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Embedded, IP & SoC News

MACOM Extends Leadership in Diodes with Broadband Shunt Family in Ultra Small Plastic Packages

Synopsys Delivers VDK for Renesas RH850 MCUs

Vivante GPU Core Maximizes Graphics Efficiency of SAMSUNG GALAXY Tab 3

LETI Innovation Days - 5th Leti Workshop on Innovative Memory Technologies

Vitesse "Timing is Everything" Seminar Goes International

Toshiba Introduces Low RDS(ON) P-ch MOSFETs for Mobile Devices

Broadcom Announces First 5G WiFi Combo Chips for Entry Level Market

New NVIDIA GeForce GTX 780 GPU Leads the Industry With the Fastest Frame Rates and Super-Smooth Animation…

Microsemi Unveils New Family of High-Security, Self-encrypting Solid State Drives

LG Electronics Becomes Lead Partner for ARM Cortex-A50 Family of Products and Next-Generation Mali G…

AMD Amplifies Mobile Experience With Responsive Performance, Rich Graphics, Elite Software and Long …

Microchip’s New 36V Digital Potentiometers Support Wide Signal Swings and High Power-Supply Voltag…

Verint to Welcome Worldwide Customers to Driving Innovation User Conference to Explore New Ways to Make…

Solid-State Lighting Expert Dr. Bernhard Stapp Named to Board of Pioneering LED Technology Developer…

Efficient Power Conversion (EPC) Opens GaN Power Library

UMC Establishes its Specialty Technology Center of Excellence in Singapore

Imperas Delivers Next Generation Embedded Software Development Suite Based On ToolMorphing Technolog…

Worldwide Semiconductor Market Contracted 2.2% in 2012 to $295 Billion – IDC Expects 3-4% Revenue …

Silicon Labs Introduces Industry’s Smallest, Most Power-Efficient PCI Express Clocks

TriQuint Accelerates Gallium Nitride Offerings, Releases Significant New Products and Foundry Servic…

TI introduces new sensorless, brushless DC motor driver to spin motors instantly

Soitec Announces Industry's First Four-Junction Solar Cell for Concentrator Photovoltaic Systems, Entering…

NVIDIA GRID Unleashes Graphics for Virtualized Desktops

Vishay Intertechnology Expands Its 650 V N-Channel Power MOSFET Series With 23 New Devices Offering …

Industry's First 802.11ac 4x4 Reference Design Specifies ANADIGICS' WiFi FEICs

STMicroelectronics Reveals Latest Power Technology for Greener Industry and Infrastructure

Renesas Electronics Announces USB 2.0 Hub Controller Chip with Battery Charging Function

Imperas™ Delivers Next Generation Embedded Software Development Suite Based On ToolMorphing™ Tec…

ON Semiconductor Awarded Title III Government Funding for Development of Advanced Next-Generation Star…

Cree Introduces Industry’s Brightest, Highest Efficacy Color LEDs

Freescale Extends QorIQ Qonverge B4 Family to Address Industrial and General-Purpose Markets

Shenick Announces Appointment of Tim Jefferson as Senior Vice President of Global Sales

Blue Pearl Software Joins Mentor OpenDoor Program

SkyWave SCADAconnect Enables 360 Degree Visibility between Field Equipment and Enterprise

Global Tower Partners’ Utilities Head Named to UtiliSite Council Board

CrestaTech Extends X7 Smart Tuner Line; Introduces Digital TV Designs for China and South America

L-3 Link Simulation & Training Cuts Engineering Change Orders by Ninety Percent Using Capital Software…

Etherios Adds Wireless Design Services to Suite of M2M Solution Offerings

Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technolog

Praesum Communications Introduces Serial RapidIO Endpoint Core for AMBA 4 AXI4

North American Semiconductor Equipment Industry Posts April 2013 Book-to-Bill Ratio of 1.08

Avery Design Systems Announces eMMC and SD Verification IP Solutions

NVIDIA Announces PhysX Support for Microsoft Xbox One Game Console

ZMDI, a Global Semiconductor Company, Extends its Portfolio of IPv6-Based Low-Power Wireless Mesh-Networking…

Altera Stratix V GX FPGAs Achieve PCIe Gen3 Compliance and Listing on PCI-SIG Integrators List

Atmel ARM- and AVR-based Microcontrollers Power Secret Labs' Ultra-low-power Smart Watch

