IBM, Samsung and GLOBALFOUNDRIES Announce Keynote Lineup for 2012 Common Platform Technology Forum

2012 Speakers from IBM, Samsung, GLOBALFOUNDRIES and ARM Highlight the Importance of Semiconductor R&D to Consumer & Mobile Device Innovation

SANTA CLARA, Calif. — (BUSINESS WIRE) — February 22, 2012 — Simon Segars, president of ARM Inc., will join senior technology executives from IBM, Samsung and GLOBALFOUNDRIES as keynote presenters at the Common Platform Technology Forum, March 14, 2012 at the Santa Clara Convention Center. This year’s conference will highlight the Common Platform’s advanced R&D pipeline aimed at addressing technology challenges and customer demands for future innovations in consumer devices. The Common Platform companies represent the world's largest chip-making consortium, delivering technology that powers the majority of mobile and consumer devices including smartphones and tablets.

“We are privileged to have such a notable lineup of keynote speakers at this year’s Common Platform Technology Forum,” said Dr. KH Kim, executive vice president for Samsung Electronics’ Foundry business, on behalf of the Common Platform alliance. “These visionary leaders are at the forefront of innovation in the global technology industry, and they recognize the value of collaboration in delivering the next wave of consumer and mobile products to the market. We look forward to hearing their views on the changing dynamics of the semiconductor R&D.”

During the morning general session from 9:00 to 11:30 a.m., conference attendees will have the opportunity hear from the following industry leaders:

  • Dr. Gary Patton, Vice President of IBM Semiconductor R&D
  • Gregg Bartlett, Chief Technology Officer for GLOBALFOUNDRIES
  • Dr. Jong Shik Yoon, Senior Vice President of Samsung Electronics’ Semiconductor R&D
  • Simon Segars, President, ARM Inc. and Executive Vice President and General Manager of Physical IP division, ARM Ltd

In addition to the morning keynotes, the Common Platform Technology Forum will offer a full afternoon of in-depth technical sessions from members of the Common Platform partners’ technical teams and ecosystem industry leaders. The forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, packaging and design services companies.

Registration for the complimentary, one-day event at the Santa Clara Convention Center opens today. To register visit:  www.commonplatform.com/tf2012.

About the Common Platform

IBM, Samsung, GLOBALFOUNDRIES and more than 20 additional companies form the Common Platform alliance; focusing on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. The Common Platform model is supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP and design services industries. This ecosystem allows foundry customers to source their chip designs to multiple 300mm foundries with minimal design work, unprecedented flexibility and choice.



Contact:

IBM Media Relations
Michael Corrado, 1-914-766-4635
Email Contact
or
Samsung Semiconductor Inc.
Lisa Warren-Plungy, 408-544-5377
Email Contact
or
GLOBALFOUNDRIES
Jason Gorss, 518-305-9022
Email Contact




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