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ADF India Agendas Set and Registration Is Open
Media Alert: Cadence to Showcase System-Level Integration of Electronic/Photonic Devices at the Photonics…
IEEE System Test Access Management Study Group CFP
"Accelerating Simulation of Vivado Designs with HES" by Krzysztof Szczur, Hardware Verification Products…
Agenda Is Set and Registration Is Open for ADF 2017 Korea
Intel Showcases Application of AI for Space Research at NASA FDL Event
Mouser Electronics Recognized with Top Awards for Excellence from Its Supplier Partners
Zuken USA Announces Dates for Zuken Innovation World 2018
Flexera’s Changing the Software Asset Management Game – Reducing the Risk and Waste of Buying and…
DVCon U.S. 2018: Call for Tutorial, Panel and Short Workshop Proposals
Mouser Electronics and Grant Imahara Explore Vertical Farming in Shaping Smarter Cities Series
New Application Note Explains How to Design a Modified Three-Level Doherty Amplifier Using NI AWR So…
Synopsys Posts Financial Results for Third Quarter Fiscal Year 2017
MEDIA ALERT: OneSpin Solutions Heads to China, Korea for CDNLive
Mentor announces first annual FloTHERM Award for electronics thermal design excellence
Flexible Hybrid Electronics & Sensors Impacting the Automotive Industry
"The value of software" by Colin Walls
"Diversity: Really, who cares" by Peggy Aycinena
Three Creative Engineering Teams Win the Design Automation Conference’s Inaugural International Hardware…
IC Insights Bulletin: DRAM, NAND Flash, Automotive Analog/Logic Among Best-Growing ICs
EnSilica boosts SoC design and supply services with two senior-level appointments
SEMI Europe Supports Call for Action on European Manufacturing Policy
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Silego Announces Shipping More Than 3 Billion Configurable Mixed-signal ICs
SiFive and Rambus to Provide IP to the 'DesignShare' Economy
TowerJazz and Tacoma Announce a Partnership for a New 8-inch Fabrication Facility in Nanjing, China
Wave Computing CTO to Present Details of its Dataflow Technology at HOT CHIPS Symposium
New 8th Gen Intel Core Processors: Simplifying Today, Opening the Door for What’s Next
Sankalp Semiconductor awarded with ISO 9001: 2015 certification
Uniquify Announces Silicon Success for Latest Timing Controller (T-CON) for DTV
MediaTek selects MIPS for LTE modems
Runtime Awarded Outstanding Contributor by Open Connectivity Foundation (OCF)
Pallidus Announces M-SiC™ Technology
Toshiba Announces New CMOS LDO Voltage Regulators
JSC introduces Industry's Fastest Serial interface OctaRAM combining with MXIC OctaFlash
RISC-V Foundation to Showcase Growth of New Architecture at Hot Chips 29
SiFive Appoints Naveed Sherwani as CEO
Achronix to Attend HOT CHIPS: A Symposium on High Performance Chips
Cypress Streamlines Wireless Design for Smart Home Applications with Addition of iCloud Support to IoT…
Micron Advances Semiconductor Research & Development Capabilities with New Boise Facility
TowerJazz Announces DENSO Corporation utilized its Advanced 0.18um SiGe Technology to Develop a 24GHz…
EnSilica and Solomon Systech in Multi-Year eSi-RISC Licensing Deal
Everspin Announces Sampling of the World’s First 1-Gigabit MRAM Product
Maxim Power Corp. Announces 2017 Second Quarter Financial and Operating Results
NVIDIA Announces Financial Results for Second Quarter Fiscal 2018
Semiconductor Pioneer George Perlegos Honored With Lifetime Achievement Award
Cavium Announces Support for FC-NVMe Standard
IXYS Introduces a Smart Single Pole SSR with Thermal Shutdown and Current Limiting Capabilities
Qorvo® Lowers Telecom Infrastructure Costs with New Power-Efficient GaN-on-SiC Amplifier
AMD Launches the Highest-Performance Desktop Processor, Ever, with Ryzen™ Threadripper™ High End…
ChipMOS REPORTS SECOND QUARTER 2017 RESULTS