New OMAP5432 processor-based evaluation module from Texas Instruments delivers exceptional processing…

PLX Teams With Avnet, Mindshare for PCI Express Technical Seminar

New Release of Cypress’s PSoC® Designer™ IDE Speeds and Simplifies Embedded Designs

KYOCERA SLC Technologies Corporation Breaks Ground on 2nd Manufacturing Facility in Kyoto, Japan

Invensas Shows New xFD Customer Products, Including ASUS Ultrabooks, at Computex Taipei

Wind River Extends Multicore Capabilities for Industry-Leading VxWorks

Altair Selected by u-blox to Power Single-Mode LTE Wireless Modules

Xilinx and Sumitomo Electric Collaborate on Smarter Solutions that Reduce Network CapEx and OpEx Cos…

Microsemi Shipping Production-qualified SmartFusion2 SoC FPGAs and Full-featured Development Kit

NXP Delivers Industry's First Ultra-Wideband Doherty Amplifiers

QuickLogic's Parallel Camera Interface for TI Sitara(TM) AM335x ARM(R) Cortex(TM)-A8 Processors Supports…

Avnet to Co-Present an End-User Case Study with Gartner on Building Multi-tier Supply Chain Visibility…

Avnet Electronics Marketing Whitepaper Helps Engineers Make Industrial Touch a Reality

Google TV Devices with Vivante GPU Cores Ready for Android Jelly Bean Update

Vivante Showcases Low Power GPU Solutions Shipping in 100M+ Devices at Multicore Developers Conferen…

Samsung Announces Industry-First 45 nanometer Embedded Flash Logic Process Development

Marvell Unveils Industry's First Mass Market Quad-core 5-mode Category 4 LTE Single-chip Solution,…

Robert Van Buskirk Joins Wilson Electronics As President And CEO

Peregrine Semiconductor Offers Industry’s Broadest Integrated RF Tuning IC Portfolio

Sequans Introduces EZLinkLTE Family of Modules for All-in-One LTE Connectivity

Xilinx Achieves PCI Express Compliance Across its All Programmable 28nm Devices

Pioneering Application for InvenSense’s® 6-Axis MotionTracking™ SoC in “Intelligent Headset™”…

ASE Assembly & Test (Shanghai) Limited to Acquire Shares of Wuxi Tongzhi Microelectronics Co., Ltd. …

Ciena Announces Reporting Date and Web Broadcast for Fiscal Second Quarter 2013

QLogic Announces Leadership Change

NEC Display Solutions Adds 23-Inch LED-Backlit Monitor with IPS Panel to MultiSync EA Series

HARMAN Delivers Leading-Edge, Next-Generation Infotainment System for Mercedes-Benz

Vocollect Introduces Latest Building Block for the Voice-Centric Warehouse: Industry’s First Wearable…

SureCore Receives £250K SMART Award To Prototype Its Low Power SRAM Technology

SMTA, IPC to Co-locate Fall Events

World's smallest Bluetooth location 'stickers’, StickNFind, locate misplaced items from smartphone…

Synopsys DesignWare IP for PCI Express 3.0 Passes First PCI-SIG PCIe 3.0 Compliance Workshop

Moxa Showcases the Industry’s First Integrated PRP/HSR Redundancy Box at IEC 61850 Europe 2013

u-blox announces collaboration with Intel on dedicated HSPA module

Key Digital® Presents New Champion Series HDMI Matrix, Switcher and Distribution Amplifier Line

Fairchild Semiconductor to Standardize Globally on Camstar Manufacturing Platform

VPG’s Bulk Metal® Foil Ultra-High-Precision COTS Resistors in High Demand for 4 mA to 20 mA Current…

ChipMOS REPORTS FIRST QUARTER 2013 RESULTS

IDT Announces Breakthrough Technologies Enabling the Industry’s Lowest Phase Noise VCO and Fractional…

Abracon Corporation Forms Pan-European Distribution Alliance with Avnet Abacus

CATALYST TELECOM NOW OFFERING EMC STORAGE SOLUTIONS

Venture Atlanta Promotes Funding for Georgia-based Companies

EnTouch Leverages Partnership with Telit to Enhance Energy Management M2M Application

Digi International Deploys 500-Node Internet of Things Network for the Data Sensing Lab at Google I/…

Brad® Nano-Change® Connectors from Molex Conform to M8 Form Factor Standards

LogMeIn and ARM Announce Collaboration to Accelerate Commercial Products on the Internet of Things

