IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO

BANNOCKBURN, Ill., USA, March 2, 2015 —  IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at  IPC APEX EXPO® at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.                                         

For his leadership of the D-33AT Task Group that developed the IPC-6012C Certification and Training courseDon Dupriest, Lockheed Martin Missiles & Fire Control, received a Committee Leadership Award. For their contributions to the IPC-6012C Certification and Training course, Elizabeth Allison, NTS – Baltimore; Gary Ferrari, FTG Circuits; Renee Michalkiewicz, NTS – Baltimore; Debora Obitz, Microtek – East; and Jose Rios, i3 Electronics, earned a Distinguished Committee Service Award.

For their leadership of the 5-45 Subcommittee that developed IPC-7801, Reflow Oven Process Control Standard, Joseph Kane, BAE Systems Platform Solutions and Linda Woody, Lockheed Martin Missile & Fire Control, earned a Committee Leadership Award. For their contributions to IPC-7801, MB Allen, KIC; Paul Austen, Electronic Controls Design Inc.; Frederick Beltran, L-3 Communications; Casimir Budzinski, Safari Circuits Inc.; Fred Dimock, BTU International; Scott Homan, IEC Electronics – Albuquerque; Robert Hornsblow, Datapaq Limited; Ife Hsu, Intel Corporation; Marc Peo, Heller Industries Inc.; Sam Polk, Lockheed Martin Missiles & Fire Control; Doug Schueller, AbelConn, LLC; Jose Servin Olivares, Continental Temic SA de CV; Geok Ang Tan, DSO National Laboratories; and Tomo Yoshikawa, Senju Comtek, earned a Distinguished Committee Service Award.

For their leadership of the 1-14 DFX Standards Subcommittee that developed the IPC DFX Guideline document, IPC-2231, Design for Excellence (DFX) Guideline During the Product Lifestyle, Karen McConnell, Northrop Grumman Corporation and Cheryl Tulkoff, DfR Solutions, earned a Committee Leadership Award.

For his leadership of the 5-21K Task Group that developed IPC-SM-817A, General Requirements for Dielectric Surface Mounting Adhesives, Nate Grinvalds, Rockwell Collins, earned a Committee Leadership Award. For his significant contributions to IPC-SM-817, Bev Christian, BlackBerry, earned a Special Recognition Award. For their contributions to IPC-SM-817A, David Adams, Rockwell Collins; Frederick Beltran, L-3 Communications; Lance Brack, Raytheon Missile Systems; Laura Cohen, Continental Automotive Systems; David Edwards, Henkel Corporation; Lionel Fullwood, WKK Distribution Ltd.; Ife Hsu, Intel Corporation; Richard Iodice, Raytheon Company; and Bill Vuono, TriQuint Semiconductor, earned a Distinguished Committee Service Award.

For his leadership of the 6-10C Task Group that developed IPC-TM-650 Method 2.6.26A, DC Current Induced Thermal Cycling Test, Randy Reed, Viasystems Group, Inc., earned a Committee Leadership Award. For their contributions to IPC-TM-650 Method 2.6.26A, Matthew Byrne, BAE Systems Platform Solutions; Bev Christian, BlackBerry; Vicka Hammill, Honeywell Inc. Air Transport Systems; Kevin Knadle, i3 Electronics; Paul Reid; and Jose Rios, i3 Electronics, earned a Distinguished Committee Service Award.

For their leadership of the 5-22AS Task Group that developed J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, Kathy Johnston, Raytheon Missile Systems and Garry McGuire, NASA Marshall Space Flight Center, earned a Committee Leadership Award. For their significant contributions to J-STD-001FS, James Blanche, NASA Marshall Space Flight Center; Agnieszka Ozarowski, BAE Systems Platform Solutions; and Jonathon Vermillion, Ball Aerospace & Technologies Corporation, earned a Special Recognition Award. For their contributions to J-STD-001FS, Kirk Armstrong, Naval Air Warfare Center Weapons Division; Gustavo Arredondo, Para Tech Coating Inc.; Robert Cooke, NASA Johnson Space Center; Robert Fornefeld, L-3 Communications; Daniel Foster, Missile Defense Agency; Constantino Gonzalez, ACME Training & Consulting; Gaston Hidalgo, Samsung Telecommunications America; Shelley Holt, L-3 Communications; Robert Humphrey, NASA Goddard Space Flight Center; Joseph Kane, BAE Systems Platform Solutions; Sean Keating, Amphenol Limited (UK); Leo Lambert, EPTAC Corporation; Gregg Owens, Space Exploration Technologies; Helena Pasquito, EPTAC Corporation; Pamela Petcosky, Lockheed Martin Mission Systems & Training; Patricia Scott, STI Electronics, Inc.; Jose Servin Olivares, Continental Temic SA de CV; and Zenaida Valianu, Celestica, earned a Distinguished Committee Service Award.                                                                                                    