Toshiba Wins Most Innovative Flash Memory Technology Award at Flash Memory Summit 2017
Silicon Labs' Radio Solution Solves Automotive Industry Challenge of Scaling Price Points and Perfor…
ISSI Introduces AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Markets
Supermicro Previews 1U Petabyte NVMe Storage System Supporting New "Ruler" Form Factor for Intel® SSDs…
GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud…
TowerJazz to Provide Advanced RF and High Performance Analog Solutions for the Fast Growing Automotive…
Palma Ceia Announces Complete PHY Solution for HaLow 802.11ah, Supporting IoT WiFi Connectivity
Avery Design Systems Announces NVMe 1.3 and NVMe-MI Verification IP Updates
UMC Reports Sales for July 2017
MaxLinear, Inc. Announces Second Quarter 2017 Financial Results
Spectra7 Announces Record Financial Results for the Second Quarter of 2017
Samsung Introduces Far-Reaching V-NAND Memory Solutions to Tackle Data Processing and Storage Challe…
Benefit from the Power of the Latest SystemVerilog Subset Constructs – with Confidence
Pixelworks Reports Second Quarter 2017 Financial Results
Diodes Incorporated Reports Second Quarter 2017 Financial Results
Cirrus Logic Voice Capture Development Kit for Alexa Voice Service (AVS) Available Exclusively through…
Access Data at the Speed of Now with Micron’s New Flagship NVMe Solid-State Storage Family
DENSO licenses Imagination’s newest MIPS CPU and PowerVR GPU to drive enhanced in-vehicle electronic…
CNEX Labs Achieves Industry-First 1.5 Million IOPS NVMe SSD Performance Featuring Toshiba Memory Corporation…
Media Alert: New 8th Gen Intel Core Processor Family to Debut Aug. 21
CNEX Labs Partners with Microsoft to Boost Storage Performance for the Cloud with Open-Channel SSDs
IntelliProp Announces Gen-Z Persistent Memory Controller Combining DRAM and NAND
Cavium Demonstrates Breakthrough NVMe over Fabrics Performance at Flash Memory Summit 2017
Broadcom Showcases NVMe Technology Firsts with Industry’s Most Comprehensive NVMe over Fabrics Adapter…
Intel Completes Tender Offer for Mobileye
Toshiba Announces Next Generation Client SSD with 64-Layer 3D Flash Memory
Solarflare Demonstrates New Storage Fabric That Stays True to Ethernet: NVMe™ over TCP
SMIC Reports 2017 Second Quarter Results
Microsemi Collaboration Enables Mellanox and Other Industry Leaders to Deliver Innovative NVMe-oF Ar…
Toshiba Memory Corporation Unveils SATA Client SSD Utilizing 64-Layer, 3D Flash Memory
Global Unichip Achieves SGS-TUV ISO26262 Certification
Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017
UltraSoC delivers industry’s first debug and analytics solution for ARM’s AMBA 5 CHI Issue B coherency…
Vidatronic Contributes Expertise to AMD’s Latest High-Performance Processors
Moortec Semiconductor announces new sales representatives in Japan
Power Integrations and Future Electronics Sign Worldwide Distribution Agreement
MEDIA ALERT: Flash Memory Summit Gold Sponsor Mobiveil to Demonstrate FPGA-Based SSD Platform, LDPC-based…
Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and…
Toshiba Announces NVMe over Fabrics Software Technology for Cloud Data Centers
Silicom's FPGA Momentum Builds: Design Win from Long-term Strategic Customer
Mie Fujitsu and SST Announce Automotive Platform Development on 40nm Technology
Toshiba Memory Corporation Introduces World’s First* Enterprise-Class SSDs with 64-Layer 3D Flash …
AgigA Tech to Showcase NVDIMM Technology at 2017 Flash Memory Summit
Everspin Announces Production Release of 1 and 2 Gigabyte nvNITRO NVMe SSDs
Everspin Demonstrates Breakthrough Technologies at FMS 2017
Askey Computer Selects Sequans’ LTE-Advanced Chipset to Design Broadband Wireless Access Devices
Microsemi Accelerates the Industry's Transition to Enterprise PCIe SSDs With Production Release of its…
Advantest to Debut New Solid-State-Drive Testers and Present Technical Papers at Flash Memory Summit,…