Calxeda and Fedora Project Deploy Servers on Path to Make ARM a Primary Architecture

sureCore receives £250K SMART Award to prototype its low power SRAM technology

Ultra-Low Latency H.264 Video Encoding Now Available from CAST

sureCore Receives £250K SMART Award to Prototype Its Low Power SRAM Technology

XMOS powers beyerdynamic’s world’s first Ethernet-AVB-enabled conference audio equipment

MACOM Introduces the Industry’s Highest Power GaN in Plastic Transistor

TI's new UL-certified SafeTI™ software packages for TI C2000™ MCUs streamline development for…

IDT Introduces Industry’s First Low-power Quad 16-bit DAC with JESD204B for Multi-carrier Broadband…

KEMET Introduces First-to-Market High Temperature Multilayer Stacked Capacitors with an X8L Dielectric…

Power Integrations’New 200V Qspeed Diodes CombineLow Recovery Losses and Softness to Optimize Efficiency…

Advanced Power Electronics Corp. launches three new MOSFETs targeting industry’s need for very efficient…

IR’s 40V Automotive-Qualified COOLiRFET™ Deliver Benchmark On-State Resistance for Improved System…

Advanced Power Electronics Corp. announces miniature ultra-low RDS(ON) dual load switch

Excelitas Technologies Introduces New Thermopile Detector

GaN Systems announces Rinehart Motion Systems as an Accredited Systems Integrations Partner

Excelitas Launches First Digital Pyrodetector for Wireless and Battery-Operated Devices

Nigel Springett joins GaN Systems in Germany to add European applications expertise

ACE's latest CoSy compiler development system optimizes for extreme architectures

New Electronics Coalition Eyes Industry-Wide Collaboration

ADLINK Launches Powerful Embedded Vision System, EOS-1220

OneSpin Solutions Reaches for the Cloud, Driving New Technology, Business Model for Easy Adoption

congatec Inc. Opens First Design Center in the Americas

TranSwitch Corporation Announces First Quarter 2013 Financial Results

Chip Memory Technology Inc. Emerges From Stealth Mode to Reveal Unique Embedded NV Memory Solution

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication…

TI delivers industry's most integrated ZigBee® single-chip solution with an ARM® Cortex™-M3 …

WITS Releases Allwinner's Quad-core A31 based Development Kit to Speed Up the Development Proces…

TI introduces industry-leading ultra-low noise, high PSRR linear voltage regulators

Altera to Deliver Breakthrough Power Solutions for FPGAs with Acquisition of Power Technology Innovator…

McAfee and Intel Deliver New Model for Consumer Security

MIPI Alliance Board of Directors Appoints Full-Time Managing Director and Hires Senior Marketing and…

Renesas Electronics America Adds Powerful Debugging and Enhanced Usability With Next-Generation of e2studio…

ON Semiconductor Introduces Industry Leading, Best in Class System Level Performance Expansion to IGBT…

New Freescale Xtrinsic Intelligent Sensor Hub Integrates Programmability and Precision in a Single P…

Cree’s New Power Module Enables Higher Performance, More Reliable and Lower Cost Power Conversion …

New Compact 6.5 kV IGBT-driver Cores From CONCEPT Feature Reduced Component Count for High Reliabili…

Power Integrations’ New 200 V Qspeed Diodes Combine Low Recovery Losses and Softness to Optimize Efficiency…

Power Integrations Reinvents Its Databook With New Mobile App

New IGBT-Driver Cores From CONCEPT Target 10 to 75 kVA Inverters and Servo Drives

Telebyte, Inc. Announces Release of Layer 1 Test Solution for Bonding

CONCEPT Launches Dual-Channel 4.5 kV IGBT-driver With Transformer-Based Signal Interface and Integrated…

Harris Corporation Awarded $45 Million Department of Homeland Security Communications Support Contra…

International, Afterschool, K-12 Robotics Organization, FIRST® Appoints Co-Chairs of the Board of D…

UltraSoC delivers first Universal Debug IP to PMC-Sierra

Eleven Companies Move Up in 1Q13 Top 20 Semi Supplier Ranking

Energy efficient EFM32 "Wonder Gecko" with ARM Cortex-M4 and FPU now available

Open-Silicon Celebrates Its 10th Year Anniversary With Continued Growth

Elecard announces the release of a new version of Elecard ARM Codec SDK.

