Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications

RESEARCH TRIANGLE PARK, N.C., March 18, 2015 -  Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement withSony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix's hybrid bonding patents for high volume applications.

"This license agreement with Sony is an exciting milestone for Ziptronix because it removes any doubt that our patented DBI hybrid bonding technology is both manufacturable and beneficial for high volume applications," noted Dan Donabedian, CEO and president of Ziptronix. "We believe it demonstrates that our patented hybrid bonding technology is both enabling and cost effective as compared to stacking with TSVs. Sony licensed Ziptronix's ZiBond direct bonding patents in 2011, which we also believe grew their image sensor market share from a few percent to the largest market share in the industry. We expect this new license for Ziptronix's DBI hybrid bonding patents will further contribute to Sony's growth within the industry. Any company wishing to compete in this space will need Ziptronix's DBI hybrid bonding patents."

About Ziptronix

A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® direct bonding and DBI® hybrid bonding technologies deliver the industry's most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking.  The company's intellectual property has been licensed for a variety of semiconductor applications including BSI sensors, RF front ends, pico-projectors, memories and 3D integrated circuits.  Founded in 2000 as a venture-backed spinoff of RTI International, the company has been issued 45 U.S. patents and 42 international patents, with 18 U.S. and international patent applications pending.  www.ziptronix.com.




Review Article Be the first to review this article
Aldec

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Simon Davidmann: A re-energized Imperas Tutorial at DAC
More Editorial  
Jobs
LVS for PDK Design Engineer SILICON VALLEY for EDA Careers at San Jose, CA
LVS PEX DESIGN ENGINEERS SILICON VALLEY for EDA Careers at San Jose, CA
Senior Front-End RTL Design AE for EDA Careers at San Jose, CA
DDR 3-4-5 Developer with VIP for EDA Careers at San Jose, CA
Upcoming Events
11th International Conference on Verification and Evaluation of Computer and Communication Systems at 1455 DeMaisonneuve W. EV05.139 Montreal Quebec Canada - Aug 24 - 25, 2017
DVCon India 2017, Sept 14 - 15, 2017 at The Leela Palace Bengalore India - Sep 14 - 15, 2017
SMTA International 2017 at Rosemont IL - Sep 17 - 21, 2017
DownStream: Solutions for Post Processing PCB Designs
S2C: FPGA Base prototyping- Download white paper
DownStream: Solutions for Post Processing PCB Designs



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy