Experts from Intel, Indium and CalTech to address materials technology and testing strategies
BANNOCKBURN, Ill., USA, September 12, 2013 — Subject-matter experts will provide insights into electronics reliability challenges during the IPC Conference on Solder and Reliability in Costa Mesa, Calif., November 13–14. Presented by IPC – Association Connecting Electronics Industries®, the conference follows the 7th International Symposium on Tin Whiskers, which will adjourn at noon on November 13 to allow for participation in both events.
IPC Conference on Solder and Reliability will include presentations addressing strategic considerations related to solder alloys, defects, risk mitigation processes and data analysis.
“There is a real urgency in the industry to put practical methodologies in place to improve reliability,” says Sanjay Huprikar, IPC vice president of member success. “Attendees will come away from this conference with new strategies they can take back and implement right away.”
Speakers for the conference include Ron Lasky, Ph.D., and Rick Short, Indium; Cheryl Tulkoff, DfR Solutions; Rich Brooks, GE Oil & Gas; Lenora Toscano, MacDermid Inc.; Larry Bright, MicroSemi; John McMahon, Celestica; James Wade, Intel; Jim Ryan, Integral Technologies; Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory, CalTech; and Michael Neilsen, Sandia National Laboratories.
Complete agenda and registration information can be found at www.ipc.org/solder-reliability-conference.
www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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