Teledyne Acquires Axiom IC

MEMSIC Announces First-Quarter 2013 Results

MoSys Announces Proposed Public Offering of Common Stock

Analogix to Host First Slimport Summit

Oclaro Enables Direct Diode Systems with Broadest Wavelength Range of High Power Laser Diodes

Industry's Smallest 18-Bit Successive Approximation Register (SAR) ADC from Maxim Integrated Saves…

Energy efficient EFM32 “Wonder Gecko” with ARM Cortex-M4 and FPU now available

Renesas Electronics America, Micrium and IAR Systems Bring Expanded RTOS and Middleware Bundle to Embedded…

Peregrine Semiconductor Introduces Latest SPDT RF Switch for Harsh Space Environments

MaxLinear MxL267 Full-Spectrum CaptureTM Receiver Powers Hitron’s DOCSIS® 3.0 Cable Gateway Famil…

TowerJazz and TLi Korea Collaborate on Sensor ICs Targeting $1.7B Worldwide Mobile Phone Market

NeoFuse - eMemory's Innovative Anti-fuse eNVM Technology

Tablet Apps Processor Revenue Jumped 83 Percent in 2012

Smartphone Apps Processor Revenue Soared 60 Percent in 2012

Achronix Tapes Out Industry's First FinFET-based System-on-Chip Using Synopsys' IC Compiler and IC V…

Adobe Delivers “Sneak Peeks” of Ground-breaking Creative Innovation at MAX 2013

Flipout Tantrum Electric Screwdriver Receives Cool Idea! Award

Kubotek USA Introduces KeyMarkUp CAD Viewer for Fast Viewing and Mark Up of Over Two Dozen CAD Forma…

DDC-I Announces OpenGL SC DO-178 Level A Avionics Display Technology for Deos Safety-Critical RTOS

Leggett & Platt to Present on Integrating Logistics & Compliance at SCM World Leaders Forum

Dataram Announces Memory Manufacturing Partnership with Advanced Micro Devices, Inc.

ChipMOS REPORTS APRIL 2013 REVENUE

Tessera and Siliconware Settle Litigation

VITEC Announces the Availability of the Focus FS-H50 Portable Proxy Recorder

Digi Helps Wildlife Research Institute Study Bear Hibernation with Remote Monitoring Solution

Softtek Ranks 30th Best Provider in the World by Prestigious IAOP 2013 Global Outsourcing 100 List �…

Healthx Wireless Monitoring for High-Risk Patients Reduces Costly ER Visits and Readmissions

International Rectifier Commences Commercial Shipments of Gallium Nitride on Silicon Devices

More Than 30 Billion Devices Will Wirelessly Connect to the Internet of Everything in 2020

3SAE Technologies Introduces Plasma Fusion Splicer for Small Diameter and Low-Melt Optical Fibers

NeoFuse – eMemory’s Innovative Anti-fuse eNVM Technology

Oclaro Offers High-Power 633 nm Single-Mode Red Laser Diode for Biomedical, Inspection and Measurement…

Renesas Electronics America Announces Expanded Ecosystem for RX100 Family of MCUs

IXYS Announces the Launch of Multiple New Energy Efficient High Reliability Technologies at the PCIM…

Avnet Electronics Marketing Launches Power Solutions Video Series

Suntron Corporation Showcases Manufacturing Capabilities and DFx Approach at SOFIC 2013

NeoFuse – eMemory’s Innovative Anti-fuse eNVM Technology

Fairchild Semiconductor’s High-Speed Logic Gate Optocoupler Meets Higher Isolation Requirements in…

EZchip Announces First Quarter 2013 Results

Silicon Labs Digital Isolation Solution Enhances Long-Term Reliability of Motor Controls

Technicolor Selects MaxLinear Chip for New Hybrid Satellite / ISDB-T Set-Top Box

MoSys Announces Sample Availability of the Bandwidth Engine 2 - Burst IC Optimized for High-Throughput…

UMC Reports First Quarter 2013 Results

HiSilicon Technologies Tapes Out 50+ Million Instance ARM Processor-based SoC Using Synopsys IC Comp…

Counterfeit Electronic Parts Symposium Program Finalized

New Triple-Play Platform Connects Raspberry Pi, Arduino and 32-bit Embedded ARM

Cadence Incisive Enterprise Simulator Improves Low-Power Verification Productivity By 30%

