Aceplorer models and optimizes electronic design power and thermal consumption for early architecture exploration, architecture validation and power budget tracking during electronic design implementation stages, and AceThermalModeler creates compact RC thermal models for complete systems from system on chips (SoCs) to System-in-Packages (SiP), 3D ICs to complete boards. These compact thermal models are used for fast steady state or dynamic thermal responses enabling early system floorplan exploration or partitioning, improved system packaging and integration architectures, and early exploration of power and thermal management policies to reduce temperature peaks and manage temperature gradients across the system.
Aceplorer 3.0's new features include an event scheduler to automate the creation of timed scenarios from parallel tasks and workload definitions with different arbitration schemes, along with the support for thermal models created with AceThermalModeler. The event scheduler complements the existing timed flow chart creation and vcd import capabilities already in place and used to automate the creations of use cases.
AceThermalModeler 1.1 will be demonstrated for the first time at DAC. Its new features include an enhanced graphical user interface (GUI) with capabilities for 3D and thermal model creation and debugging. The Docea team will demonstrate how to use its thermal models to validate thermal management policies, simulate power-thermal coupling, detect thermal runaway risks, and improve the productivity of thermal experts and the architecture team.
Monday-Wednesday, June 4-6, 2012 9 am to 6 pm
Docea Booth #1702
Moscone Convention Center, San Francisco, California
Information and Registration
To request a private demo, please register here
To schedule a meeting with Docea Power, please email Ridha.Hamza (a)doceapower.com or call +33 (0)4 27 85 82 97
For more information about Docea, please visit www.doceapower.com.
To register for DAC, please visit www.dac.com.
About Docea Power
Docea Power develops and commercializes a new generation of methodology and tools for enabling faster and more reliable power and thermal modelling at the electronic systems level (ESL). Docea solutions offer a consistent approach for architectural exploration and optimizing power and thermal behaviour of electronic systems, at an early stage of an electronic design project.
Docea's customers include manufacturers of electronic systems, chips and boards that target wireless, multimedia, consumer, networking and automotive applications. The company has offices near Grenoble, France, and in San Jose, California, USA, and sales offices in Japan and Korea.
For more information: www.doceapower.com.
Notes to editors:
Graphics are available on request.
Acronyms and Definition
ESL: Electronic System Level
RC: R stands for Resistor and C for Capacitor
Vcd: value change dump; vcd is a standard trace format in the electronic design industry.
Aceplorer and AceThermalModeler are trademarks of Docea Power.
All other trademarks or tradenames are the properties of their respective owners.
Press contacts Europe: Chantal Cochini l'Ops PR +33(0)1 42 71 30 93 Email Contact US: Georgia Marszalek ValleyPR LLC +1 (650) 345-7477 Email Contact