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Semiconductor Industry Invited to Workshop on Best Practices for Effective Digital Marketing
U.S. EDA Software Market Size Worth $6.35 Billion By 2025: Hexa Research
Mouser Electronics and Grant Imahara Launch 2018 Empowering Innovation Together Series “Generation Robot”
Expanded 55th Design Automation Conference Program Content Drives Unprecedented Exhibition Growth
TTM Technologies, Inc. Completes Acquisition of Anaren, Inc.
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7…
Introducing New Space Electronics®
New Application Note Demonstrates NI AWR Software Simulation Test Bench for NB-IoT Products
ANSYS to Release First Quarter 2018 Earnings Results After Market Close on May 2, 2018
New AC/DC PCB Mounted Power Modules from PalPilot Save Valuable Development Time
Synopsys Extends HAPS Prototyping Family with New Desktop Prototyping Solution
Tempo Closes $20M Series B to Build New Connected Factory in San Francisco For Electronics Manufactu…
IEEE Publishes Standard Revision for SystemVerilog – Unified Hardware Design, Specification and Verification…
"Beyond Fireworks: The Next Generation of Drone Light Shows" by intel
Mouser Electronics Expands Mexico Office, Enhances Service Excellence in Region
Mouser Electronics Continues Hall of Fame Sponsorship of FIRST Championship
NI AWR Software Featured in Balun Design Webinar
Weebit Nano announced as a finalist in the 2018 Red Herring Top 100 Europe Awards
SEMI Announces ESD Alliance to Join as Strategic Association Partner
ESD Alliance Signs Memorandum of Understanding to Join SEMI as Strategic Association Partner
TiE Silicon Valley Announces TiE Inflect 2018, World’s Largest Conference for Entrepreneurs and Me…
Synopsys and Arm Extend Collaboration to Improve Power, Performance, and Time to Results for Arm's Latest…
"Write-only ports" by Colin Walls
SEMI Postpones SEMICON Southeast Asia 2018 to Avoid Malaysian Election Conflict
Cadence Announces First Quarter 2018 Financial Results Webcast
"Autonomous Driving – Hands on the Wheel or No Wheel at All" by intel
Aldec’s HES UltraScale+ Reconfigurable Accelerator and Northwest Logic’s PCI Express Cores Provide…
MEDIA ALERT: Breker Verification Systems to Showcase Portable Stimulus Solutions for UVM, SoC Verification…
Traditional PC Market Exceeds Expectations with Flat Year-on-Year Shipment Growth, According to IDC
Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP
HP Revamps Pavilion PCs with Premium Features and Design
North Carolina State University Course That Inspired Bits to Waves Workshop Reimagined as an IMS2018…
Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support Down to 5nm, and…
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Mobile Semiconductor's 22nm ULL Memory Compiler Joins The GLOBALFOUNDRIES FDXcelerator™ Partner Program
Qualcomm and NXP Agree, at MOFCOM Request, to Withdraw and Refile Application for Chinese Regulatory…
Intel and Portworx Deliver Breakthrough Performance to Answer Enterprises' Demand for Stateful Containerized…
2nd Generation AMD Ryzen™ Desktop Processors Deliver Best-in-Class Compute Performance and Even Faster…
AMD’s StoreMI Technology for Client PC Storage Powered by Enmotus’ Machine Intelligence
TSMC Files Annual Report on Form 20-F for 2017
Renesas Electronics Delivers Blood Pressure Monitoring Evaluation Kit for Immediate Evaluation
Microsemi Collaborates with MathWorks to Deliver First Integrated FPGA-in-the-Loop Workflow for PolarFire…
Unigroup Spreadtrum & RDA SoC Platforms Are Supporting Android Go Now
Silicon Labs Completes Acquisition of Sigma Designs' Z-Wave Business
Blu Wireless Appoints EDATechForce as Representative in North America
Cray Debuts AMD EPYC™ Processors in Supercomputer Product Line
Renesas Electronics Announces Determination of Selling Price and Other Matters
eSilicon awards seven scholarships to top female STEM students in Vietnam
Spectral Edge, the image fusion technology specialists, secures $5.3 million in further funding from…
Adoption of Intel FPGAs for Acceleration of Enterprise Workloads Goes Mainstream
Titan IC: LookingGlass Cyber Solutions Launches IRD-100™ a Fully-Programmable Stealth Security Ap…
CONNECTIONS™: The Premier Connected Home Conference Features Industry-Leading Companies Including …
Microsemi's Mi-V Ecosystem Continues to Expand as New Member Antmicro Joins to Develop Mi-V RISC-V Processor…
UnitySC Names Kamel Ait-Mahiout as CEO
CEVA-XM6 Computer Vision and Deep Learning Platform Honored by Vision Systems Design 2018 Innovators…
JPEG XS – Image coding for video over IP transmission in production quality
Faraday Monthly Consolidated Sales Report –March 2018
Ittiam Licenses its i265 HEVC Codec to Microsoft Azure to Offer High Quality Video Encoding and Decoding…
TSMC March 2018 Revenue Report
MediaTek Collaborates with Microsoft to Advance Innovation and Security for the Intelligent Edge
Argus Worldwide Corp. signs Memorandum of Understanding to acquire India based technology innovator …
MEDIA ALERT: SiFive to Present Closing Keynote at GSA Silicon Summit
Rambus Launches CryptoManager RISC-V Root of Trust Programmable Secure Processing Core
QuickLogic Announces Webcast with AI Ecosystem Partners
Accelize Launches AccelStore: A Platform-Independent Marketplace that Brings FPGA-based Workload Acceleration…
GUC Monthly Sales Report – Mar 2018
CAST and Accelize Make GZIP Compression Instantly Available via Cloud-Based FPGA Accelerators
Dolphin Integration augments the TSMC IP Ecosystem at 40 nm ULP eFlash with new TITAN Read Only Memo…
NAB 2018 - intoPIX demonstrates TICO implemented SMPTE 2110 IP running 4K live on FPGA CPU and GPU
Microchip Technology Announces Receipt of Antitrust Clearance in U.S. for Its Acquisition of Microse…
2nd Generation AMD Ryzen™ Processors: Ultimate Desktop CPUs for High-Performance Computing Available…
IDT to Showcase Latest Technology Solutions at TECHNO-FRONTIER 2018
Dover Microsystems Brings Secure Silicon IP to DesignShare
Faraday Leads ASIC Industry with Supporting Major Projector Technologies
Epiq Solutions Unveils Highly Integrated RF + Linux® Module to Simplify Wireless Product Development…
DapTechnology Releases 1394/AS5643 IP for Microsemi IGLOO2 and SmartFusion2 FPGA Devices
Qualcomm Unveils the Vision Intelligence Platform Purpose-built for IoT Devices Powered by Latest Advances…
CONNECTIONS™: The Premier Connected Home Conference Features Intel Keynote and Session on Independent…
MaxLinear and Geniatech Target Live TV on Mobile Devices
Keysight Delivers First-to-Market 28 GHz Channel Sounding Solution to Japan’s Leading Mobile Operator…
Microsemi Reaches Key Production-Qualification Milestone for its Award-Winning PolarFire FPGA Family…
Toshiba Releases Automotive 40V N-channel Power MOSFETs in New Package
CAST and Achronix Enable Processing from Data Center to the Edge with Lossless Compression IP
MACOM Introduces New Transimpedance Amplifier Supporting 12G-SDI Over Optical Fiber for Broadcast Video…
ON Semiconductor Introduces Digital Image Sensor with Class-Leading Low Light Sensitivity and Signal-Noise…
Broadcom Modernizes Fibre Channel with New NVMe Storage and SAN Automation Technology
Microsemi Achieves QML Class Q Qualification for its RTG4 High-Speed Radiation-Tolerant FPGAs
UMC Reports Sales for March 2018
ASICs Unlock Deep Learning Innovation: Webinar May 2, 2018
Arastu Systems evolving in the Industry with a strategic roadmap
Fraunhofer IIS Audio System Selected for Chinese 3D Audio Standard for UHD TV
HEVC Advance Highlights Momentum with Newest Licensors and Licensees
Qualcomm Technologies Inc. and THX® Demonstrate End-to-End Workflow for Delivery of Next-Generation…
SEMI Reports Record Semiconductor Photomask Sales of $3.7 Billion
ON Semiconductor Introduces First High Resolution Image Sensors with NIR+ for Improved Night Vision
ChipMOS REPORTS MARCH 2018 AND 1Q18 REVENUE
Flex Logix Validates EFLX®4K eFPGA IP Core on TSMC16FFC; Evaluation Boards Available Now
GLOBALFOUNDRIES and Toppan Photomasks Extend Advanced Photomask Joint Venture in Germany
MediaTek Announces World's First Complete 56G PAM4 SerDes, Silicon-Proven on 7nm for ASIC services
intoPIX Boosts the IP Media Production at NAB 2018: Demonstrating the New SMPTE ST 2110 Standards Running…
intoPIX to Unveil Newest JPEG-XS Compression Tech at NAB Show 2018 in Las Vegas – A World First
Silvaco IP Revs Up Silicon Catalyst’s Semiconductor Startup Ecosystem
Tortuga Logic to Develop Novel Hardware Security Solutions with Support from DARPA Program
NEOTION partners with Texplained creating stronger Secure by design ICs
Imagination Technologies Group Ltd. Announces CEO Succession
eMemory, Europractice IC Service form eNVM IP partnership
Silicon Labs Announces First Quarter 2018 Earnings Webcast
Nantero Expands NRAM Product Development, Signs New Customers
The Low Profile PCIe Board XpressGXA10-LP 1150 and 1151 Versions Are Providing HPC, Finance and Networking…
Microsemi Announces Cesium Atomic Clock Portfolio Compliant with New ITU Standards for Enhanced Primary…
Broadcom Completes Redomiciliation to the United States
NVMEngines to Exhibit and Present at IP SOC 2018; Company to Be Renamed Numem
InterDigital and Kyocera Corporation Sign Multi-Year Patent License Agreement
Advantest Launches T5503HS2 High-Speed Tester for Speediest Current and Emerging Memory ICs
Toshiba Releases Medium-voltage Photorelay in Small 4-pin SO6 Package for Factory Automation and Other…
Silex Inside releases MACsec engine
CoreHW partners with GLOBALFOUNDRIES in RF Ecosystem Program
Aehr Test Systems Reports 176% Revenue Growth Year over Year in Third Quarter of Fiscal 2018
ON Semiconductor Expands Imaging Options for Extreme Low-Light Imaging
Maxim's Low-Power Microcontrollers Extend Battery Life for Wearables and Other Compact Devices
Open-Silicon to Present: FlexE IP – A New Flexible Ethernet Client Interface Standard
NVIDIA and Arm Partner to Bring Deep Learning to Billions of IoT Devices
Arteris FlexNoC® Interconnect IP Powers DJI Drones
NEOTION and Invia join expertise in hardware-based security
Chips&Media was reportedly signed a contract to supply ISP IP package for IP cameras intended for surveillance…
65GH/s, 1500W, Innosilicon Announces the World's Most Powerful Dash Miner---A5+ DashMaster
SiFive Secures $50.6 Million Funding to Advance RISC-V Based Semiconductors
Secure Provisioning Solutions from Inside Secure Now Protecting Pay TV Services at Kiwisat
Intrinsic ID Awarded EU Grant under Horizon 2020/SME Instrument Phase 2 Program for INSTET Project
Omnitek adds chipsets at NAB
EnSilica extends its Design & Supply services for the Automotive Sector
Pentek Announces Kintex UltraScale Co-processor Jade XMC for Signal Processing Applications
Toshiba Corporation Welcomes Nobuaki Kurumatani as Chairman and CEO
Nanusens now live on Crowdcube for Pre-Series A fund raising
Mobile Semiconductor Introduces 40nm ULP Memory Compiler Support
SMIC Announces 2017 Annual Results
NextPower 100V Power MOSFETs From Nexperia Feature Low Qrr, and High 175°C Rating
Inside An Intel Chip Fab: One Of The Cleanest Conference Rooms On Earth
With its Highest Growth Rate in 14 Years, the Global Semiconductor Industry Topped $429 Billion in 2017,…
MEDIA ALERT: Achronix to Exhibit at D&R IP-SoC Days April 5 in Santa Clara, Calif., Showcasing eFPGA…
Ouster Launches Two New LIDAR Sensors, Adopts NVIDIA DRIVE™ AI Platform
Ambarella Introduces CV2 4K Computer Vision SoC with CVflow™ Architecture and Stereovision
Ambarella Demonstrates Its Fully Autonomous Vehicle on Silicon Valley Roads
Microsemi's Leadership in Space Continues with Class V and Q Qualifications and QML Certification for…
Preferred Networks to Launch “MN-1b” Private Sector Supercomputer Adopting NVIDIA Tesla V100 32GB…
Marvell Announces Integration of Industry's First Secure Automotive Ethernet Switch into NVIDIA DRIVE…
VRgineers Teams With NVIDIA To Bring Enterprise VR To Its Highest Level Of Performance