Advantage Mobile Application Development Opens up New Markets with Addition of Keoki Trask

Actions Semiconductor Reports First Quarter 2013 Results

Broadcom Unveils World's Most Highly Integrated Processor SoC for 5G WiFi Enterprise Access Points…

Marvell Launches ARMADA 375 Dual-Core 1.0 GHz Cortex A9-Based SoC for SMB, Infrastructure and Enterprise…

Marvell Launches New 10G/40G Alaska X Devices for Extreme Performance over Optical and Copper Cable

Cavium Introduces LiquidIO™ Family of 10 Gigabit Server Adapters to enable SDN for Cloud and Datac…

WD® And SanDisk Team Up To Create Innovative Solid State Hybrid Drives

Broadcom Introduces Highly Integrated, Low-Power Processor SoC for Switch Control Plane Applications…

Marvell Launches New Prestera CX Devices; Expands Collaboration with IP Infusion to Deliver on Promise…

Zilog Announces New MCU Educational Platform for Education, Prototyping and Experiments

Microsemi Releases Ultra Low-power Sub-GHz Radio With Extended Temperature and Frequency Range

MagnaChip Offers Multiple High Voltage Foundry Options Targeting Touch Sensing Applications

IDT Announces Availability of High-reliability LVDS / LVPECL MEMS Oscillators Through Fox Electronic…

SMIC Appoints Dr. Atsushi Hori as General Manager of SMIC Japan

FlexVIA Plasma System from Nordson MARCH Wins Innovation Award for Plasma Surface Treatment of Flexible…

Silicon Image and the China Video Industry Association Collaborate to Promote HD Connectivity Standards…

Jenoptik to introduce new laser technology and optics at LASER 2013

STMicroelectronics and Quantenna Enter Strategic Licensing Agreement

Ittiam Announces Induction of Lip-Bu Tan to the Company Board

S3 Group licenses custom ADC and DAC Solution to Avalent Technologies’ SoC Platforms

Cadence to Acquire IP Business of Evatronix, Further Expanding IP Portfolio

Embedded Component Technology on the Rise

Intel Launches Low-Power, High-Performance Silvermont Microarchitecture

Fairchild Semiconductor’s Automotive 3-Phase Variable Speed Inverter Power Module Enables Higher Torque…

Altera Quartus II Software v13.0 Enables World's Fastest FPGA Designs

Altera Opens the World of FPGAs to Software Programmers with Broad Availability of SDK and Off-the-Shelf…

Broadcom Introduces Full Featured, Lowest-Power Multi-port Gigabit PHYs

Avnet Electronics Marketing Introduces Xilinx Zynq®-7000 All Programmable SoC Mini-Module Plus, the…

Renesas Electronics Leapfrogs to Top of the Microcontroller Market in the Americas

Peregrine Semiconductor Introduces Industry’s Highest-Isolation RF Switch for Wireless Infrastructure…

Texas Instruments and Continental collaborate to deliver first 65 nm safety ARM® Cortex™ microcontroller…

McAfee to Acquire Stonesoft; Transaction to Strengthen Network Security Portfolio with Next-Generation…

Imagination Technologies Group plc: Year-end trading update

AMD to Create Tailored Products Integrating Customer-Specific IP through Semi-Custom Business Unit

Advanced Power Electronics Corp. launches new dual n- and p-channel MOSFETs for battery management a…

New Precision Temperature Controller with User-friendly software and Data Retrieval

Gemalto expands its Defender Suite with a new PIV Solution Ideal for Enterprises and Government Agen…

Agilent Technologies Receives Global Company of the Year Award for Radio-Frequency Test Equipment

Bluebeam Software Releases International Versions of Revu 11

Apriso Launches Packaging Solution for Global Manufacturers

CEVA, Inc. Announces First Quarter 2013 Financial Results

Intel Board Elects Brian Krzanich as CEO

SEMICON Singapore 2013 to Spotlight Trends and Challenges in Technology and Workforce Development

QLogic Reports Fourth Quarter and Fiscal Year 2013 Results

Power Integrations Reports First-Quarter Financial Results

ON Semiconductor Reports First Quarter 2013 Results

Super Barrier Rectifier from Diodes Incorporated Helps Reduce Charger Size

IXYS Integrated Circuits Division Offers 3 New Low Cost 1.5A Gate Drivers

Pixelworks® Introduces Display Processor for Mainstream DLP Projectors

Digi-Key Offers Cirrus Logic’s New Single-Stage LED Drivers

InvenSense® Unveils World’s Lowest Profile 6-Axis MotionTracking Device

MediaTek Launches the World's First Integrated Platform for Entry Smartphones Featuring Dual-Core…

