The awards were based on surveys completed by conference attendees.
"Our customers appreciate and benefit from the work Cadence is doing to bring 16nm FinFET design to market," said Suk Lee, TSMC senior director of Design Infrastructure Marketing. "These technical papers move the ball forward by helping leading innovators embrace the most advanced manufacturing processes available."
The papers can be viewed and downloaded from TSMC Online.
Cadence previously announced that the company received three TSMC Partner of the Year awards at the OIP conference for work with TSMC on analog/mixed signal IP, 16nm FinFET design infrastructure, and 3D-IC design solutions.
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