UMC Reports Third Quarter 2013 Results

Revenue contribution from Asia Pacific and Japan both grew to 44% and 6% respectively.

Revenue Breakdown by Geometry

Geometry

3Q13

2Q13

1Q13

4Q12

3Q12

40nm and below

20%

20%

18%

15%

13%

40nm<x<=65nm

34%

31%

32%

40%

41%

65nm<x<=90nm

6%

6%

6%

7%

7%

90nm<x<=0.13um

16%

15%

14%

15%

15%

0.13um<x<=0.18um

11%

13%

15%

10%

9%

0.18um<x<=0.35um

10%

11%

11%

10%

11%

0.5um and above

3%

4%

4%

3%

4%


2012 figures account for UMC parent company only.

Advanced node contribution from 65nm and below revenue grew to 54% in 3Q13 from 51% in 2Q13.

Revenue Breakdown by Customer Type

Customer Type

3Q13

2Q13

1Q13

4Q12

3Q12

Fabless

86%

90%

90%

90%

83%

IDM

14%

10%

10%

10%

17%


2012 figures account for UMC parent company only.

The percentage of revenue from IDM customers increased to 14%.  

Revenue Breakdown by Application (1)

Application

3Q13

2Q13

1Q13

4Q12

3Q12

Computer

16%

18%

22%

18%

21%

Communication

52%

51%

47%

50%

49%

Consumer

28%

28%

28%

29%

27%

Others

4%

3%

3%

3%

3%


2012 figures account for UMC parent company only.

(1) Computer consists of ICs such as CPU, GPU, HDD controllers, DVD/CD-RW control ICs, PC chipset, audio codec, keyboard controller, monitor scaler, USB, I/O chipset. Communication consists of handset components, broadband, WLAN, bluetooth, Ethernet, LAN, DSP, etc. Consumer consists of ICs used for DVD players, DTV, STB, MP3/MP4, flash controller, game consoles, DSC, smart cards, toys, etc.


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