MACOM to Showcase Highest Power GaN in Plastic-packaged Power Transistors, Industry Leading Shunt Diode Series and E-Band Power Amplifiers at IEEE MTT International Microwave Symposium 2013

LOWELL, Mass. — (BUSINESS WIRE) — May 30, 2013M/A-COM Technology Solutions:

What: M/A-COM Technology Solutions (MACOM) will showcase a broad portfolio of new products for aerospace and defense, wireless backhaul, CATV, and optical communications applications in Booth #930 at the IEEE MTT International Microwave Symposium (IMS) tradeshow in Seattle, Washington, June 4-6, 2013.

Meet engineer-to-engineer to solve your unique application design challenges. Ask MACOM about its:

  • Broad catalog of 2000+ reliable standard products
  • Highest power GaN in plastic-packaged power transistors
  • Industry leading shunt diode series
  • E-Band MMIC power amplifier
  • Innovative 120W switch module for TDD-LTE base stations
  • Lowest power EML driver for 100G applications
  • Linear amplifiers for 13/15/18 GHz cellular backhaul

The Future of GaN Presentation

  • Hear expert Paul Beasly/MACOM speak about the future of GaN at 1:00 PM on June 4th at the Richardson RFPD Booth #620:

When:

    June 4-6, 2013; Exhibition Hours:      

 

Tuesday, June 4

9:00 AM – 5:00 PM

 

Wednesday, June 5

9:00 AM – 6:00 PM

 

Thursday, June 6

9:00 AM – 3:00 PM


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