Fastdata.io Secures $5 Million In Seed Funding From CrossCut, Pelion Venture Partners And NVIDIA
NVIDIA Introduces DRIVE Constellation Simulation System to Safely Drive Autonomous Vehicles Billions…
NVIDIA Boosts World’s Leading Deep Learning Computing Platform, Bringing 10x Performance Gain in Six…
NVIDIA Reinvents the Workstation with Real-Time Ray Tracing
Maxim's Ultra-Small Step-Down Converters Deliver the Industry's Lowest Quiescent Current and Highest…
STMicroelectronics Cooperated with Synelixis and Academic Institutions to Build a Simulation Framework…
Renesas Electronics Unveils World’s First On-Chip Flash Memory Microcontroller Featuring Advanced …
U.S. Companies Maintain Largest Share of Fabless Company IC Sales
IPC Urges Trump Administration to Take Measured Approach in Levying Higher Tariffs on Electronics from…
GLOBALFOUNDRIES Names Ronald Sampson as General Manager of its Leading-Edge Silicon Manufacturing Facility…
Keysight Technologies, Tech Mahindra Collaborate to Develop 5G NR Device Test Capability, Accelerating…
Fairview Microwave Launches New Line of RF and Microwave Power Amplifier Accessories
Macronix 8-bit I/O Flash Memory Complements STMicroelectronics STM32L4+ Discovery Kit for Higher Performing…
Improve Reliability and Performance in Harsh Environments with Microchip’s New Automotive MEMS Osc…
H2O.ai Unleashes H2O4GPU and Driverless AI for the Latest NVIDIA CUDA 9 and Tesla V100 Platforms
QuickLogic Announces EOS S3 LV (Low Voltage) Voice and Sensor Processing Platform
Toshiba Releases Small MOSFET with High ESD Protection to Drive Headlight LED
Xanita board launches in the USA
Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co.,…
Mobiveil Joins Gen-Z Consortium
Everspin Signs Long-term Patent License Agreement with Alps Electric
HiTrend selects Dolphin Integration’s cache controller for its next generation of smart energy metering…
SambaNova Systems Emerges from Stealth and Secures $56 Million in Series A Funding Led by Walden International…
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
Micron Technology, Inc., Reports Results for the Second Quarter of Fiscal 2018
BittWare Announces SmartNIC Shell for Building FPGA-powered 100G NICs
SiFive Brings in Mobiveil as Newest Partner in the DesignShare Economy
Toshiba Expands New Packaging Option for SO6L IC-Output Photocouplers
Intel Editorial: One Simple Truth about Artificial Intelligence in Healthcare: It’s Already Here
Maxim's Himalaya uSLIC Solution, the Industry's Smallest Power Modules, Revolutionizes Design for Highly…
Lighting up LED new prospect M31 and Macroblock work together to deploy the global LED driver IC mar…
IC Insights Raises 2018 IC Market Forecast from 8% to 15%
Samsung Electronics Diversifies Its 8-Inch Foundry Offerings With New RF/IoT and Fingerprint Technology…
The Industry’s First Power Supply ICs for High-Fidelity Audio from ROHM
Keysight’s Ixia Solutions Group and Innovium Collaborate to Deliver 12.8 Tbps Performance in a Single-Chip…
Texas Instruments challenges students to design solutions that improve everyday life
GIGABYTE Announces ThunderXStation: Industry's first Armv8 Workstation based on Cavium's ThunderX2 P…
Marvell Introduces Industry's First NVMe Chipset Solutions to Address Emerging Data Center SSD Requi…
Microsemi Expands Market Opportunities for Cloud Data Centers with Announcement of Adaptec Smart Storage…
UNiTYSC aCquires HSEB Dresden GmbH TO BECOME A GLOBAL LEADER IN SEMICONDUCTOR PROCESS CONTROL
EnSilica Builds Export Drive with Appointment of Asia Region Manager
MIPI Alliance Welcomes Bosch and Qualcomm as Promoter Members
Arteris IP FlexNoC® Interconnect Licensed by VeriSilicon for Multiple Chip Designs
CREDO DEMONSTRATES ROBUST, LOW-POWER 112G PAM4 SOLUTIONS AT OFC 2018 ACCELERATING END-TO-END 112G HYPERSCALE…
Imagination announces powerful new capabilities in PVRTune performance analysis tool for PowerVR GPU…
Imagination streamlines app and game development with GPU debugging as part of new PVRStudio IDE
NVIDIA RTX Technology Realizes Dream of Real-Time Cinematic Rendering
Nallatech Launches 250 Series of NVMe Storage Acceleration Solutions
congatec Powers Luxoft’s Modular Next-Gen Automotive Reference Platform
Cavium™ Expands Industry Partnerships to Drive OCP NIC 3.0
Cavium™ Technologies Power End-to-End NVMe over Fabrics Solutions
Toshiba Memory Corporation Adds New Lineup of Data Center SSDs Featuring BiCS FLASH 64-Layer 3D Flash…
Rambus to Develop Hybrid Memory System Architectures for Future Data Centers
Xilinx Unveils Revolutionary Adaptable Computing Product Category
Xilinx CEO Outlines New Vision, Strategy For The Company
TowerJazz and active-semi® Announce the Ramp to Production of a Motor Driver IC on 200V SOI Technol…
QuickLogic Joins RISC-V Foundation
Mnano selects Dolphin Integration’s six-channel Audio converter for its next generation of Smart S…
CSEM SELECTS ID-Xplore TO ACCELERATE ANALOG DESIGN AND TECHNOLOGY PORTING AT FUNCTIONAL LEVEL
Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service
Xilinx Showcases Future of Optical Networking with Breakthrough Technology and Products at OFC 2018
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
Embedded Systems Conference Boston Announces 2018 Keynotes Addressing Deep Learning and AI, Impact …
Microsemi Enhances Switchtec PCIe Switch for Fabric Connectivity and Composability of Multi-Host GPU…
ChipMOS REPORTS FOURTH QUARTER AND FULL YEAR 2017 RESULTS
Tobii and Qualcomm Collaborate to Bring Eye Tracking to Mobile VR/AR Headsets
MACOM Announces Single- and Quad-Channel Linear EML Driver Family for 100G and 400G PAM-4 Applicatio…
SigmaTron International, Inc. Reports Third Quarter Financial Results for Fiscal 2018
Eta Compute Launches Industry's First Neuromorphic Platform for Ultra-Low-Power Machine Intelligence…
GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivi…
MaxLinear’s MxL7704 Power Management IC Powers the Raspberry Pi 3 Model B+
Broadcom Withdraws Offer to Acquire Qualcomm
Seoul Semiconductor Launches the World’s Smallest LED Driver Developed for Japan Lighting Market
TSMC February 2018 Revenue Report
Wave Computing Adopts Low Power MIPS 64-bit Multi-Threaded Core
AMD Processors Severe Security Advisory Announced by CTS Labs
60V/1A Buck LED Driver from Diodes Incorporated Adds Dimming for Commercial Lighting
Stratix 10 FPGA: REFLEX CES is Shipping the Cloud Computing COTS Board “XpressGXS10-FH200G”, and…
MACOM and ColorChip Announce a 100G Single-Lambda QSFP28 Module for Cloud Data Center Applications
Mobile Semiconductor Introduces 28nm Memory Compiler Support
Renesas Electronics Ships New RV2X6376A Series of 25 Gbps Directly Modulated Laser Diodes for 4.9G and…
Arteris IP Supports Dream Chip Technologies Innovative Business Model for Automotive SoC Development…
Rambus Initiates Accelerated Share Repurchase Program
Are the Major DRAM Suppliers Stunting DRAM Demand?
Intrinsic ID and Technolution Awarded SBIR to Develop SEMIO IoT Security Platform
Delivering Compelling Visual Experiences to the Mainstream
Qualcomm Receives Presidential Order Prohibiting Broadcom's Proposed Takeover of Qualcomm
Broadcom Issues Statement
ABLIC Inc. Has Released S-1222 Series, Industry's Smallest Class, High-withstand Voltage, and Low-profile…
ON Semiconductor Delivers AEC-Q100 Qualified Image Sensors Optimized for OEM-Fitted In-Car DVR Camer…
Lattice Semiconductor Announces CEO Succession Plan
Eideticom, IBM, Rackspace and Xilinx Demonstrate World's First PCIe Gen4 NVM Express Production Ready…
Broadcom Introduces the Industry’s First 5G Radio Switch
II-VI Incorporated Achieves Industry Leading Shipment Milestone for Pump Lasers and Erbium Doped Fiber…
II-VI Incorporated Unveils DFB Laser Diode for 3D Sensing
Open-Silicon, Credo and IQ-Analog Showcase Complete End-to-End Networking ASIC Solutions at OFC 2018…
Palma Ceia Closes Series B Funding, Internet of Things Connectivity to be Accelerated
Efinix™ Releases Trion™ Programmable Platform
Canaan-Creative employs Moortec’s Temperature Sensor in their new ASIC aimed at HPC IC
HCC EMBEDDED RELEASES MISRA-COMPLIANT EMBEDDED CRYPTOGRAPHY SUITE AND MANAGER
92 IC Wafer Fabs Closed or Repurposed From 2009-2017
MacB Technical Expert to Present FPGA Assurance Whitepaper at GOMACTech
Following Significant Technology, Capacity and Expansion Milestones, GLOBALFOUNDRIES’ Sanjay Jha to…
ChipMOS REPORTS FEBRUARY 2018 REVENUE
UMC Reports Sales for February 2018
Marvell Technology Group Ltd. Reports Fourth Quarter and Fiscal Year 2018 Financial Results
Corigine adds certified USB IP to SiFive's Growing DesignShare Economy to Accelerate Adoption of RIS…
Analog Devices Adds Innovative RADAR Technology for Industrial and Automotive Markets with Acquisition…
MaxLinear Adds Two Quad TIA Devices to Telluride Family of 400Gbps PAM4 Products
Sequans’ LTE Cat 1 Chipset Certified by KDDI
MIPI Alliance Expands Reach with New Automotive Working Group
Dynamically Configurable Off-Line Switcher IC From Power Integrations Supports USB PD 3.0 + PPS
Littelfuse Introduces 1200V SiC MOSFETs with Ultra-Low On-Resistances at APEC 2018
Analog Devices’ High Power and High Voltage Isolated Gate Driver Board for Microsemi SiC Power Module…
MaxLinear Introduces Optimized Power Management IC for Low Power FPGAs and SoCs
Teledyne e2v, pSemi and GaN Systems Unveil Industry’s Fastest Hi-Rel GaN Power Solution at Satellite…
Helix Semiconductors’ MxC200 DC-DC Power IC Now in Production
Marvell Launches Industry's First 16-Port 50GbE PHY Transceiver
IoT Growth Drives Demand for Silicon Labs' New Highly Integrated Power over Ethernet ICs
Efficient Power Conversion's GaN-Based 48 V to 12 V Regulated Power Supply Development Board Delivers…
Qualcomm Board Names Jeffrey Henderson Non-Executive Chairman
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
In Letter to Congress, Broadcom Pledges to Make the U.S. the Global Leader in 5G
Qualcomm Increases Quarterly Dividend by 9 Percent
MACOM Announces Availability of 400Gbps Chipset for Short Reach Optical Connectivity Applications
New FormFactor Probing System Dramatically Improves Throughput and Productivity
AMD to Host Ryzen One Year Anniversary Webinar
CEVA and Nokia Collaborate for 4.9G and 5G Technologies
S3 Semiconductors joins Arm Approved design partner program
TRINAMIC LICENSES CODASIP’S BK3 RISC-V PROCESSOR FOR NEXT GENERATION MOTION CONTROL APPLICATIONS
MIPS 64-bit Multi-Threaded Processor Drives AI’s Explosive Growth
GCT Semiconductor Licenses CEVA Bluetooth Low Energy IP for its LTE IoT SoC
CEVA First to Deliver Bluetooth® 5 Dual Mode IP
Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt
Arteris IP FlexNoC® Interconnect Licensed by AutoChips for Automotive SoC Development
Maxim's Dynamic Speaker Management Technology Running on the CEVA-TeakLite-4 Ultra-Low-Power DSP Provides…
Nuance Voice Activation Technology Now Available for CEVA-TeakLite Family, World's Lowest Power Audio/Voice…
Single-Chip Custom Solutions for the IoT Edge
NovAtel® Demonstrates Precise Positioning Using the Teseo APP and Teseo V Automotive GNSS Chipsets …
Synopsys Adds New Algorithms in DesignWare Security Protocol Accelerators to Increase Protection for…
Vicor's Power-on-Package System Provides up to 1,000A Peak Current
Microsemi Enables Terabit OTN Switching Cards for Flexible Optical Networks
Akoustis Announces Major Milestone by Freezing Its First Generation Single Crystal BAW Manufacturing…
Imperas Appoints Kevin McDermott as Vice President of Marketing
Smart Manufacturing, Big Data to Highlight ASMC 2018
SONICS PARTNERS WITH INOMIZE TO ENABLE AUTOMOTIVE CHIP DESIGN FOR ISO 26262 STANDARD
OPENAIRINTERFACE SOFTWARE STACK POWERING 5G USE-CASES EXHIBITED AT MOBILE WORLD CONGRESS BARCELONA
Ashling and Imperas Partner to Extend the RISC-V Ecosystem
RISC-V RV64GC High-Performance Extendable Platform Kit For Fast Linux Execution Released by Imperas
Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
