Lattice Announces Production of MachXO3L Devices in WLCSP and caBGA Packages

The most capable non-volatile solution optimized for a wide range of power, size and cost-efficient applications

HILLSBORO, Ore. — (BUSINESS WIRE) — September 22, 2014 — Lattice Semiconductor Corp. (NASDAQ: LSCC), the leader in low power, small form factor, customizable solutions, today announced volume production of its industry-leading MachXO3LTM family in four tiny packages as small as 2.5 mm x 2.5 mm. Lattice also launched two new low-cost breakout boards that enable designers to evaluate the MachXO3L device’s hard IP, versatile I/O and other capabilities. These releases solidify the MachXO3L family’s lead in enabling engineers to quickly solve complex design problems in applications as diverse as industrial infrastructure and smart connected devices.

The MachXO3L family’s unique advantages include:

Lowest cost per I/O in the industry enabled by Wafer-Level Chip-Scale (WLCSP) and advanced Chip-Array BGA (caBGA) technology with package sizes as small as 2.5 mm x 2.5 mm and having up to 335 I/O in an industry leading 17 mm x 17 mm package. These enable engineers to fit big functionality in tiny spaces while maintaining cost competitiveness.

Low power leadership that includes an onboard regulator to simplify system design, eliminate thermal constraints and help engineers realize power efficient, always-on devices.

Instant-on capability with boot-up time of less than 1ms coupled with background system upgrade capability, dual boot and a single supply makes MachXO3L ideal for controlling bring-up and system initialization.

Hardened IP blocks including I2C, SPI, embedded memory, and an oscillator, all in an instant-on programmable fabric. The MachXO3L devices also support MIPI D-Phy based DSI and CSI2 I/O. These all help engineers design more quickly, improve reliability and reduce cost.

“Lattice is clearly ahead of its competition with a rich 25-year legacy of instant-on products,” said Keith Bladen, Corporate Vice President, Marketing. “Our non-volatile FPGA portfolio leads the industry with advanced 40 nm technology, power as low as 19 μW and the industry’s widest density range with 256 to 40K LUT devices in production today. The demand for MachXO3L devices is strong and growing with nearly 200 unique customers across a wide range of markets including industrial, communications and consumer.”

Availability

MachXO3L FPGAs are supported today by Lattice Diamond® software, soft IP and reference designs. Production devices and evaluation boards are available now from Lattice and its distributors. To learn more, please visit www.latticesemi.com/MachXO3.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the leader in low power, small form factor, low cost, customizable solutions for a quickly changing connected world. From making smart consumer devices smarter, to enabling intelligent industrial automation, or connecting anything to everything in communications, electronics manufacturers around the world use Lattice's solutions for fast time to market, product innovation and competitive differentiation. For more information, visit www.latticesemi.com. You can also follow us via LinkedIn, Twitter, Facebook or RSS.

Lattice Semiconductor Corporation, Lattice Semiconductor (& design), L (& design), MachXO3, MachXO3L, Lattice Diamond and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

MIPI is a licensed trademark of MIPI, Inc. in the U.S. and other jurisdictions.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.



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