INVECAS Acquires Lattice’s HDMI Design Team and Simplay Labs Subsidiary
Azul Systems Collaborates with Qualcomm to Bring Enterprise-Grade Open Source Java on ARM to Datacen…
Sierraware makes Global Platform compliant Trusted Execution Environment (TEE) available for MIPS-based…
Bluetooth SIG Announces Mesh Networking Capability
Blue Pearl Software Streamlines RTL Verification for Xilinx All Programmable FPGAs and SoCs
Renesas Electronics’ R-Car SoC Accelerates Development of In-Vehicle Infotainment Applications With…
ON Semiconductor Reports Second Quarter 2017 Results
Semtech’s ClearEdge™ CDR Platforms Enter Full Production for Low-Cost 25G SFP28 SR Modules and Active…
Integrated 3U VPX VideoPaC Enhances Graphics Processing in Dense Computing Applications
MagnaChip Reports Second Quarter 2017 Financial Results
Microchip Technology Announces Record Net Sales and Earnings for First Quarter of Fiscal Year 2018
inTEST Reports 2017 Second Quarter Financial Results
Mobiveil Announces FPGA-Based SSD Platform for 3D NAND Flash Devices, Upgrades NVMe, PCI Express Controllers…
Motorola Solutions Reports Second-Quarter 2017 Financial Results
Broadcom’s Industry-Leading Data Center SoC Delivers Breakthrough Performance & Efficiency for Smart…
TE Connectivity Debuts ChipConnect Cable Assemblies
GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance…
Toshiba Unveils Single Package SSDs with 64-Layer 3D Flash Memory
Microsemi Announces New Switchtec PAX Advanced Fabric PCIe Switch to Accelerate Evolution of Hyperconverged…
CEVA, Inc. Announces Second Quarter 2017 Financial Results
Camtek Announces Second Quarter 2017 Results
Teledyne Technologies Reports Second Quarter Results
TowerJazz Announces Records in Revenues, Margins, EBITDA and Free Cash Flow for the Second Quarter and…
Update on Toshiba Memory Corporation's Investment in Production Equipment for Fab 6 at Yokkaichi Ope…
Toshiba Memory Corporation Unveils Single Package NVMeTM Client SSD Utilizing 64-Layer, 3D Flash Mem…
NXP Semiconductors Reports Second Quarter 2017 Results
Cavium Announces Financial Results for Q2 2017
FormFactor, Inc. Reports Second Quarter Results
Pixelworks Completes Acquisition of ViXS Systems
TI introduces most affordable way to get started with DLP® Pico™ display technology
Power Integrations and Casambi Technologies Showcase Color-Adjustable Smart Lighting Reference Desig…
MACOM Reports Fiscal Third Quarter 2017 Financial Results
Mobileye Announces Satisfaction of Antitrust Clearance Condition for Tender Offer By Intel
Crossbar to Showcase ReRAM in Action at Flash Memory Summit
Molex Debuts zSFP+ Interconnect System for 56 Gbps Channels
c3PR Helps Promex Promote Innovative IC Packaging and Heterogeneous Assembly Solutions for Complex Microelectronics…
Advantest Extends its Solid-State-Drive Test Solutions with Enhancements to MPT3000 Platform
Silicon Motion Announces Results for the Period Ended June 30, 2017
NVIDIA Supercharges Rendering Performance with AI
NVIDIA External GPUs Bring New Creative Power to Millions of Artists and Designers
IDT Reports Fiscal 2018 Q1 Financial Results
Analog Devices Joins University of Michigan’s Mcity Initiative for Advancing Connected and Autonomous…
Seventh NVM Express Plugfest Ushers in Next Wave of NVMe and NVMe-MI Devices
Industry’s First Dual-Mode LED Driver with Programmable Emergency Light Levels Offers OEMs Greater…
Intel Extends Cash Tender Offer for All Outstanding Shares of Mobileye
ON Semiconductor Wins 2017 IoT Evolution Product of the Year Award
Truechip-Moving Towards 10 Years of Successfulness
USB 3.0 Promoter Group Announces USB 3.2 Update
Sankalp Semiconductor to hire 300 engineers
Updated logiADAK-VDF Video Framework
Enhanced Open Source Framework Available for Parallel Programming on Embedded Multicore Devices
AMD Redefines the Enthusiast Gaming Experience with Radeon™ RX Vega and Radeon™ Packs