Solar-Tectic LLC Announces Publication Reporting Breakthrough High Mobility Thin-Film Transistor (TFT)…
Smallest 65W USB-PD Adapter Solution Using Industry Standard Super Junction FETs from ON Semiconduct…
Qualcomm Responds to Broadcom Statement
TI expands GaN power portfolio with the industry's smallest and fastest GaN drivers
Qualcomm, KDDI and NEC Platforms Ship World's First Commercially Available Draft 802.11ax Carrier Ga…
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
KEMET Introduces KC-LINK Capacitors for Fast-Switching Wide Bandgap Semiconductor Applications
Micron Technology to Host Analyst and Investor Event
MaxLinear to Showcase New Switch Mode DC/DC Dual 4A Power Module at APEC 2018
Velankani and STMicroelectronics Collaborate on Smart Meters for 'Make in India' Program
Luxshare-ICT Demonstrates New 400G/200G QSFP-DD/OSFP AOC and Introduces 100G/25G Pluggable Optical Module/AOC…
Metrics Partners with Avery to Expand Cloud Verification with Robust VIP Portfolio
Ceragon License CEVA DSPs for Full 5G Wireless Backhaul
Intel Ships Industry’s First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure …
Sequans Introduces New NB-IoT Only Platform: Monarch N
Aehr Test Systems to Exhibit at Burn-in and Test Strategies Workshop in Mesa, AZ March 4-7, 2018; CEO…
Trilinear Technologies and Avery Design Systems Team on DisplayPort IP Solutions
NVIDIA to Host World’s Top AI Experts at GPU Technology Conference
Microchip Technology to Acquire Microsemi
ROHM's New DC/DC Converter Featuring the Industry’s Lowest Current Consumption
InterDigital Makes Binding Offer to Acquire Technicolor’s Patent Licensing Business, Will Collaborate…
Oclaro Introduces Suite of Integrated Optical Components for 400G and 600G Networks
New 1-MHz active clamp flyback chipset and industry-first 6-A three-level buck battery charger from …
Brite Semiconductor Releases Gen2 DDR LP PHY IP
Truphone Brings New Integrated SIM Solution to Life With Synopsys ARC Secure IP Subsystem
ON Semiconductor’s SiC Diodes Offer Higher Efficiency, Power Density and Lower System Costs
Lowest-power multi-standard, multi-band MCUs connect the building, factory and grid via Thread, Zigbee,…
GaN Systems Announces World’s Highest Current Rated GaN Power Transistor
Renesas Electronics and Fortinet Highlight Integrated Security and Threat Protection for Connected Cars…
Green Hills Software Extends Its Trusted Instrument Cluster Solutions to Renesas Electronics' R-Car …
Ready for 3GPP Compliance - Anokiwave Introduces 1st IC in a new family that supports 3GPP compliant…
TDK to acquire Chirp Microsystems, aiming for leadership in ultrasonic sensing solutions
CEVA Announces Industry's First 802.11ax Wi-Fi IPs
CEVA Introduces PentaG™ - A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones,…
Blu Wireless Technology inside CCS self-organising mmWave access and backhaul solution
Spectrum’s digitizer is key for world’s highest indoor magnetic field at University of Tokyo
GOWIN Semiconductor Selects PLDA XpressRICH3 Controller IP as the PCIe Interface Block in Their FPGA…
USB 3.1 Gen1/Gen2 Type-C Controllers from Diodes Incorporated Integrate Advanced Features to Enable …
AccelerComm and Achronix Enable Fast Time to Market with 5G Polar Code for Speedcore eFPGAs
Diodes Incorporated’s Synchronous Rectifier Controller Delivers Higher Efficiency and Saves Board …
Axcelis Strengthens Its Board With Nomination Of Dr. Tzu-Yin Chiu
New robust, noise-immune capacitive-sensing MCUs from TI bring touch control to cost-sensitive industrial…
Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling Of eFPGA Cores To Create Wide…
GLOBALFOUNDRIES Strengthens 22FDX® eMRAM Platform with eVaderis’ Ultra-low Power MCU Reference De…
NXP Leads Edge Computing Revolution – High-Performance Compute, Security, and Ecosystem
STMicroelectronics Launches World's First Multi-Band GNSS Receiver with Autonomous-Driving Precision…
MoSys, Inc. Reports Fourth Quarter and Full Year 2017 Financial Results
Data I/O Announces Availability of SentriX(TM) Secure Provisioning Support for Infineon OPTIGA(TM) Trust…
Cypress Unveils Unified Software Suite to Accelerate IoT Product Designs
Renesas Electronics Delivers R-Car V3H System-On-Chip for Automotive Front Cameras in Level 3 and Level…
Renesas Synergy™ Strengthens Chip-to-Cloud IoT Connectivity With New Enterprise Cloud Toolbox
Cypress Introduces Nonvolatile Memory Family for Critical Data Logging in Automotive Event Data Recorder…
Microsemi Continues Its Leadership in Silicon Carbide Solutions with New SiC MOSFETs and SiC SBDs Targeted…
Qualcomm Introduces New Snapdragon 700 Mobile Platform Series
NXP Integrates Layerscape® Family of Arm-based Processors with Microsoft Azure IoT for Secure Edge …
NXP Unveils EdgeScale: A Secure, Scalable, Device-Management Suite for Edge Computing
New Arm Mbed IoT Device Platform capabilities enable companies to get more from their data
PSA: Next steps toward a common industry framework for secure IoT
Gartner Says Worldwide Sales of Smartphones Recorded First Ever Decline During the Fourth Quarter of…
Integrated Circuit Technology Advances Continue to Amaze
SoC-e’s MTSN Switch IP Core solution now supports 802.1AB (LLDP)
Truechip Announces First Customer Shipment of PCIe Gen 5 and JESD204C Verification IP
New Silicon Labs Wi-Fi Devices for the IoT Slash Power Consumption in Half
IAR Systems Enhances Amazon FreeRTOS Integration for Full Control of Arm Cortex-M-Based IoT Applicat…
Infineon expands mobile-security portfolio with the world's fastest solution
Astronics Corporation Reports 2017 Fourth Quarter and Full Year Financial Results
CENTRI to Demonstrate Complete Chip to Cloud Data Security Following Platform Security Architecture …
Broadcom's Attempts at Genuine Engagement Met with Qualcomm's "Engagement Theater"
SiFive to Host RISC-V Hackathon at Embedded Linux Conference
MEDIA ALERT: Achronix’s Steve Mensor Joins Expert Panel Addressing eFPGA Ecosystem During NDIA
STMicroelectronics and USound Demonstrate Immersive Listening Experiences with Advanced Micro-Speakers…
ON Semiconductor Expands Solutions for Industrial IoT, Smart Home and Wearables
STMicroelectronics and Sigfox Cooperate to Connect Billions of Devices
Saki to Demonstrate AOI, SPI, and AXI Software and Systems at IPC APEX Booth 1127
MACOM Announces GaN-on-Si MMIC Power Amplifiers for Massive MIMO 5G
Lattice Releases Next-Generation FPGA Software for Development of Broad Market Low Power Embedded Ap…
Renesas Electronics Shortens Evaluation Time of Industrial Networking Applications with RZ/N1L Solution…
Cypress and e.solutions Set New Standard for Automotive Infotainment
Cypress Accelerates Secure IoT Designs with Support for Platform Security Architecture Trusted Firmware-M…
Qualcomm Technologies Announces Industry's First Comprehensive Modem-to-Antenna Solution Featured in…
Keysight and ASTRI demonstrates test and measurement solutions for validating 3GPP Release 15 NR compliant…
Qualcomm Proposes Further Engagement with Broadcom on Price and Terms of Possible Transaction
CEVA Extends its IP Platforms for Bluetooth and Wi-Fi with RISC-V
Qualcomm Wi-Fi Innovations Are Leading Industry Growth, Creating New Opportunities for Partners and …
QuickLogic Collaborates with Shenzhen Horn Audio Company to Develop Bluetooth Headset Reference Desi…
MediaTek Powers the Future of Mobile with New Helio P60 Chipset, Bringing Big Core Power & AI Experiences…
Micron Announces Leading-Edge, Mobile 3D NAND Solutions for Flagship Smartphones
GREEN WAVES : GreenWaves Technologies Unveils GAP8, the Industry's Lowest Power IoT Application Processor,…
NI Introduces 3GPP-Compliant Reference Test Solution for Sub-6 GHz 5G New Radio
Inside Secure to Provide Secure Provisioning Solutions to ALi Corporation
TDK reinvents consumer-grade 6-Axis IMUs, launches new CORONA premium motion sensor product line addressing…
MaxLinear Strengthens Wireless Transport Product Portfolio with 5Gbps, 16K QAM-based Microwave Modem…
Keysight Launches 5G NR-Ready Solutions Across the Workflow at MWC 2018 Enabling Chipset and Device …
Analogix Introduces ANX7441 – First USB-C Re-timer for Next Generation Smartphones and VR Active C…
Vidatronic, Inc. Awarded National Science Foundation Grant for the Development of High Performance CMOS…
WuQi Technologies is the latest licensee of CCww’s NB-IoT UE protocol-stack software
48 Arteris IP Engineers Attain ISO 26262 Functional Safety Practitioner Certification by exida
UltraSoC and Lauterbach RISC-V collaboration furthers vendor-neutral debug and development environme…
Top 10 Semiconductor R&D Spenders Increase Outlays 6% in 2017
MWC 2018: Faststream Technologies Lightening the way to Ambient Intelligence for Move Towards Intelligent…
Industry's smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent
SM-Optics Unveils First FLEXSET Chip, Paving the Way to Optical Micro Nodes
Skyworks and Sequans Launch Industry’s Most Advanced LTE-M/NB-IoT Connectivity Solution for the Internet…
CEVA and mPerpetuo Partner to Deliver Halide Support for CEVA Vision Processors
QuickLogic Announces Partnership with DSP Concepts to Extend the Market Reach of Always-On Mobile De…
Samsung Electronics Breaks Ground on a New EUV Line
Data I/O Reports Fourth Quarter 2017 Results
ON Semiconductor to Demonstrate Latest Integrated Semiconductor Solutions for the Internet of Things…
SparkFun and Cypress PSoC 6 Wireless Sensor Network IoT Development Platform Available through Digi-…
Barefoot Networks and Xilinx to Showcase Unprecedented Programmability and Visibility for 5G Network…
LegUp Computing, Inc. Closes a Seed-funding Round Led by Intel Capital
Intel and Unigroup Spreadtrum & RDA Announce 5G Strategic Collaboration
InterDigital Reports Fourth Quarter and Full Year 2017 Financial Results
STMicroelectronics Powers Next-Generation IoT Devices with Higher-Performing Multiprotocol Bluetooth®…
Adesto’s EcoXiP™ enables ultra-low-power, low-latency XiP system operation on STMicroelectronics’…
Data I/O Supports Platform Security Architecture from Arm to Deliver Scalable Security for all IoT O…
Cypress Introduces Automotive-Grade USB-C Controller for Fast Device Charging in Cars
MaxLinear’s AirPHY™ Powers New ZINWELL Outdoor-Indoor Product for 5G High-Band Wireless Communic…
Microsemi's New RF Modules Speed Time to Market for Implantable Medical Device Designers
Movandi Unveils BeamX 5G RF Front-End 28 GHz and 39 GHz Millimeter Wave Solutions
TowerJazz Reports Fiscal Year 2017 Record Results in Revenues, Gross Profit, Operating Profit, EBITDA,…
Samsung Electronics and Qualcomm Expand Foundry Cooperation on EUV Process Technology
ROHM's New High-Speed Optical Heart Rate Sensor Optimized for Measuring Blood Pressure, Stress and Vascular…
Shenzen TiComm Selects Ethernity Network’s FPGA-Based SD-WAN Platform
Qualcomm Strengthens IoT Interoperability with New Development Kits Supporting Key Wireless Technologies…
Qualcomm Artificial Intelligence Engine Powers AI Capabilities of Snapdragon Mobile Platform
Qualcomm Announces New Snapdragon 845 Mobile VR Reference Design To Fuel Next-Generation VR Experien…
Napatech Delivers Stunning 100 GigE Performance for TRex
Qualcomm Introduces the Industry's First Integrated 802.11ax-ready Solution for Smartphones and Computing…
Broadcom Adjusts Offer for Qualcomm to $79 Per Qualcomm Share
Qualcomm and Ruckus Successfully Complete Industry's First Announced Trial of Enhanced Wi-Fi CERTIFIED…
Qualcomm Extends its Embedded Computing Portfolio and Brings its Premium Tier Processors for Cutting-Edge…
Qualcomm Enhances Performance of Truly Wireless Earbuds and Hearables with its Next Generation Qualcomm…
InterDigital to Showcase 5G Millimeter Wave Integrated With OPENAIRINTERFACE LTE Solution
AdaSky and STMicroelectronics Cooperate to Bring Day/Night High-Resolution Vision and Perception to …
AMD Launches EPYC™ Embedded and Ryzen™ Embedded Processors for End-to-End “Zen” Experiences …
InterDigital’s Alan Carlton to Particpate in MWC18 5G Panel Discussion: Core or Edge?
