NXP Delivers Industry's Most Comprehensive Range of Automotive Qualified Dual Power-SO8 MOSFETs

EINDHOVEN, THE NETHERLANDS and MANCHESTER, UK -- (Marketwire) -- Sep 24, 2012 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced the LFPAK56D portfolio -- a range of dual Power-SO8 MOSFETs specifically designed for automotive applications such as fuel injection, ABS and stability control. Fully AEC-Q101 qualified, the NXP LFPAK56D range offers best-in-class performance and reliability, while delivering a 77-percent smaller footprint than the equivalent DPAK solution which typically requires two devices. The LFPAK56D range is in volume production and is available immediately.

LFPAK56D combines two fully isolated MOSFETs into a single package designed to meet the rigorous requirements of the automotive industry. With the industry's widest range of RDSon values across five voltage grades, it provides the best performance, current handling and reliability on the market. This new range of dual Power-SO8 MOSFETs offers customers complete flexibility and freedom to pick the device that best matches the application and module requirements, while also achieving a much higher power density.

Designing with LFPAK56D lowers costs through simpler PCB assembly, ease of inspection and shrinking module size. Smaller modules also means a significant saving in weight, which is particularly attractive to manufacturers focused on reducing CO2 emissions.

Building on NXP's expertise in LFPAK56, which was the first Power-SO8 package on the market fully qualified to AEC-Q101, NXP is now introducing the same reliable "copper clip" bonding technology to dual Power-SO8 MOSFETs in LFPAK56D. This copper clip technology is what gives the package its advantage in low package resistance, inductance and high maximum ID rating.

"We believe that LFPAK56D will set a new industry benchmark for automotive MOSFETs, enabling OEMs to maximize efficiency and achieve significant cost savings through the development of smaller, more compact products," said Steve Sellick, business development manager, automotive MOSFETs, NXP Semiconductors. "Our portfolio of automotive qualified Power-SO8 MOSFETs is the most comprehensive in the industry, providing our customers the broadest possible choice when designing safety-critical automotive applications."

Key Features

  • Dual Power-SO8 MOSFET
  • 77% smaller footprint than the equivalent DPAK solution
  • Copper clip technology - Wire bond free
  • High maximum ID rating
  • Low package resistance and inductance
  • Low thermal resistance
  • High current transient robustness
  • Automotive AEC-Q101 qualified to 175 degrees C


About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements

This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

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