- New IC to help drive innovation for tablets, phablets and handheld gaming devices -
TOKYO — (BUSINESS WIRE) — November 18, 2014 —
Corporation (TOKYO:6502) today announced the launch of
“TC358860XBG”, the industry's first VESA®
Embedded DisplayPort™ (eDP™)-to-MIPI® dual-Display
Serial Interface(DSI) converter IC. The new IC enables the 4K2K ultra
high definition (UHD) experience for handled electronic devices such as
tablets, phablets and portable gaming devices.
Sample shipments start today, with mass production scheduled to start in March, 2015.
Toshiba: 4K2K VESA Embedded DisplayPort(eDP)-to-MIPI Dual-DSI Bridge IC "TC358860XBG" (Photo: Business Wire)
The TC358860XBG is an embedded DisplayPort™ (eDP™)-to-MIPI®
dual-DSI converter IC with video format conversion and compression
technology support for UHD (4096 x 2160, 3840 x 2160), 4K2K, 60fps,
24bpp (bits per pixel) video inputs for high resolution displays.
Employing both high speed serial interfaces meeting industry standards
with low-power operation capability in one chip enables support for UHD
4K2K displays while continuing to meet the low power consumption
requirements of handheld devices.
Connecting with the application processors with eDP™ interface and high computing capabilities, the new IC enables set-makers to design portable devices supporting UHD 4K2K, WQXGA and WQHD content without latency.
> eDP™ RX support
|-||VESA® eDP™ v1.4|
|-||1:2 compression engine: Max 4K UHD (4096 x 2160, 24bpp at 60fps; 3840 x 2160, 24bpp at 60fps)|
|-||Non Compression: Max WQXGA (2560 x 1600, 24bpp at 60fps)|
|-||Main link: Max 4lane (1, 2, 4 Lane configurable), Voltage swing Min200mV|
|-||8Types of Bitrate support: 1.62 (LBR), 2.16, 2.43, 2.7 (HBR1), 3.24, 4.32, 4.86, 5.4 Gbps (HBR2)|
|-||Max 1Mbps AUX Channel support, Native and I2C-over-AUX Transaction support|
|> MIPI ® DSI Dual port TX support|
|-||Max 1.0Gbps/Lane Link speed interface|
Max 2 Port, 8 Lane, Total 8Gbps data transfer capability