Dover Microsystems Secures $6M Seed Funding
Renesas Electronics Unveils New Renesas Synergy™ Website and Solutions Gallery for IoT Developers
MaxLinear MxL85110 Virtual Fiber™ 20 Gigabit Ethernet Modem SoC Selected by Technetix for Wireless…
Magewell to Expand Video Interface Offerings at 2018 NAB Show
Embedded Artists selects Adesto’s EcoXiP™ system-accelerating memory to optimize system performance…
Fine Line Stencil and Metal Etching Technology Announce Merger
Rambus Signs License Agreement with Gemalto to Protect Against Side-Channel Attacks
Silicon Library Adopts Averant's Solidify Automated Checks Using CDC Inc. EDA Cloud Services
Broadcom is Evaluating its Options Following Qualcomm's Transfer of Value from Qualcomm Stockholders…
Air Products Introduces New Flux-free Soldering Technology for Wafer Level Packaging Applications at…
Keysight Technologies’ mmWave Testbed Enables Ball Aerospace, Anokiwave to Validate First Commercial…
ON Semiconductor Announces New Set of Low Power, Fully Compliant USB-C 1.3 Devices
New Lattice Modules Make Replacing USB Connectors with 12 Gbps Wireless Technology a Snap
Seoul Semiconductor Successfully Invalidates Everlight’s Patent in the United Kingdom and Holds Everlight…
INVECAS, Molex Collaborate on Automotive Infotainment Media Module
Qualcomm Enters into Amended Definitive Agreement with NXP
Microsemi to Showcase Third-Party IP Offerings for Machine Vision Applications Using its Cost-Optimized,…
NXP Unveils Cutting Edge IoT, Industrial and Automotive Solutions at Embedded World 2018
Solid State System Co., Ltd. Andes AndesCore ™ N9 for Its SSS6131 USB 3.1 Gen 1 Flash Controller Highly…
MIPS and NetSpeed Partner to Deliver Solutions for AI and ML SoCs
SiFive Appoints CFO to Executive Team
Arteris IP FlexNoC Interconnect Licensed by Arbe Robotics for Automotive Imaging Radar Chipset
Renesas Electronics Introduces Low-Cost Target Boards to Support Growing RX 32-bit MCU Family
VESA Highlights Growing Adoption of DisplayPort over USB-C, New Codec for Handheld Device-Specific Display…
New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
Intrinsic ID to Demonstrate Hardware Root of Trust for IoT Security at Embedded World, February 27 to…
TSMC January 2018 Revenue Report
Qualcomm Provides Update on Meeting with Broadcom
Pixelworks Reports Fourth Quarter and Fiscal Year 2017 Financial Results
PDF Solutions® Reports Fourth Fiscal Quarter and Fiscal Year 2017 Results
MoSys Ships Over 100,000 Bandwidth Engine Serial Memory ICs
MaxLinear Microwave Transceiver SoC Powers Aviat Networks' New WTM 4000 Microwave Radio Platform with…
WISeKey's Semiconductor reaches 1 Billion Secure Chips and introduces VaultIC407, a new Secure Microprocessor…
Qualcomm Issues Statement On Meeting with Broadcom
QuickLogic Reports Fourth Quarter and Fiscal 2017 Results
Atotech to present and exhibit at the IPC APEX Expo 2018
Express Logic’s X-Ware IoT Platform® Brings Industrial-Grade IoT Support to RISC-V Architecture
Microprocessor Supervisory Circuit from Diodes Incorporated Monitors System Voltage with Programmable…
Peraso Appoints Wireless and Semiconductor Industry Veteran Bill McLean as CEO
Qualcomm Announces a New LTE IoT Software Development Kit in Support of the Commercialization of Internet…
Qualcomm Demonstrates the Next Phase of 5G NR Technology Roadmap to Expand the Mobile Ecosystem
Qualcomm Technologies Announces the Introduction of Qualcomm Wireless Edge Services
Qualcomm Continues Gigabit LTE Leadership with World's First Announced 2 Gbps LTE Modem
STMicroelectronics Signs License and Cooperation Agreement on LDMOS Technology from Innogration
Renesas Synergy Platform Boosts IoT Performance With IAR Systems Advanced Compiler Technology
Ethernity Networks Enhances ENET Flow Processor SoC with IPSec
Orbotech Reports Fourth Quarter and Full Year 2017 Results
MaxLinear, Inc. Announces Fourth Quarter 2017 Financial Results
IntelliProp Announces Q1 2018 Release of Gen-Z IP Cores Supporting Rev 1.0 Specification
New university robotics kit and curriculum from TI prepare future engineers for systems-level design…
HEIDENHAIN Introduces New AMO Multi-Section Linear Encoder For Use with ACU-RITE'S Digital Readouts
Aehr Test Systems Receives Orders Exceeding $2.5 Million for Burn-in and Test Products for Automotive…
Arm’s Project Trillium Offers the Industry's Most Scalable, Versatile ML Compute Platform
Gen-Z Consortium Announces the Public Release of Its Core Specification 1.0
SoC-e releases IEC 61850/62351 SASCrypt IP Core
NetSpeed and Synopsys Collaborate to Enable Early Architectural Exploration of Advanced ADAS and Datacenter…
Sonics noc customer Starblaze Technology reaches volume production with star1000 SSD controller SoC
CEVA, Inc. Announces Fourth Quarter and Year End 2017 Financial Results
First AMD Ryzen™ Desktop APUs Featuring World’s Most Powerful Graphics on a Desktop Processor(1)…
MagnaChip Offers 2nd-Generation 0.13 Micron BCD Process Technology with High-Density Embedded Flash …
Broadcom Presents Best and Final Offer for Qualcomm of $82.00 Per Share
Annual Semiconductor Sales Increase 21.6 Percent, Top $400 Billion for First Time
intoPIX & Macnica Technology revolutionize AV signal distribution at ISE 2018: Integrating the new ST…
GUC Monthly Sales Report – Jan 2018
Sankalp Semiconductor opens a New Design Center in Ahmedabad
Moortec Appoints Mark Davitt ex Sidense Sales Director to grow PVT Monitoring Sales in North America…
ChipMOS REPORTS JANUARY 2018 REVENUE
UMC Reports Sales for January 2018
Renesas Electronics Reports Full Year 2017 Financial Results
Renesas Electronics Announces Consolidated Forecasts for the First Quarter Ending March 31, 2018
NVIDIA Announces Financial Results for Fourth Quarter and Fiscal 2018
Qualcomm Board of Directors Unanimously Rejects Revised Broadcom Proposal
Monolithic Power Systems Announces Results for the Fourth Quarter and Year Ended December 31, 2017, …
Ultra-Compact TVS from Diodes Incorporated Provides Protection for USB 3.1/3.2 and Thunderbolt 3 Int…
Trace3 Partners with NVIDIA to Deliver Accelerated Computing and Machine Learning
Global OEMs Select Qualcomm Snapdragon X50 5G NR Modem Family for Mobile Device Launches in 2019
Movandi Works with Keysight Technologies to Advance Millimeter Wave Technology and Test Capabilities…
MIPI Alliance Releases MIPI UniPro v1.8 with Increased Performance and Improved Quality of Service
SMIC Reports 2017 Fourth Quarter Results
VisIC Technologies Partners With TSMC to Offer Industry's Most Advanced 1200V GaN-based Power Device…
Samsung Begins Mass Production of 256GB Embedded Universal Flash Storage for Automotive Applications…
NXP Semiconductors Reports Fourth Quarter and Full Year 2017 Results
Alpha and Omega Semiconductor Reports Financial Results for the Fiscal Second Quarter of 2018 Ended …
FormFactor, Inc. Reports Strong Fourth Quarter and Full Year 2017 Results
Diodes Incorporated Reports Fourth Quarter and Fiscal 2017 Financial Results
A Billion Devices from SiTime Empower Self-Driving Cars, Mobile Phones, and Everything in Between
Improve System Accuracy with Maxim's Small, Low Power 4-20mA Sensor Transmitter for Industrial Automation…
SiFive Launches World's First Linux-Capable RISC-V Based SoC
Renesas Electronics Ships Space Industry’s First Radiation-Hardened 100V and 200V GaN FET Power Supply…
Camtek Announces Fourth Quarter and Full Year 2017 Results
Fairview Microwave Introduces New Calibrated Noise Sources Designed for Precision Test and Measurement…
Silicon Motion Announces Results for the Period Ended December 31, 2017
LYTSwitch-6 LED Drivers From Power Integrations Feature High Efficiency and Very Low Standby Power
MagnaChip Reports Fourth Quarter and Full Year 2017 Financial Results
MACOM Reports Fiscal First Quarter 2018 Financial Results
MACOM and STMicroelectronics to Bring GaN on Silicon to Mainstream RF Markets and Applications
Maxim Selects Methodics as IP Lifecycle Management Platform to Enable Enterprise IP-Centric Design Approach…
AMD EPYC™ Momentum Grows with Three New Platforms in Industry-Leading Dell EMC PowerEdge Family
Microsemi's Libero SoC Development Software Now Certified for IEC 61508 Functional Safety Requiremen…
EMCORE Introduces New EMCORE-Hawkeye™ Series of Precision Single-Axis Fiber Optic Gyroscope Module…
intoPIX & Macnica Technology Revolutionize AV Signal Distribution at ISE 2018: Integrating The New ST…
Mobile System on Chip Designs, Embedded Processing Lift MPU Market
JEDEC Publishes Universal Flash Storage (UFS & UFSHCI) Version 3.0 and UFS Card Extension Version 1.…
Micron Updates Guidance for Fiscal Second Quarter
AKM Has Developed TRANSMIT-ONLY Bluetooth(R) Low Energy IC
Continental and NVIDIA Partner to Enable Worldwide Production of Artificial Intelligence for Self-Driving…
Qualcomm Confirms Receipt of Revised Proposal from Broadcom
Xilinx to Showcase 8K and AV over IP Solutions at ISE 2018
ON Semiconductor Reports Fourth Quarter and 2017 Annual Results
AMIQ EDA Releases Version 18.1 of the Design and Verification Tools Eclipse IDE
Silex Inside releases JPEG 2000 AV over IP OEM boards
Movellus Announces “True Digital” PLL, DLL, & LDO Generators
New Silicon Device Solutions from Omnitek
Arteris IP and Synopsys Accelerate the Optimization of Heterogeneous Multicore Neural Network System…
Horizon Robotics Licenses NetSpeed Interconnect IP for AI SoCs
Icron’s Powerful Maverick KVM Extension Platform to be Showcased by intoPIX at ISE 2018 Show in Am…
Leti Proposes Curving Technology for Optical Equipment that Improves Performance and Reduces Cost and…
