Georgia Tech Packaging Research Center Partners with Finetech to Demonstrate New Copper Interconnection Technology Without Solders

Gilbert, AZ - May 14, 2014 - Finetech, a global supplier of high accuracy bonding and advanced rework equipment, was selected by the Georgia Tech Packaging Research Center (PRC) to provide it's semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine pitch copper interconnections and assembly technology.

The new Georgia Tech patented technology enables, for the first time, the ability to manufacture reliable copper interconnections at temperatures below 180°C. The process provides tolerance of bump co-planarity and substrate warpage, as well as surface roughness, to achieve ultra-fine pitch interconnections down to 30 µm.

The Finetech Matrix bonder facilitates Georgia Tech's research needs by featuring a proven placement accuracy of 3 micron, component size handling from 0.1 mm x 0.1 mm to 150 mm x 150 mm, substrate sizes up to 350 mm x 350 mm or 12" wafer. A modular design, and real-time contrast optimization with LED lighting, help to make the Matrix a low maintenance, flexible, easy-to-use system for R&D, prototype and multi-shift production.

"We have worked with Finetech bonders for many years and selected the new Matrix platform for our next generation of research and development at the PRC," says Dr. Vanessa Smet, the Program Manager for Interconnections and Assembly at Georgia Tech PRC. "The flexibility of the system to handle various bonding conditions, with large array of components and in panel form while maintaining co-planarity and 3 micron placement accuracy, was a very good fit for our research needs. Georgia Tech will present its findings using this tool at Electronic Components and Technology Conference (ECTC) in Orlando in May 2014."

Click here for more information about GA Tech's Low-temperature Cu Interconnections and Assembly Technology.

Click here to read the full press release on our website.

About Finetech

Finetech is a leading manufacturer of manual and fully automated equipment for high-precision bonding / die attach and advanced component rework. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research. Corporate headquarters and main production are in Berlin, Germany. Sales and Technical support centers are located in Gilbert, Arizona; Manchester, New Hampshire; Shanghai, China and Kuala Lumpur, Malaysia.

To learn more about Finetech please visit

About Georgia Tech 3D Systems Packaging Research Center

The Packaging Research Center (PRC), housed on the Georgia Tech campus, was established in 1994 as the 1st NSF Engineering Research Center (ERC) in the U.S. It has been the largest global Research, Education and Industry collaboration Center dedicated to System Scaling by entire System on a Single Package (SOP) technologies. Companies interested in licensing the patented low-temperature copper technology or joining the new Georgia Tech Interconnections and Assembly Program are encouraged to contact Dr. Vanessa Smet at  Email Contact or Prof. Rao Tummala at Email Contact.

To learn more about Georgia Tech's Packaging Research Center
, please visit:


Adrienne Gerard
Finetech USA
Tel: +1 480-893-1630
Email: Email Contact

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