For their leadership of the 2-30 Committee that developed IPC-T-50M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, Steven Bowles, Viasystems Group, Inc. and Vicka Hammill, Honeywell Inc. Air Transport Systems, earned a Committee Leadership Award. For their contributions to IPC-T-50M, Matthew Byrne, BAE Systems Platform Solutions; Don Dupriest, Lockheed Martin Missiles & Fire Control; Gary Ferrari, FTG Circuits; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Louis Hart, Compunetics Inc.; Joseph Kane, BAE Systems Platform Solutions; Nick Koop, TTM Technologies; Karen McConnell, Northrop Grumman Corporation; Steven Nolan, Lockheed Martin Mission Systems & Training, earned a Distinguished Committee Service Award.                                                                                                                                        

For his leadership of the 8-40 committee and 8-41 subcommittee that developed the 2015 IPC International Technology Roadmap for Electronic Interconnect, Jack Fisher, Interconnect Technology Analysis, Inc., earned a Committee Leadership Award. For their contributions to the 2015 IPC International Technology Roadmap for Electronic Interconnect, Mike Carano, OM Group Electronic Chemicals, LLC; Karen Carpenter, TechSearch International; Dennis Fritz, SAIC; Happy Holden, Holden Consulting; Rich Kraszewski, Plexus; and Raj Kumar, Viasystems North America, Inc., earned a Distinguished Committee Service Award.                                                                              

For their leadership of the D-33A Task Group that developed IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, Mark Buechner, BAE Systems and Randy Reed, Viasystems Group, Inc., earned a Committee Leadership Award. For their contributions to IPC-6012D, Lance Auer, Raytheon Missile Systems; Matthew Byrne, BAE Systems Platform Solutions; Denise Chevalier, Amphenol Printed Circuits, Inc.; Bill Dieffenbacker, BAE Systems Platform Solutions; Don Dupriest, Lockheed Martin Missiles & Fire Control; Gary Ferrari, FTG Circuits; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Vicka Hammill, Honeywell Inc. Air Transport Systems; Nick Koop, TTM Technologies; Leo Lambert, EPTAC Corporation; Cliff Maddox, Boeing Company; Chris Mahanna, Robisan Laboratory Inc.; Jim Monarchio, TTM Technologies, Inc.; Steve Nolan, Lockhead Martin Mission Systems & Training; Bill Ortloff, Raytheon Company; and Jose Rios, i3 Electronics, earned a Distinguished Committee Service Award.            

For their leadership of the 5-18g subcommittee that developed IPC-7092, Design and Assembly Process Implementation for Embedded Components, Raj Kumar, Viasystems North America, Inc.; and Vern Solberg, Solberg Technical Consulting, earned a Committee Leadership Award. For their contributions to IPC-7092, Hikmat Chammas, Honeywell Inc. Air Transport Systems; and Bruce Hughes, Amrdec MS&T EPPT, earned a Distinguished Committee Service Award.

For their leadership of the D-13 Subcommittee in the development of IPC-FC-234A, Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards, Michael Beauchesne, Amphenol Printed Circuits, Inc.; and Clark Webster, ALL Flex, LLC, earned a Committee Leadership Award. For his significant contributions to IPC-FC-234A, Terry Shepler, Electro-Materials, Inc., earned a Special Recognition Award. For their contributions to IPC-FC-234A, Scott Bowles, L-3 Fuzing and Ordnance Systems; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Thomas Gardeski, Gemini Sciences, LLC; John Leschisin, Minco Products, Inc.; Steven Nolan, Lockheed Martin Mission Systems & Training; and Brent Sweitzer, Multek Flexible Circuits, Inc., earned a Distinguished Committee Service Award.                                                   

For their leadership of the 5-23A Task Group that developed J-STD-003C Amendment 1, Solderability Tests for Printed Boards, Gerard O'Brien, Solderability Testing & Solutions, Inc. and Michah Pledger, Pledger Consulting, earned a Committee Leadership Award. For their contributions to J-STD-003C Amendment 1, Bev Christian, BlackBerry; David Sommervold, The Bergquist Company – Prescott; Henry Rekers, Schneider Electric; Jose Rios, i3 Electronics; Karl Sauter, Oracle America, Inc.; Louis Hart, Compunetics Inc.; and Mahendra Gandhi, Northrop Grumman Aerospace Systems, earned a Distinguished Committee Service Award.                                                      

For more information on these awards or the award recipients, contact  Sandy Gentry, IPC communications manager, at +1 847-597-2871.

About IPC

IPC ( www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,600 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.




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