Cypress Reports Fourth Quarter and Year End 2017 Results
Power Integrations Reports Fourth-Quarter Financial Results
Motorola Solutions Reports Fourth-Quarter and Full-Year Financial Results
Air Products to Supply Samsung Electronics' Second 3D V-NAND Fab in Western China
CommAgility LTE platform supports eNodeB and UE LTE-Advanced functionality
Teledyne Technologies Reports Fourth Quarter Results
Cavium Announces Financial Results for Q4 2017
Qualcomm Earnings Release Available on Company's Investor Relations Website
Qualcomm and Samsung Announce Expanded Strategic Relationship
ESI Announces Strong Third Quarter Fiscal 2018 Results
TE Connectivity and Credo pave the way for 112G single lane connectivity
ST Technologies Help Neonode Add Touch Interaction to Any Object, Surface, or Space
Renesas Electronics Unveils Industry-Leading Fully Encapsulated Dual 30A and Single 33A Digital Power…
Silicon Labs Announces Fourth Quarter 2017 Results
InterDigital Announces Successful Demonstration of 5G Ready mmW Wireless Crosshaul Transport
Mitsubishi Electric's New 6.5 kV Full-SiC Power Semiconductor Module Achieves World's Highest Power …
Largest SEMICON Korea Ever Highlights Smart Manufacturing, Automotive
AMD Reports Fourth Quarter and Annual 2017 Financial Results
ROHM's New Boost Converter Provides 1.3x Longer Battery Life
Mike Noonen Joins efabless’ Advisory Board
Constant-Current LED Drivers Now Offered in Low-Profile DFN Package Suitable for Edge Lighting
Custom Silicon Veteran Joins SiFive Executive Team
Alpha and Omega Semiconductor Announces the Newest Generation of XSPairFET™ in DFN 3.3x3.3 Package…
Spectra7 and Amphenol ICC Showcase 100/200/400 Gbps Data Center Interconnects at DesignCon
Microsemi Announces Digital Ceiling Power-Over-Ethernet Switch Offering Optimal and Cost-Effective Solution…
UltraSoC delivers industry’s first RISC-V processor trace IP
Gartner Says Samsung and Apple Extended Their Lead as Top Global Semiconductor Customers in 2017
Semiconductor Shipments Forecast to Exceed 1 Trillion Devices in 2018
Andes Processors Are Not Susceptible to Meltdown and Spectre Attacks
Eta Compute Secures $8 Million Series A Financing to Accelerate Development of the 3rd Generation of…
NXP Expands Automotive Ethernet Portfolio with new Gigabit Switch and Dual Port PHY
Chelsio Demonstrates Leading NVMe Over Fabrics (NVMe-oF) JBOF Performance Using 100GbE iWARP RDMA
Rambus Reports Fourth Quarter and Fiscal Year 2017 Financial Results
Developers can maximize efficiency in cost-sensitive power-control applications with new additions to…
ON Semiconductor Announces Strategic Partnership With Audi on Progressive SemiConductor Program (PSC…
Qualcomm Releases Video and Sends Informational Brochure to Stockholders
Marvell Announces Expiration Of Hart-Scott-Rodino Waiting Period
Sigma Designs, Inc. Announces Departure of President and Chief Executive Officer Thinh Tran
POET Technologies Introduces Optical Interposer Platform for Co-Packaging of Electronic and Optical …
Renesas Electronics Expands RX130 MCU Lineup to Enhance Functionality for Touch-Based Home Appliances…
Cypress Enables the Industry’s First Certified Bluetooth® Mesh Product
InterDigital Joins European and Taiwanese Consortium to Deliver a 5G Converged Radio Access Network …
Toshiba Electronic Devices & Storage Corporation Releases Small Dual MOSFET for Relay Drivers
CODASIP ANNOUNCES STUDIO 7, DESIGN AND PRODUCTIVITY TOOLS FOR RAPID GENERATION OF RISC-V PROCESSORS
ISRAELI SEMICONDUCTOR CONSORTIUM LICENSES FLEX LOGIX’S EMBEDDED FPGA TECHNOLOGY
GUC Announces 20th Anniversary
Inside Secure Protects New Interactive Video Application Developed by PodOp and HBO
Thalia expands with new analog design engineering facility
FormFactor to Announce Fourth Quarter 2017 Financial Results on February 7
Toshiba Electronic Devices & Storage Corporation Introduces SOI Process with Low Noise Figure for Low-Noise…
Global Communication Semiconductors, Intengent, and VLC Photonics Enter into a Partnership to Provide…
Microsemi Reports First Quarter 2018 Results
Maxim Integrated Reports Results For The Second Quarter Of Fiscal 2018; Increases Dividend By 17%
MaxLinear Launches Industry's First 400Gbps PAM4 DSP SoC with Integrated Laser Drivers for Cloud Data…
Rambus and Marvell Sign Patent License Agreement
Qualcomm and Leading Chinese Manufacturers Announce "5G Pioneer" Initiative
Carlo Bozotti's Succession Plan Announced at STMicroelectronics
STMicroelectronics Reports 2017 Fourth Quarter and Full Year Financial Results
Imagination Announces Neural Network SDK
Xilinx Reports Record Revenues; Ninth Consecutive Quarter Of Revenue Growth
Teradyne Reports Fourth Quarter and Fiscal Year 2017 Results, Increases Capital Return Program
pSemi Recognized for Second Consecutive Year on Distinguished "IEEE Spectrum" Patent Power Scorecard…
Pixelligent Technologies, Fraunhofer ISC, & Osram Semiconductor Release Whitepaper Covering PixClear®…
GLOBALFOUNDRIES Delivering 45nm RF SOI Customer Prototypes for 5G Applications
Andes Technology Processors Not Susceptible to Meltdown and Spectre Attacks
Qualcomm to Appeal European Commission Decision Regarding Modem Chip Agreement
UMC Reports Fourth Quarter 2017 Results
Diamond Electric Develops Business Card-sized, Thin 1KW Isolated Bidirectional DCDC Converter
Imagination announces hardware virtualized GPU core to meet automotive needs for cluster, HUD and in…
Starblaze Reaches Volume Production with Moortec’s Temperature Sensor in their SSD Controller SoC
TI reports 4Q17 and 2017 financial results and shareholder returns
Cavium™ FastLinQ® Enables Scalable Networking for HyperConverged Infrastructure
aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 TSVs
Micron Launches Industry’s First Enterprise SATA Solid State Drives Built on Leading 64-layer 3D NAND…
AgigA Tech Introduces New Family of PowerGEM® Energy Modules for NVDIMM Backup Power
Rambus Announces GDDR6 Memory PHY for AI, Automotive and Networking Applications
Molex Spotlights MPN High-Speed Structured Cabling at 2018 BICSI Winter Show
Achronix Completes Production Silicon Validation of 16nm FinFET+ Speedcore eFPGA Technology
Value of Semiconductor Industry M&A Deals Slows Dramatically in 2017
TSMC Reports Fourth Quarter EPS of NT$3.83
ASR License CEVA DSP and Connectivity Technologies for Smartphones and IoT Devices
Arteris IP FlexNoC Interconnect Licensed by Nationz Technologies for Ultra-Low Power Security IoT Ch…
VSORA Closes Series A Financing with Investment from Omnes Capital, Partech Ventures, Angel Investo…
Everspin Begins 40nm STT-MRAM Volume Production
Open-Silicon Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for Best Paper
Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.5 Percent in 2018
Vidatronic Continues Expansion with New Office in Austin, Texas
OneSpin Announces Immediate Availability of OneSpin 360 EC-FPGA Tool Qualification Kit Certified for…
Broadcom Receives Second Request From FTC Under HSR Act for Proposed Acquisition of Qualcomm
Intel Demonstrates Technology That Transforms the Entertainment Industry at Sundance Film Festival
Barco Silex leaves Barco and becomes Silex Inside
Mentor Nucleus RTOS extends system reliability for Arm Cortex v8-A 64-bit processors on multicore So…
MIPS Returns to Silicon Valley To Drive Next Generation of Intelligent Applications
Xilinx Announces Availability of Automotive Qualified Zynq UltraScale+ MPSoC Family
Microsemi Announces its Entire Product Portfolio is Unaffected by Spectre and Meltdown Vulnerabiliti…
Picosun Provides 300 mm ALD Technology for Green Power Electronics
Broadcom Issues Statement
Magewell Bringing Powerful Video Interface Innovations to ISE 2018
Orbotech Announces Preliminary Fourth Quarter and Fiscal Year 2017 Results; Updates 2018 Guidance With…
Peregrine Semiconductor Is Now pSemi™; Celebrates 30 Years of Technology Innovation and Ships 4 Billionth…
TSMC December 2017 Revenue Report
At CES 2018, Global SoC Design Service Provider, Incise announces the appointment of T2M for global …
STMicroelectronics Selects GLOBALFOUNDRIES 22FDX® to Extend Its FD-SOI Platform and Technology Lead…
eSilicon announces 7nm FinFET ASIC design win
Arteris IP FlexNoC Interconnect Licensed by Nationz Technologies for Ultra-Low Power Security IoT Ch…
Qualcomm Sends Letter to Stockholders and Files Investor Presentation
NI Improves PXI SMU Channel Density for the Semiconductor Test System by 6X
Microsemi and Future Electronics Announce Avalanche Board for Designing with Microsemi's PolarFire F…
BaySand expands its “Programmable-In-ASIC” initiative with EfinixTM QuantumTM programmable accelerator…
IFI CLAIMS Announces 2017 Top US Patent Recipients
CEVA Introduces ClearVox™- Advanced Software Package Providing Enhanced Speech Intelligibility for…
Flex Logix Names Valy Ossman Technical Director, Solutions Architecture
Dolphin Integration paves the way for the next generation of Digital microphones “CoolMic”
Moortec Opens New European Design Centre in Poland
Sankalp Semiconductor expands internationally with its operations in Malaysia
Wi-Fi Alliance® introduces security enhancements
GUC Monthly Sales Report – Dec 2017
UMC Files Patent Infringement Lawsuit against Micron
14nm FinFET 2.5D/HBM2/SerDes Webinar, presented by Samsung, ASE, eSilicon, Rambus and Northwest Logi…
Molex Automotive Power Delivery Modules Leverage Innovative Microchip Technology Devices
New NPC Modules with Latest IGBT Chip Technology for up to 120 kVA
Toshiba Electronic Devices & Storage Corporation Unveils New-Generation 600V Planar MOSFET Series
FDK Introduces High Voltage 1/8th Brick Isolated Power Module
