Hsinchu, Taiwan (July 29, 2014)— With the rise of the Internet of Things (IoT) and wearable devices, the trend to connect electronic products and accessories wirelessly has created considerable market opportunities for wireless communication ICs. eMemory’s Multiple Times Programmable (MTP) Silicon Intellectual Property (SIP) NeoEE offers simple structure and small micro size for system on chip (SoC) design. Its ability to replace conventional plug-in EEPROM with embedded EEPROM can reduce IC size for achieving compact IC designs and production cost effectively. Moreover, NeoEE’s low-power consumption and high-read/write cycle features can help to extend devices’ battery life and fulfill the need for repeated frequency read/write of wireless communication ICs, assisting customers to grasp the key to success in the flourishing wireless communication IC market.
The popularization of smart phones and tablets in recent years has made mobile wireless communications an indispensable part of people’s everyday life and stimulated the demands of related ICs. The newly developed products demonstrated at “COMPUTEX TAIPEI” indicated that IoT and wearable devices are the leading industrial trend; hence the related products and the peripherals which require wireless connection are expected to bring the wave of demands for wireless communication ICs.
As the features of wearable and mobile devices are becoming increasingly powerful, and the product designs emphasis on compact yet with high read/write cycles and extended battery life features; how to minimize the wearable’s size to enhance comfort and decrease power consumption to maximize battery durability have become the essential target for every developer.
eMemory’s NeoEE SIP provides all the aforementioned features, which can assist clients to minimize product dimension and weight effectively. Its low-power consumption characteristic is also excellent for improving wireless devices’ standby time. NeoEE provides functional blocks in two modes including EEPROM and Flash architecture for IC pairing passwords storage and system execution-related data setting; which offers maximum design flexibility as customers can select either EEPROM or Flash architecture based on the application needs. NeoEE SIP can be embedded on the IC to replace conventional plug-in EEPROM and facilitate integration onto various process platforms. Furthermore, it can overcome the data security issues of plug-in EEPROM to strengthen information protection, making it the best choice for wireless communication ICs including Radio Frequency ICs (RFIC), MEMS Controllers, Bluetooth ICs, Near Field Communication ICs (NFC), Radio Frequency Identification ICs (RFID), etc.
eMemory’s NeoEE SIP has past qualification at leading foundries’ 0.3µm, 0.18µm, 0153µm, and 0.11µm processes platforms to provide customers versatile solutions for extensive applications and designs requirements. Looking into the future, eMemory will continue collaborating closely with 18 foundries partners worldwide to develop SIP for advanced applications, assisting clients to seize upon every opportunity of success in the competitive global market.
eMemory (TWSE: 3529) is a global leader in logic process embedded non-volatile memory (eNVM) silicon IP. Since established in 2000, eMemory has been devoted to research and development of innovative technologies, offering the industry’s most comprehensive platforms of patented eNVM IP solutions include NeoBit (OTP silicon IP), NeoFuse (anti-fuse OTP silicon IP), NeoMTP (1,000+ times programmable silicon IP), NeoFlash (10,000+ times programmable silicon IP), and NeoEE (100,000+ times programmable silicon IP) to semiconductor foundries, integrated devices manufacturers (IDMs) and fabless design houses worldwide. eMemory’s eNVM silicon IPs support wide range of applications include trimming, function selection, code storage, parameter setting, encryption, and identification setting. The company has the world’s largest NVM engineering team and prides itself on providing partners a full-service solution that sees the integration of eMemory eNVM IP from initial design stages through fabrication. For more information about eMemory, please visit
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