Tiempo : French Consortium Announces Development of a Clockless Smartcard Chip

Agilent Technologies' X-Series Signal Generator Enhancements Enable Faster, More Effective Verificat…

Agilent Technologies Receives Global Company of the Year Award for Radio-Frequency Test Equipment

CircuitSutra releases SystemC Model Library for Virtual Platforms

Atmel Reports First Quarter 2013 Financial Results

Microsemi Selects Intel Corporation Foundry Services for the Development of Digital Integrated Circu…

ISSI Announces Second Fiscal Quarter 2013 Results

TI eases tablet design with interface ICs for connecting displays and keyboards

MiiPC, the World's First Family Android PC, Adds a Double Memory Feature with Just 7 Days to Go

Mellanox Announces the World’s First Demonstration of Open Ethernet Platforms

QLogic Announces Appointment of Christine King to Board of Directors

Microchip Expands LIN 2.1/ SAE J2602-2 Portfolio with New Transceiver, System Basis Chip and System-in-Package…

IPextreme Welcomes Ridgetop Group, Inc. to Constellations

Athena Expands Extensive FFT/DFT Processor Line

Vivante Demonstrates The First OpenGL ES 3.0 Production Silicon to Successfully Run Rightware Basemark…

ADLINK’s Data Acquisition Applications and ActiveX Controls Library for HMI Now Available for Complimentary…

Amkor Technology Appoints Steve Kelley President and CEO

Cavium Announces Financial Results for Q1 2013

Silicon Image Announces First Quarter 2013 Earnings

MagnaChip Reports First Quarter 2013 Financial Results

TI extends remote control portfolio with new Bluetooth® low energy solution with broad industry sup…

Sonics and ARM Enter Patent License Agreement and Broaden Technology Cooperation

Rambus Expands Family of Revolutionary LED-Based Light Bulbs

IXYS Introduces New 3.6kV 630A Dual Isolated Base Rectifier Module

TriQuint Achieves Breakthrough GaN-on-Diamond Results

Microsemi Expands Power Management Portfolio With New Radiation-hardened Isolated DC-DC Converters

Atmel Introduces Industry's First Ultra-low Power Single-Chip Touch Controller for Touchscreens Up to…

French consortium announces development of a clockless smartcard chip

STMicroelectronics Remains Top MEMS Supplier for All-Important Consumer and Mobile Market

Use of Small Cells in New Wi-Fi Architectures Will Reshape Wireless Consumption Patterns

Cache SSD Prevails Over Pure SSD Storage in Ultrabooks and Ultrathins

Audio Semiconductor Market Achieves Loud and Clear Gains in Cellphones

Cadence and GLOBALFOUNDRIES Collaborate to Improve DFM Signoff for 20- and 14-Nanometer Nodes

Semiconductor Industry to Recognize Philip Yeo and Lee Kok Choy at SEMICON Singapore 2013

Mouser and Philips Lumileds Announce Global Distributor Partnership

IDT Reports Q4 and Fiscal Year End 2013 Financial Results

International Rectifier Reports Third Quarter Results

Monolithic Power Systems Announces Results for the First Quarter Ended March 31, 2013

Fairchild Semiconductor’s Quad-MOSFET Solution Boosts Efficiency and Eliminates Heat Sinking in Active…

Atmel Introduces Industry's First Ultra-low Power Single-Chip Touch Controller for Touchscreens …

Rudolph Purchases Selected Assets from Tamar Technology; Adds 3D Measurement Capability for Advanced…

Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded…

DOLPHIN INTEGRATION announces the best noise and linearity performances on the market of its circuit…

50th DAC Tutorials Focus on Verification, Implementation and Embedded Systems

SMIC Appoints Dr. Haijun Zhao as COO

Toshiba Launches Stepping Motor Control Drivers Combining High Voltage, High Current and High Effici…

IDT Announces Industry’s First Power Management Solution With Innovative Patented Distributed Power…

Toshiba Launches Driver IC for Small Fan Motors

Toshiba Launches 8 Megapixel 1.12μm CMOS Image Sensor for Mobile Devices

Toshiba Launches Sine-wave Brushless Motor Driver IC

Advanced Semiconductor Engineering, Inc. Reports Unaudited Consolidated Financial Results for the First…

