Invensas Acquires ALLVIA 3D-IC Packaging Technology

SAN JOSE, Calif. — (BUSINESS WIRE) — November 1, 2011 — Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that it has acquired the patent assets of ALLVIA, Inc. In addition, Invensas has entered into a two-year collaborative partnership with ALLVIA to further develop technology and intellectual property (IP) in the 3-dimensional integrated circuit (3D-IC) packaging space.

The majority of the 64 acquired patents and patent applications from ALLVIA relate to 3D-IC, including through-silicon via (TSV) technology and silicon interposer technology, which is often known as 2.5D. Future generation memory and mobile products require interposer and 3D-IC based packaging technologies to meet challenging data bandwidth and power reduction requirements.

“We are delighted to close this deal with ALLVIA, a pioneer of 3D-IC technology since 1997, and the company that coined the industry term through-silicon via (TSV),” said Simon McElrea, president, Invensas Corporation. “This IP portfolio purchase, along with our collaboration on further 3D-IC development marks another important step on Invensas’ path of continued innovation in vital next-generation packaging technologies.”

“This critical collaboration with a leading innovator in advanced semiconductor packaging will allow our interposer and TSV technology to reach the market more broadly and more quickly,” said Sergey Savastiouk, chief executive officer, ALLVIA, Inc. “With Invensas as an on-going IP development partner, we are confident that we can continue to create and refine the 3D-IC solutions needed in the marketplace.”

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the features, characteristics and benefits of 3D-IC packaging technology and the expected benefits of the acquisition of the ALLVIA patent assets and the two year collaborative partnership between ALLVIA and Invensas. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to Tessera Technologies, Inc.’s (the “Company”) intellectual property or intellectual property litigations, or any invalidation or limitation of the Company’s key patents; fluctuations in the Company’s operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect the Company’s ability to protect its intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt the Company’s technologies; competing technologies; the future expiration of the Company’s patents; the future expiration of the Company’s license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with the Company’s existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company’s filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2010 and its Quarterly Report on Form 10-Q for the quarter ended June 30, 2011, include more information about factors that could affect the Company's financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company's and Invensas’ website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.

About Invensas Corporation

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), acquires, develops, acquires and monetizes strategic intellectual property (IP) in areas such as, circuitry design, memory modules, 3-D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. Invensas’ IP portfolio includes approximately 400 patents and patent applications. The group is headquartered in San Jose, California. For information call 1.408.321.6000 or go to

Invensas and the Invensas logo are trademarks of Invensas Corporation or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.




Invensas Corporation
Judy Erkanat, 408-321-6751
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