Toshiba Introduces New Bluetooth 5-Compliant ICs with Industry-Leading Sensitivity Level of -105dBm …
MaxLinear G.hn Wave-2 Technology Selected by Comtrend for New Carrier-Grade Wi-Fi Extender Solution
Express Logic’s X-Ware IoT Platform™ Achieves Thread® Product Certification
ON Semiconductor and ConvenientPower Systems Announce Strategic Collaboration in Automotive Wireless…
Cypress Introduces the Industry’s Most Advanced Automotive Touchscreen Controller
Cypress Brings Superior Infotainment Experience to Connected Cars
Industry’s strongest MEMS microphone portfolio driven by TDK
Cypress’ Ultra-Low Power, Secure PSoC 6 MCU at the Core of Innovative Wellness Wearable From Oura …
Aquantia and Molex Collaborate on Multi-Gigabit Automotive Ethernet Network
Plume® and MediaTek Announce Cloud Pre-Integration, Wi-Fi Pod Reference Design
Lattice Semiconductor to Showcase Latest Innovations in Edge Connectivity and Computing Solutions at…
Toshiba Electronic Devices & Storage Corporation Launches Two New ICs Compliant with Bluetooth® Ve…
UMC Reports Sales for December 2017
4D Systems announces global distribution agreement with Arrow Electronics
Hardent IP Portfolio Supports New Features of HDMI 2.1 Specification
UltraSoC appoints Aileen Smith as Chief Strategy Officer
AImotive, Leading Provider of Camera-First Autonomous Driving Technology, Raises $38 Million USD Series…
MaxLinear Expands Multi-Gigabit G.hn Wired Connectivity to Automotive, Industrial, Security and Utility…
Media Alert: Intel CEO Brian Krzanich Kick Starts CES 2018 With Pre-Show Keynote
Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs
ON Semiconductor’s AR0430 Image Sensor Recognized at CES 2018 for Simultaneous Delivery of Image Capture…
New Development Kit from ON Semiconductor Enables Rapid Installation of Battery-Free Smart Passive Sensors™…
Energous Unveils Industry-First Wireless Charging 2.0 Integrated Circuit (IC) Solutions at CES 2018
Spectra7 Announces New AR/VR/MR Products and Reference Designs for Mobile Tethered Head Mounted Displays…
Analogix’s Turnkey VR Solutions Power the Industry’s Newest Wave of Tethered VR Headsets
Dialog Semiconductor Plc: FCC Certification of Energous Wireless Power-At-A-Distance Unlocks Complete…
Ambarella Introduces CV22 4K SoC with CVflow™ Computer Vision Architecture
GEO Introduces the World’s First Automotive Smart Viewing Camera Processor
Toshiba Unveils Mainstream RC100 NVMe SSD Series at CES 2018
Cleer, Inc. Announces Broad New Bluetooth Wireless Headphone Line-up Based on Qualcomm Bluetooth Audio…
Gartner Says Worldwide Semiconductor Revenue Grew 22.2 Percent in 2017; Samsung Takes Over No. 1 Pos…
CEVA's Bluetooth® 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester
NGCodec Closes $8M Series A, Launches Live Broadcast H.265/HEVC Cloud Video Encoding and Demonstrates…
DSP Group, Emza and Himax Announce Industry’s First AI based Human Presence IoT Visual Sensor for …
Faraday Signs Satris Group as Its Israeli Distributor
Argus Cyber Security Collaborates with Renesas to Secure Connected and Autonomous Vehicles Against C…
CEVA Unveils NeuPro™ - A Family of AI Processors for Deep Learning at the Edge
ON Semiconductor Introduces Scalable Image Sensor Platform for ADAS and Autonomous Driving to Speed …
ON Semiconductor Joins CharIN Ecosystems in Development of Electric Mobility Standards
MIPI Alliance Enhances its MIPI NIDnT Debug and Test Specification to Enable Debugging over the Latest…
Toshiba Memory America Highlights Recent BiCS FLASH 3D Technology Breakthroughs, Unveils New NVMe SSD…
Virtualized eCockpit: COQOS Hypervisor on NXP i.MX 8 and i.MX 8X
OmniVision's First 0.9 Micron Pixel Image Sensor Family Enables Best-in-Class Performance and Features…
Breakthrough TFT material for LCD and OLED displays by Solar-Tectic LLC and Blue Wave Semiconductors,…
Baidu Selects ON Semiconductor Image Sensors for its Apollo Autonomous Driving Platform
eVaderis Completes Tape-Out of Innovative MRAM-Based, Memory-Centric MCU Demonstrator for Next-Generation…
Arastu Systems enhances outreach with the establishment of its Global Sales Channel
Chipus Microelectronics receives ISO 9001 certification
NXP and Baidu Partner on Apollo Open Autonomous Driving Platform
Rambus Renews Patent License Agreement with Panasonic
QuickLogic to Demonstrate Sensor Processing and eFPGA Solutions at CES 2018
Khronos Group Releases NNEF 1.0 Standard for Neural Network Exchange
X-FAB Introduces New Low-Power eFlash Block Optimized for Energy Harvesting & IoT Devices
Renesas Electronics and Green Hills Software Collaborate on Connected Cockpit Vehicle
Renesas Electronics Accelerates NCAP Front Camera Application Development for Entry and Mid-Range Cars…
UMC Announces Availability of 40nm SST Embedded Flash Process
IC Manage Launches Envision Verification Analytics with 10-100x Speedup
Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance…
Maxim Empowering Design Innovation at CES 2018
BrainChip Announces Change in Board Membership
QuickLogic Collaborates with Mentor to Provide Seamless Design Environment for eFPGA Technology
Achronix Wins 2017 Company of the Year Award
Innovative Logic USB 3.1 Gen 2 IP got Certification from USB-IF
Catena selects Thalia-DA to facilitate analog IP re-use
Inspur Demonstrates PowerAI Solution at 2017 OpenPOWER China Summit
Toshiba Electronic Devices & Storage Corporation Releases High-Current Photorelays for Factory Automation…
Wide Input Voltage Ultra-Low Quiescent Current Regulator from Diodes Incorporated covers 5V, 9V, 12V,…
ON Semiconductor Demonstrates its Enabling Technologies for Automotive and IoT Applications at CES 2…
Renesas Electronics and Airbiquity Deliver Secure, High-Performance Automotive Solution with Over-the-Air…
Microsemi and American Megatrends Collaborate to Enable Innovative NVMe-oF Storage Solutions Based on…
Intersil to Start Operations as Renesas Electronics America in January 2018
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Truechip Successfully hosted TrueConnect 2017- The First Annual Technical Conference
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VESA Defines New Standard to Help Speed PC Industry Adoption of High Dynamic Range Technology in Laptop…
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IDT Introduces Timing Solutions for Cavium Processors
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AI Chip Maker ThinkForce Raises RMB 450 Million from YITU Tech, Yunfeng Fund, Sequoia Capital and Hillhouse…
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Inside Secure Delivers Next-generation Content Protection Solutions Extending Leadership in Device Coverage…
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the REUSE 2017 Expo in Santa Cl…
Lattice Diamond Software Receives Road Vehicles Functional Safety Qualification (ISO 26262)
Inside Secure protects Lufthansa Technik’s inflight entertainment on passenger devices
SEGGER presents RTOS, stacks, middleware for RISC-V
Euresys Acquires Sensor to Image
AIC Announces Its New Line of Servers With Intel® Xeon® Scalable Processors
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
ICE-P3 EPU Upgrade Simplifies Control Of On-Chip And External Resources To Save More Power In SoC And…
MediaTek Sensio: New Biosensor Solution Brings Health Monitoring to Smartphones
Renesas Electronics and Dibotics Realize Real-Time, Power-Efficient LiDAR Processing Based on R-Car …
Maxim's Isolated CAN Transceivers Ensure Robust Communications for Industrial Systems
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Toshiba Memory America’s Storage Node Software Obtains Industry-First NVMe-oF Certification
SMIC and Efinix™ Quickly Deliver the First Quantum™-Accelerated Silicon Product
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Toshiba Introduces New Bluetooth Low Energy IC for Automotive Applications
Redpine Signals Launches Industry's Lowest-Power Wireless MCU and Connectivity Solutions for Battery-Operated…
MIPI Alliance Opens Access to its MIPI I3C Sensor Interface Specification
Magewell Streamlines 4K HDMI Video Capture Architectures with New Pro Capture HDMI 4K Plus LT
Microsemi and Imperas Announce Extendable Platform Kit for Microsemi Mi-V RISC-V Soft CPUs
TSMC November 2017 Revenue Report
UltraSoC and Percepio partner to offer first complete embedded analytics platform for real-time syst…
Kilopass Anti-Fuse NVM OTP IP Designed into Montage Technology Next Generation Set-Top Box Chips Targeting…
Arasan Announces Industry’s First MIPI C-PHY HDK
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Dialog Semiconductor Power Conversion Chipset Used in HUAWEI's Latest Flagship Mate 10 Series
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Broadcom Files Preliminary Proxy Materials in Connection with Qualcomm's 2018 Annual Meeting and Files…
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For the 3rd Time, ArterisIP Appears on the Inc. 5000 list
Videantis and ADASENS partner to address explosive growth in intelligent automotive cameras
Inomize selected as Supply Chain Manager and to support the development of 3D camera and AI/AR/VR ASIC…
GUC Monthly Sales Report – Nov 2017
Green Hills Software Expands Automotive Integrated Cockpit Coverage to NXP i.MX 8 Families
Media Alert: Rambus to Showcase High-performance SerDes Solutions at the eSilicon Live Seminars in Tokyo…
AKM Releases AK4493, Upgrade to the AK4490, the Best Selling Premium High-End DAC
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UMC Reports Sales for November 2017
Silicon Labs Announces Definitive Agreement to Acquire Sigma Designs, Inc.