Toshiba to Start Sales of CompactFlash(R) Memory Card for Digital Single Lens Reflex Market

SILICA Rolls Out Power ’n More Design Support Strategy

Suntron Corporation Offers EMS Services for Semiconductor Equipment

CEVA Introduces World's First Software-Based Super-Resolution Technology for Low Energy Mobile Appli…

Critical Manufacturing sets up US headquarters in Austin, TX

Altera Announces First Quarter Results

Pixelworks Reports First Quarter 2013 Financial Results

Freescale Semiconductor Announces First Quarter 2013 Results

PMC Reports First Quarter 2013 Results

Amkor Technology Reports Financial Results for the First Quarter 2013

Intilop and Altera to perform live demo of 5th Gen 10G 76 ns TCP and UDP Offload cores implemented in…

Microsemi Reports Second Quarter 2013 Results

Maxim Integrated Reports Results For The Third Quarter Of Fiscal 2013

Renesas Electronics to Release Intelligent Power Device for IGBT Drive with Micro-Isolator for Reduced…

Teledyne LeCroy Announces DDR4 Physical Layer Compliance Test Support and DDR4 Lighthouse Partners P…

Fujitsu Expands its FM3 Family of 32-bit MCUs with New Versions Featuring High-Capacity Memory, Low-Pin-Count…

SiOnyx Unveils Ultra-high Performance CMOS Image Sensors with True Nightglow Capabilities

CEVA Introduces World's First Software-Based Super-Resolution Technology for Low Energy Mobile A…

Toshiba Launches Reinforced Insulation Triac-output Photocouplers

Toshiba Launches Full HD CMOS Image Sensor for Security/Surveillance and Automotive Markets

Dassault Systèmes Announces Acquisition of Archividéo

Dassault Systèmes Acquires FE-DESIGN

Starboard Announces New Additions to Its Hybrid Storage Product Line

AMD Announces 2013 Developer Summit: “APU13” set for San Jose, California

AMD Targets High-Growth, Embedded Markets with New AMD Embedded G-Series System-on-Chip

IPextreme and Stars of IP to Party Together at DAC 2013

NASA Selects Ridgetop Group to Develop an Innovative Modular SiGe 130 nm Cell Library

DP8051 – (even more) fast & configurable 8051 with Instructions Smart Trace

Xilinx Announces Fiscal 2013 Results; Q4 Sales Increase 4% Sequentially

TriQuint Announces First Quarter 2013 Results

Qualcomm Announces Second Quarter Fiscal 2013 Results

LSI Reports First Quarter 2013 Results

Fairchild Semiconductor’s Integrated Low-Side Gate Driver Incorporates 3.3-V Low Drop Out (LDO) Regulator…

Development Kit for Cypress's New PSoC 4 Architecture Now Available Globally for Pre-Order from Premier…

Atmel maXTouch S Controller Powers Touchscreen for Kyocera's Torque Smartphone for Rugged Enviro…

MOSCAD Design & Automation Achieves New Milestone in Fully Integrated Silicon Oscillators

New Series of Load Switch ICs from Toshiba Now Available

Maxim Integrated's 12/16-Channel Analog Front-Ends (AFEs) Double Accuracy While Reducing Battery-Management…

SMIC Reports 2013 First Quarter Results

Renesas Electronics First to Achieve UL Certification of Hardware Safety Features for UL 60730-1 Com…

Fully Qualified Production Silicon for Cypress’s First Two PSoC® 4 Product Families Is Now Availa…

Silicon Labs Beats Expectations

Cool Compute - Harnessing More Performance per Watt to Do Cool Stuff

Toshiba Launches Sub-Power Management IC for Mobile Products

ADLINK Launches Flagship VPX Product Line with VPX3000 Series

Critical Updates from Industry Leaders on EUV, 3D Transistors and 450mm Manufacturing Targeted for SEMICON…

AdaCore Releases GNAT Pro 7.1

AdaCore Releases Major New Version of CodePeer Static Analysis Tool

TOYOTA ITC Japan Selects SPARK Pro Language and Toolset for High-Reliability Research Project

Etherios Launches The Social Machine® on Salesforce.com's AppExchange, the World's Leading Business…

HDL Design House Introduces JESD204B PCS IP Core – HIP 600