all levels of the electronic design space – chip, board, package and system. Presentation quality is judged based on audience feedback collected at DesignCon. The awards were divided into four categories: Modeling & Simulation, High-Speed Signal Design, Power Integrity & Signal Integrity, and Test & Measurement.
….and the winners are:
Modeling & Simulation
Behavioral Modeling of Random Jitter with Realistic Time and Frequency Dependence
- Scott Wedge, Sr. Staff Engineer, Synopsys, Inc.
Package Simulations For Mitigating Noise Coupling Onto Sensitive RF Signals
- Dmitry Fliter, SI/PI & Packaging Engineer, CSR
- Nir Malka, SI/PI & Packaging Dep. Manager, CSR
Practical Method for Modeling Conductor Surface Roughness Using Close Packing of Equal Spheres
- Bert Simonovich, Signal Integrity and Backplane Design Consultant, Lamsim Enterprises Inc.
High-Speed Signal Design
Does Skew Really Degrade SERDES Performance?
- Gustavo Blando, Senior Principal HW Engineer, Oracle
- Shirin Farrahi, HW Engineer, Oracle
- Vijay Kunda, Senior HW Engineer, Oracle
- Istvan Novak, Senior Principal HW Engineer, Oracle
- Li Ying, Senior HW Engineer, Oracle
- Xun Zhang, Principal Hardware Engineer, Oracle
A Simple and Innovative Circuit Technique To Tackle Power Supply Induced Jitter In High Speed Serial Links For 25Gbps
- Dan Oh, Signal and Power Integrity (Si/Pi) Architect, Altera Corporation
- Yujeong Shim, Member of Technical Staff, Altera Corporation
56+ Gb/s Serial Transmission using Duo-binary Signaling
- Timothy De Keulenaer, Doctoral Researcher, INTEC-IMEC
- Jan De Geest, Senior Staff R&D Signal Integrity Engineer, FCI
- Guy Torfs, Senior Researcher, INTEC-IMEC
- Johan Bauwelinck, Professor, Ghent University/iMinds
- Yu Ban, Doctoral Researcher, INTEC-IMEC
- Jeffrey Sinsky, Member of Technical Staff, Alcatel-Lucent
- Bartek Kozicki, Member of Technical Staff, Alcatel-Lucent
Power Integrity & Signal Integrity
Vectorless Prediction of Simultaneous Switching Noise from FPGAs
- Chunchun Sui, Ph.D Candidate, Missouri University of Science and Technology
Optimization of PCB Capacitors for Signal Integrity Performance in Mixed Reference Channels
- Gerardo Romo Luevano, Staff Engineer/Manager, Qualcomm Technology Inc.
- Martin Schauer, Principal Engineer, CST of America
- Darryl Kostka, Senior Application Engineer, CST of America
- Selman Ozbayat, Sr. Engineer, Qualcomm Technology Inc.
Test & Measurement
100 Gb/s Ethernet 100GBASE-CR4 Test Points and Test Fixtures
- Christopher DiMinico, President/CTO, MC Communications
- Mike Sapozhnikov, Technical Leader, Cisco Systems
- Mike Resso, Signal Integrity Application Scientist, Keysight Technologies
One-Sided Measurement of Power Supply Impedance without Connectors
- Joachim Held, EMC Consultant, Siemens AG
- Richard Sjiariel, Senior Application Engineer, CST
"The winners of this year's Best Paper Awards highlight some of the top talent in semiconductor and electronic design today," said DesignCon Technical Program Director, Janine Love. "This awards program not only recognizes some of the best and brightest, but it also incentivizes researchers to produce high-quality DesignCon papers, ensuring our attendees get the most innovative content at our annual shows. Congratulations to all finalists and winners."
For additional highlights and insights from DesignCon, visit EDN's DesignCon Central: edn.com/designcon.
DesignCon 2016 Call for Papers
Coming off of an incredible show in January, DesignCon is already gearing up for what should be another record-breaking show next year. DesignCon 2016 will take place January 19-22 at the Santa Clara Convention Center in Santa Clara, CA. Call for Papers will open in mid-May, and the deadline for submissions is June 30, 2015. For more information and updates, visit: designcon.com.
Follow DesignCon online:
DesignCon, produced by UBM Tech, is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com/santaclara/.
UBM Canon is the leading B-to-B event producer, publisher, and digital media company for the world's $3 trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the advanced manufacturing market and leverage our proprietary 1.3 million name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. UBM Canon is part of UBM plc (UBM.L) a global provider of media and information services for professional B-to-B communities and markets.
To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/designcon-2015-recognizes-outstanding-research-and-writing-with-best-paper-awards-300052723.html
SOURCE UBM Canon