Offline Constant Voltage and PFC Controller from Diodes Incorporated Offers Low Standby Power for Connected…
BLU and MediaTek Expand Collaboration, Introduce New BLU S1 Smartphone
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SiFive Joins Microsemi's New Mi-V Ecosystem to Accelerate Adoption of RISC-V Open Instruction Set Ar…
MediaTek SoCs are optimized and ready for Android Oreo (Go edition)
Toshiba Electronic Devices & Storage Corporation Launches 4-channel High-Efficiency Linear Power Amplifier…
Qualcomm Snapdragon 845 Mobile Platform Introduces New, Innovative Architectures for Artificial Intelligence…
Anritsu and Huawei Demonstrate 1.2 Gbps LTE-A Pro Download Speed
Cadence Allegro Pulse Extends Team Collaboration, Reducing Costs and Enabling Shorter, More Predictable…
Industry's first zero-drift, nanopower amplifier combines ultra-high precision with the lowest power…
MikroElektronika Click Board With Cypress F-RAM Memory Enables Mission-Critical Data Capture for Industrial…
GCT Semiconductor's 4G LTE IoT Chip Powers New AI Speaker Launched in South Korea
Inside Secure delivers strong customer authentication for Visma Solutions
Intrinsic ID Names Alpesh Saraiya as Senior Director Product Management
MediaTek Announces Second Smartphone Design Training Program, Offers Intensive Training to Engineers…
Toshiba Electronic Devices & Storage Corporation Introduces New Bluetooth® low energy IC for Automotive…
Qualcomm Launches Technology Innovation with Advancements in the Always Connected PC and its Next-Generation…
Think Silicon Joins SiFive's Growing DesignShare Ecosystem
Cavium Partners with IBM for Next Generation Platforms by Joining OpenCAPI
TI broadens 4K UHD display possibilities with newly expanded portfolio of DLP® Products
Imaging Innovator Gigajot Licenses Binary Pixel Technology from Rambus
Microsemi Enhances SyncServer S600 Series Time and Frequency Server to Support Low Phase Noise Signals…
Esperanto Technologies Plans Energy-Efficient Chips for Artificial Intelligence and Machine Learning,…
Western Digital to Accelerate the Future of Next-Generation Computing Architectures for Big Data and…
SiFive Joins FDXcelerator™ Program to Bring RISC-V Core IP to GLOBALFOUNDRIES’ 22FDX® Process T…
CODASIP ANNOUNCES BK5-64, A NEW 64-BIT RISC-V PROCESSOR
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Mitsubishi Electric and the University of Tokyo Quantify Factors for Reducing SiC Power Semiconductor…
Toshiba Announces 10TB NAS-Class Hard Drive
InterDigital and LG Electronics, Inc. Sign Multi-Year Patent License Agreement
InterDigital Updates Revenue Guidance for Fourth Quarter 2017
NVIDIA GPU Cloud Now Available to Hundreds of Thousands of AI Researchers Using NVIDIA Desktop GPUs
GLOBALFOUNDRIES and Ayar Labs Establish Strategic Collaboration to Speed Up Data Center Applications…
Nanometrics Announces Expansion of IMPULSE+ Integrated Metrology into 3D-NAND Interconnect Process …
Renesas Electronics America Expands Renesas IoT Sandbox with RX65N Wi-Fi Connectivity Kit to Accelerate…
Lattice Introduces GigaRay 60 GHz Modules for Gigabit-Class Wireless Infrastructure Applications
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HDMI FORUM RELEASES VERSION 2.1 OF THE HDMI SPECIFICATION
Titan IC launches “Hyperion F1 10G RegEx File Scan” on AWS Marketplace
Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC China 2017
TTTech collaborates with Intel to develop FPGA-based TSN solution for Industrial Automation
Breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the…
ROHM supplies Full SiC Power Modules to Formula E racing team Venturi
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Atomera Holds Semiconductor Variability Event at IEEE IEDM Conference in San Francisco
Semiconductor Industry Continues Upward Trend Toward Record Year, IHS Markit Says
MACOM to Showcase its Industry Leading GaN-on-Silicon Portfolio and High-Performance MMICs and Diodes…
Toshiba Increases Performance, Doubles Capacity with New XG5-P NVMe SSDs
MIPI Alliance Releases MIPI CCS, a New Specification that Streamlines Integration of Image Sensors in…
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IAR Systems Supports New Amazon Web Services IoT Microcontroller Operating System Amazon FreeRTOS at…
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STMicroelectronics Collaborates with Amazon Web Services on Complete STM32-Based IoT Node-to-Cloud Solution…
Adesto’s EcoXiP™ Solution Improves XiP Performance, Reduces Power and Cost for NXP’s New Crossover…
New Bluetooth® Low Energy and Energy Harvesting Sensor Shields Further Extend the Capabilities of ON…
Velodyne Demonstrates Quantum Leap in LiDAR Technology
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Lattice Simplifies Audio Connectivity and Improves Performance with HDMI 2.1 Enhanced Audio Return Channel…
Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
Microsemi Continues Leadership in Satellite Electronics with New Class V and Q Qualifications and QML…
Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology
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SiFive Advances Custom Silicon Industry with New Partnerships, Products at 7th RISC-V Workshop
Microsemi Corporation Completes Acquisition of Vectron International High-Performance Timing Business…
ROHM's Expanded Lineup of Compact High-Power Low-Ohmic Shunt Resistors
Minima Processor Reduces SoC Energy Consumption for Near-Threshold Voltage Design
Cavium FastLinQ® Delivers Advanced Networking I/O for HPE Gen 10 Servers
Supermicro Introduces Next-Generation Storage Form Factor with New Intel "Ruler" All-Flash NVMe 1U Server…
SiFive and Microsemi Expand Relationship with Strategic Roadmap Alignment and a Linux-Capable, RISC-V…
QuickLogic Announces Voice Over Bluetooth Low Energy Reference Design for its EOS S3 Voice-enabled Sensor…
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NI Announces New IP67 Edge Nodes for the Industrial Internet of Things
New Gate Drivers From Power Integrations Deliver Up to 5 A, Reducing System Complexity and Cost
Omni Design featured in the EE Times' 2017 Silicon 60: Startups to Watch
Argonne to install Comanche system to explore ARM technology for high-performance computing
NXP Announces Community-Based Industrial Linux Distribution for Industry 4.0
Inside Secure Selected by Neopost to Protect Online Postage Transactions
New Automation Systems Can Be Smaller, Smooth, and Silent with Advanced Motion-Control Chip from STM…
LG Innotek Unveils the World's First '100mW' UV-C LED
Cybertrust Japan Selects CryptoManager IoT Security Service from Rambus
Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing…
Marvell and Cavium to Combine Creating an Infrastructure Solutions Powerhouse
Andes and Imperas Partner to Deliver Models and Virtual Platforms for Andes RISC-V Cores
Embedded Tools provider Ashling joins RISC-V Foundation
Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents
MEDIA ALERT: efabless to Present RISC-V Workshop Talk on Creating Mixed-Signal ASIC Using Open Source…
EnSilica’s RADAR Imaging Co-processor addresses problem of automotive data overload to accelerate …
MediaTek Launches New Chipset to Accelerate the Growth of NB-IoT
Osram’s New LED Chip Factory Goes into Operation in Kulim
Avnet Showcases Complete System Approach for Embedded Vision in Vietnam
Renesas Electronics and SEGGER Collaborate to Support Customers with emWin GUI for RX65N/RX651 MCUs
Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification…
Barco Silex VC-2 HQ compression cores at the heart of IMAGENICS 4K HDMI-over-coax extender
Sequitur Labs Inc. and NXP Collaborate to Simplify Edge IoT Security
Broadcom Announces Industry’s First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking…
Microsemi Announces IEEE 1588 Timing Synchronization Module Providing High Performance Network Clock…
Kilopass Achieves 1000-Hour Qualification on Mie Fujitsu Semiconductor Highly Demanded 40nm Low Power…
GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card
Inside Secure Joins RISC-V Foundation
UltraSoC selected by Microsemi for growing RISC-V product range
ArterisIP Drives Artificial Intelligence & Machine Learning Innovation for 15 Chip Companies
MEDIA ALERT: efabless to Present RISC-V Workshop Talk on Creating Mixed-Signal ASIC Using Open Source…
Synapse Design Acquires Tech Vulcan to Address Fast Growth and Provide Increased Customer Access to …
AT&T Approves Altair's ALT1210 LTE-M Chipset on IoT Network
AMD EPYC™ Processor Powers New HPE Gen10 Server to World Records in SPEC CPU® Benchmarks
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HPE Extends Industry Leading ProLiant Gen10 Portfolio to Deliver Breakthrough Economics in Server Vi…
TowerJazz Broadens Green Initiatives in its Specialty Analog Foundry Business by Increasing Renewable…
Socionext Starts Offering Graphics IP "SEERIS"
S3 Semiconductors Expands Sales Rep Network
Rambus Announces Pricing of $150 Million Convertible Senior Notes Offering
Spin Transfer Technologies Announces Allowance of U.S. Patent For Next-Gen MRAM
Open-Silicon Expands Networking IP Portfolio to Address High-Bandwidth Ethernet Endpoint and Ethernet…
Broadcom Completes Acquisition of Brocade Communications Systems
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
Huawei Unveils Xilinx FPGA-Powered Cloud Server to North America at SC17
STMicroelectronics : Statement from STMicroelectronics, following Moody's upgrade to Baa3
Applied Materials Delivers All-Time Record Performance
Mercury Systems Launches 6U OpenVPX Module with Dual NVIDIA Pascal GPUs
The Industry’s First Noise-Tolerant Opamps from ROHM
Intel IoT Group's Revenue Hits Record, Renewing Interest in the Sector
Faraday Unveils M1+ Library with Enhanced Routability on UMC 28HPC Process
Enyx Premieres the First TCP and UDP Offload Engines for Intel Stratix 10 FPGA On REFLEX CES XpressGXS10-FH200G…
GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solut…
Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC
TSMC October 2017 Revenue Report
iPhone X Costs Apple $370 in Materials, IHS Markit Teardown Reveals
Barco Silex Partners with Intrinsic ID for North American Representation
Power Efficient Implementation of CommSolid’s CSN130 NB-IoT IP Solution Supported by Zephyr RTOS
Inside Secure Unveils Industry’s First Root-of-Trust Solution based on RISC-V Processor
MACOM Reports Fiscal Fourth Quarter and Fiscal Year 2017 Financial Results
Neonode zForce AIR™ Touch Sensors Available Globally from Digi-Key
NI Announces Industry’s First PXI Chassis with 58 W of Power and Cooling Per Slot
Analog Bits to Provide Precision PLL and SERDES IP to DesignShare for SiFive Freedom Platform
IXYS Introduces a New 6kV Rectifier with Record Current Rating for Ultra-High Power Applications
BOXX Introduces AMD EPYC™ Deep Learning Server and Other Solutions at SC17
Next-Generation Smart Objects Can Do More and Consume Less with New STM32L4+ Microcontrollers Series…
SMIC Reports 2017 Third Quarter Results
Microsemi Announces Adaptec Smart Storage Adapter Support for Cavium ThunderX2 ARM-Based CPUs
SiTune Offers Production Samples of Industry's First Tuner Supporting Japan's 8K TV Satellite Standa…
Growth in automotive brings videantis third Deloitte Technology Fast 50 award
EasyIC announces it is now a member of the Xilinx Alliance Program
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Spectral Edge appoints new CTO, accelerating development of smartphone imaging technology
Veriest announces expansion in Europe
MoSys, Inc. Reports Third Quarter 2017 Financial Results
InterDigital Issues Revenue Guidance for Fourth Quarter 2017
Renesas Electronics Delivers Advanced Security for Industrial Internet of Things With Enhanced RX65N/RX651…
Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV…
Broadcom Remains Fully Committed to Acquisition of Qualcomm
CCIX Consortium to Showcase First Industry Demonstration of CCIX at SC17 Conference
Qualcomm Board of Directors Unanimously Rejects Broadcom's Unsolicited Proposal
Supermicro Showcases Industry's Most Advanced and Optimized NVIDIA GPU Systems at SC17
Cavium and Leading Partners to Showcase ThunderX2™ Arm-based Server Platforms and FastLinQ® Ethernet…
Inscopix and ON Semiconductor collaborate to advance brain mapping technology
AMD Delivers ‘Supercomputing for All’ at SC17 with AMD EPYC™ and AMD Radeon Instinct™ High-Performance…
Micron Solutions, Inc. Reports 2017 Third Quarter Results
Micron Advances Persistent Memory with 32GB NVDIMM
Rescale’s Turnkey Cloud HPC Platform Now Offers NVIDIA Tesla V100 GPU With NVLink
