New Fabric, New Speeds with Intel Omni Scale Fabric
Intel Omni Scale fabric is built upon a combination of enhanced acquired IP from Cray and QLogic, and Intel’s own in-house innovations. It will include a full product line offering consisting of adapters, edge switches, director switch systems, and open-source fabric management and software tools. Additionally, traditional electrical transceivers in the director switches in today’s fabrics will be replaced by Intel® Silicon Photonics-based solutions, enabling increased port density, simplified cabling and reduced costs6. Intel Silicon Photonics-based cabling and transceiver solutions may also be used with Intel Omni Scale-based processors, adapter cards and edge switches.
Intel Supercomputing Momentum Continues
The current generation of Intel Xeon processors and Intel Xeon Phi coprocessors powers the top-rated system in the world – the 35 PFLOPS “Milky Way 2” in China. Intel Xeon Phi coprocessors are also available in more than 200 OEM designs worldwide.
Intel-based systems account for 85 percent of all supercomputers on the 43rd edition of the TOP500 list announced today and 97 percent of all new additions. Within 18 months after the introduction of Intel’s first many-core architecture products, Intel Xeon Phi coprocessor-based systems already make up 18 percent of the aggregated performance of all TOP500 supercomputers. The complete TOP500 list is available at www.top500.org.
To help optimize applications for many-core processing, Intel has also established more than 30 Intel Parallel Computing Centers (IPCC) in cooperation with universities and research facilities around the world. Today’s parallel optimization investment with the Intel Xeon Phi coprocessor will carry forward to Knights Landing, as optimizations using standards-based, common programming languages persist with a recompile. Incremental tuning gains will be available to take advantage of innovative new functionality.
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.
Copyright © 2014, Intel Corporation
Intel, Xeon, Intel Xeon Phi, Intel Atom and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries.
*Other brands and names may be claimed as the property of others.
All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2®, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Results have been measured by Intel based on software, benchmark or
other data of third parties and are provided for informational purposes
only. Any difference in system hardware or software design or
configuration may affect actual performance. Intel does not control or
audit the design or implementation of third party data referenced in
this document. Intel encourages all of its customers to visit the
websites of the referenced third parties or other sources to confirm
whether the referenced data is accurate and reflects performance of
systems available for purchase”