Cray Catapults Arm-Based Processors Into Supercomputing
RISC-V Ecosystem Surpasses 100 Members Globally, Paving the Way for the Next 50 Years of Computing Design…
Lattice Semiconductor Reports Third Quarter 2017 Results
Inside Secure acquires SypherMedia to boost its Silicon IP business and root-of-trust offering
Intellifusion Licenses ArterisIP FlexNoC Interconnect IP for Machine Learning and Visual Intelligence…
FLEX LOGIX NAMES FAN MO TECHNICAL DIRECTOR OF FPGA CAD SOFTWARE DEVELOPMENT
Microsemi Reports Fourth Quarter and Fiscal Year 2017 Results
Three-Phase Half-Bridge Gate Driver from Diodes Incorporated Simplifies BLDC and PMSM Motor Drive
Groundbreaking Image Sensor from ON Semiconductor Enables Next-Generation ADAS Solution
BOXX Introduces Next Generation Workstation with 8th Gen Intel at Autodesk University
Semtech’s Wireless and Sensing Solutions Enhance Next-Gen Wearable Technologies
Advanced Wireless-Charging Chip from STMicroelectronics Enables Faster Charging of Smartphones and T…
GCT Semiconductor LTE Advanced Pro 4.75G Single Chip Powers NEC Platforms Mobile Router
Algo-Logic Systems Demonstrates Scale-Out Machine Learning and Real-time Inference Accelerated by FPGA…
Renesas Electronics supports HIPERFACE DSL® Digital Encoder Interface with RZ/T1 Solution
ChipMOS REPORTS THIRD QUARTER 2017 RESULTS
UMC Reports Sales for October 2017
Alpha and Omega Semiconductor Announces Shield Gate Technology Generation 2 100V 3.6mOhm MOSFET for …
Qualcomm Datacenter Technologies Announces Commercial Shipment of Qualcomm Centriq 2400 - The World's…
QuickLogic Reports Fiscal 2017 Third Quarter Results
Toshiba and Newisys Deliver HPC Storage with NVMe-oF at SuperComputing 2017
Texas Instruments offers 25 functions for 25 cents with new MSP430™ microcontrollers
Intersil Delivers Space Industry's First Radiation-Hardened Quad Power Supply Sequencers
Cavium ThunderX2 Motherboard Specification for Microsoft's Project Olympus Contributed to the Open Compute…
ISSI Introduces AEC-Q100 Qualified 512Mb SPI NOR Flash for Automotive & Industrial Markets
Renesas Electronics Supports HIPERFACE DSL® Digital Encoder Interface With RZ/T1 Solution
Xilinx Announces Intention to Invest $40M in Expansion of Research, Development, and Engineering Operations…
Hardent Delivers Interoperable VESA DSC IP Solution for the New Arm Mali-D71 Processor
Diodes Incorporated Reports Third Quarter 2017 Financial Results
SiFive and eMemory Bring Embedded Memory to the DesignShare Economy to Accelerate Development of RISC-V…
MegaChips Unveils Breakthrough 16nm Analog ASIC for 5G and Other High-Speed Applications
Velodyne LiDAR Launches VLS-128™, The World’s Highest Resolution LiDAR for Autonomous Vehicles
TowerJazz Reports Increase in Net Profit
Mercury Systems Announces Safety Certifiable Graphics for Xilinx Zynq UltraScale+ MPSoC
Xilinx Announces Appointment of Two New Directors
UltraSoC embedded analytics selected by ELVEES for video, security and safety applications across ARM…
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC China OIP Ecosystem…
FADU Completes Verification of next generation NVMe eSSD using S2C’s Prodigy™ Virtex UltraScale …
Broadcom Proposes to Acquire Qualcomm for $70.00 per Share in Cash and Stock in Transaction Valued at…
Skyworks Exceeds Q4 FY17 Expectations
Orbotech Outlines Plan for Revenues in Excess of $1.25B Driving Non-GAAP Net Income Margin to 21-23%…
MagnaChip Offers 0.35 micron 700V Ultra-High Voltage Process Technology with Process Simplification
AMD Delivers Semi-Custom Graphics Chip For New Intel Processor
Keysight Technologies’ Corporate Headquarters Operational After Northern California Fires
ON Semiconductor Reports Third Quarter 2017 Results
Intrinsic ID Signs Agreement with Open Security Research for China Representation
TRUECHIP ANNOUNCES FIRST CUSTOMER SHIPMENT OF USB 3.2 VERIFICATION IP
Online BOM calculator simplifies costing process for IIoT custom ICs
Guardtime and Intrinsic ID Awarded Dutch Government Contract for Distributed Energy Marketplace via …
Vidatronic Announces Flexsupply™ Family of Switched-Capacitor DC-DC Converter IP Cores
Tablet Market Declines 5.4% in Third Quarter Despite 4 of Top 5 Vendors Showing Positive Year-over-Year…
ACM Research Announces Pricing of Initial Public Offering
Motorola Solutions Reports Third-Quarter 2017 Financial Results
Broadcom Limited Updates Fourth Quarter Fiscal Year 2017 Revenue Outlook  
Teledyne Technologies Reports Third Quarter Results
PRO DESIGN Announces Partnership with AcconSys as New Distributor in China and Hong Kong for its proFPGA…
Renesas Electronics Reports Third Quarter 2017 Financial Results
2017 Annual Creativity in Electronics Awards Announces Finalists from Leading Companies, Design Teams,…
Cavium Announces Financial Results for Q3 2017
Inphi Corporation Selects Velocity CAE Design-to-Test Tools from Alliance ATE with Multi-Year Commit…
MACOM to Showcase its Industry Leading GaN-on-Silicon Portfolio and High-Performance MMICs and Diodes…
Orbotech Reports Third Quarter 2017 Results
CEVA, Inc. Announces Third Quarter 2017 Financial Results
Flex Logix to Provide Embedded FPGA IP to 'DesignShare' for SiFive Freedom Platform
DecaWave Deploys Synopsys TetraMAX II ATPG on Latest Automotive Design to Lower Test Time 50 Percent…
Synopsys 2017 Coverity Scan Report Finds Significant Adoption of Secure Practices in OSS Projects
TowerJazz and YuanChen Microelectronics Announce Partnership for Backside Illumination (BSI) Manufacturing…
Intel Enables 5G, NFV and Data Centers with High-Performance, High-Density ARM-based Intel Stratix 10…
PCI-SIG Releases PCIe® 4.0, Version 1.0
asicNorth announces immediate availability of its IoT Endpoint ASIC Platform
New ASIL-B Ready ISO 26262 Certified VESA DSC IP Cores Launched by Hardent
Global Semiconductor Industry Posts Highest-Ever Quarterly Sales
Amkor Technology Reports Financial Results for the Third Quarter 2017
Analog Devices Co-Founder and Chairman Ray Stata Bestowed with GSA’s Highest Honor
Astronics Test Systems Announces Expansion of System-Level Test (SLT) Platform for Semiconductor Tes…
UMC Obtains LEED Gold Certification for Fab 12X
UltraSoC appoints Alberto Sangiovanni-Vincentelli as Chairman
HEVC Advance Announces Revised Royalty Rates for Lower-Priced Devices
BrainChip Ships First BrainChip Accelerator To a Major European Car Maker for Evaluation in ADAS and…
It’s Here: A Common Industry Framework for Protecting a Trillion Connected Devices
90% Reduction in power consumption for RFID chips with Dolphin Integration’s SESAME eLC standard cell…
MACOM Announces Successful Divestiture of AppliedMicro’s Compute Business
Open Innovations 2017: Digital Economy, Top Speakers, Challenges Of Global Transformation
First Ultrasound-on-a-Chip receives broadest FDA 510(k) clearance
New 2.3Mp CMOS Digital Image Sensor from ON Semiconductor is First to Combine 1080p Resolution with …
Microsemi to Acquire High Performance Timing Business of Vectron International from Knowles Corp.
Monolithic Power Systems Announces Results for the Third Quarter Ended September 30, 2017
Data I/O Reports Third Quarter 2017 Results
Cypress Reports Third Quarter 2017 Results
Power Integrations Reports Third-Quarter Financial Results
National Instruments Reports Record Revenue for a Third Quarter of $321 Million
Neonode zForce AIR™ Touch Sensors Available Globally from Digi-Key
InterDigital Announces Financial Results for Third Quarter 2017
NetSpeed and UltraSoC Partner to Accelerate Development Time for Complex SoCs
Cypress Technology Helps DENSO’s Latest Automotive Stereo Vision Sensor Improve Vehicle Safety
Cabot Microelectronics Corporation Reports Record Results for Fourth Quarter and Full Fiscal Year 20…
Toshiba Electronic Devices & Storage Corporation Contributions Make Toshiba the Winner of the 2017 MIPI…
Mixel's MIPI C-PHY/D-PHY Combo IP is Silicon-Proven in Multiple Nodes
Xylon Presents New Modular Video Logger
OVH launches Acceleration-as-a-Service Leveraging the New Intel® Programmable Acceleration Card and…
ArterisIP Acquires iNoCs Software and Associated Intellectual Property Rights
Express Logic’s X-Ware IoT Platform™ to Bring Industrial Grade Connectivity to Thread® Networked…
STMicroelectronics Reports 2017 Third Quarter and Nine Months Financial Results
NVIDIA Launches AI Cloud Container Registry to Accelerate Deep Learning, Volta GPUs Debut on Amazon …
NXP Semiconductors Reports Third Quarter 2017 Results
Teradyne Reports Third Quarter 2017 Results
Xilinx Announces Second Quarter 2018 Results; Eighth Consecutive Quarter Of Revenue Growth
Winbond Introduces TrustME Secure Flash Memory Aligned with Platform Security Architecture from Arm
FCI Selects IAR Embedded Workbench as the Preferred Toolchain for New Low-power Wi-Fi IoT SoC Platfo…
ON Semiconductor Introduces World’s First Highly Scalable Family of Next-Generation Automotive Image…
Sonics And Moortec Partner To Provide Temperature-Compensated DVFS Capability For SoC And MCU Design…
Green Hills Software Announces INTEGRITY Solutions for the Xilinx Zynq UltraScale+ MPSoC
Renesas Synergy™ Platform Revs Up Ecosystem Growth Engine
MIPI Alliance Announces 2017 Membership Award Winners
Silicon Labs Announces Third Quarter 2017 Results
Microsemi's New SyncServer S80 NTP Network Time Server Delivers Precise, Secure Time Stamps for Physical…
UMC Reports Third Quarter 2017 Results
Seoul Semiconductor Achieves Record Quarterly Revenue and Aims for Record Earnings in Fiscal Year 20…
eMemory Unveils Auto-Grade EEPROM IP with over 500K Cycle Endurance
Fairview Microwave Introduces High-Performance USB-Controlled PLL Synthesizers for Test and Measurement…
Inside Secure brings to market industry’s only complete and fully-certified cloud-based mobile payment…
TSMC Reports Third Quarter EPS of NT$3.47
CEVA and Brodmann17 Partner to Deliver 20 Times more AI Performance for Edge Devices
Achronix Speedcore Custom Blocks Supercharge Data Acceleration Systems
sureCore Joins GLOBALFOUNDRIES FDXcelerator™ Partner Program
TI reports 3Q17 financial results and shareholder returns
AMD Reports Third Quarter 2017 Financial Results
IAR Systems and Secure Thingz Collaborate for Easier IoT Security Implementation
IAR Systems Provides Unique Line-up of Complete Development Tools for Arm
Express Logic’s X-Ware IoT Platform™ to Bring Industrial Grade Connectivity to Thread® Networked…
NI Announces New PXI FlexRIO Architecture With Xilinx Kintex UltraScale Technology
Flex Logix Demonstrates Flexible Microcontroller At Arm TechCon
Lauterbach and SiFive Bring TRACE32 Support for High-Performance RISC-V Cores
STMicroelectronics Announces Class-Leading Water-Resistant Pressure Sensor and First Design Win in High-Performance…
InvenSense MEMS Microphones Showcased in Synaptics AudioSmart® Solution at 2017 TDK Sensors Developers…
Renesas Electronics America Enables Innovation at the Edge at Arm® TechCon 2017
Renesas Electronics and ASTC Accelerate Software Development for Smart Cameras With Virtual Platform…
Orbotech Revolutionizes the AOI Room with 4-in-1 AOI Solution
Fast Processor Models of Latest Arm Cores Released by Imperas and Open Virtual Platforms (OVP)
CENTRI Announces Immediate Availability of IoT Advanced Security for the Arm Mbed IoT Device Platfor…
CEVA and LG Electronics Partner for Smart 3D Camera Solution
Gartner Says Worldwide Device Shipments Will Increase 2 Percent in 2018, Reaching Highest Year-Over-Year…
MIPI Alliance Announces Milestones in Membership Growth and Industry Influence
NXP and Metanoia Collaborate on Broadband Access Solutions
Sale of Toshiba Memory Corporation Approved by Toshiba's Shareholders
New Powerful HD Wi-Fi Video Module from Amp'ed RF
STMicroelectronics' STM32H7 Series MCU Leverages the New Platform Security Architecture from Arm to …
GSI Technology, Inc. to Present at the In-Memory Computing Summit
Andes 32-bit CPU IP Cores Implemented on GLOBALFOUNDRIES 22FDX(R) Process Technology
TI enables designers to achieve a new low in standby power
UnitySC Expands; Opens U.S. Office With Global Software Development Center and Customer Demo Lab
TDK Announces Worldwide Availability of the Industry’s First 7-Axis Motion and Pressure Sensor
CODASIP HIRES IP INDUSTRY VETERAN CHRIS JONES AS VICE PRESIDENT OF MARKETING
Dr. Haijun Zhao, Dr. Liang Mong Song Appointed as SMIC Co-CEO and Executive Director
TSMC Senior Vice President Dr. Stephen Tso to Retire
Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance…
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