InterDigital Joins 5TONIC Lab
Ultimate Boost for High-End Desktop Market With Aug. 10 Availability of 16- and 12-Core Ryzen™ Threadripper™…
Samsung’s New LTE Modem Technology Supports Industry-First 6CA, Delivering Fast and Seamless Mobile…
SII Semiconductor Corporation Introduces a New 2-to-3-Cell Secondary Battery Protection IC for Rechargeable…
Advanced Semiconductor Engineering, Inc. Reports Unaudited Consolidated Financial Results for the Second…
Renesas Electronics Reports Second Quarter 2017 Financial Results
Renesas Electronics Announces Consolidated Forecasts for the Nine Months Ending September 30, 2017
Microsemi Reports Third Quarter 2017 Results
Cypress Reports Second Quarter 2017 Results
National Instruments Reports Record Revenue for a Second Quarter of $319 Million
Power Integrations Reports Second-Quarter Financial Results
Toshiba Introduces New 20V MOSFETs with Low On-Resistance Specifications
OVH and Accelize Demonstrate the Value of FPGAs in the Cloud with GZIP Compression, from CAST, Achieving…
AMD Completes Ryzen Mainstream Desktop Lineup with the Release of Ryzen 3 processors
InterDigital Announces Financial Results for Second Quarter 2017
Toshiba Introduces TR200 SATA Retail SSD Series With 64-Layer 3D Flash Memory
Teradyne Reports Strong Revenue and Earnings Growth in Second Quarter and First Half 2017
Xilinx Sales Grow For 7th Consecutive Quarter; Advanced Product Sales Up 33% Year-Over-Year
Monolithic Power Systems Announces Results for the Second Quarter Ended June 30, 2017
Synaptics Closes Acquisition of Conexant Systems
Maxim's PMICs Offer Hearables Lowest Standby Power and High Efficiency at Less Than 1/2 the Size…
DENSO Selects Cypress’ Automotive MCUs and Flash Memories to Enable Sophisticated Graphics in 2017…
Silicon Labs Announces Record Revenue in Second Quarter 2017
UMC Reports Second Quarter 2017 Results
Toshiba's Visconti™4 Image Recognition Processor Powers DENSO's Front-Camera-Based Active Safety S…
STMicroelectronics Reports 2017 Second Quarter and First Half Financial Results
TI reports 2Q17 financial results and shareholder returns
AMD Reports Second Quarter 2017 Financial Results
Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applic…
I2R Nanowave Announces New High Power Broadband Amplifier
Maxim's Dual Channel Transceiver Adopted by Omron for IO-Link Sensor Applications
Cavium Expands XPliant® Product Portfolio with 10GbE and 25GbE Optimized Programmable Switch Device…
Toshiba NVMe SSDs Now Available with Lenovo’s New ThinkSystem and ThinkAgile Servers
Rambus Reports Second Quarter 2017 Financial Results
Intel Editorial: The Road to Our Driverless Future Runs Straight Through the City
Inside Secure Announces New High-Performance 400G MAC Layer Security (MACsec) IP for Datacenters and…
Marvell Debuts Industry's First Secure Automotive Gigabit Ethernet Switch
Intel® CEO Brian Krzanich to Deliver Grand Keynote Address at InterDrone 2017
Advantest’s New Massively Parallel Test Fixture Extends the T6391 System’s Capabilities to Include…
FLEX LOGIX’S EFLX EMBEDDED FPGA ACCELERATES PROCESSOR PERFORMANCE BY 40-100X
HDL Design House and AFuzion Synergy to Enhance DO-254 Projects
S2C Prodigy Quad Virtex® UltraScale FPGA Prototyping Logic Module Now Available for Large Scale Des…
A LARGE RANGE OF SPONSORED IPS AT 55 NM ARE NOW AVAILABLE TO REDUCE SOC POWER CONSUMPTION BY UP TO 7…
Maxim Integrated Reports Results For The Fourth Quarter Of Fiscal 2017, Increases Dividend By 9%
Renesas Electronics’ R-Car Support for cocoro SB “Emotion Engine” Enables Cars to Read Driver's…
Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic…
IXYS Releases 250V Ultra-Junction X3-Class Power MOSFETs Offering Best-in-Class On-State Resistance …
NXP Announces Production of Security Chips in its US Manufacturing Facilities
First Sequans-Powered Huawei LTE-M Module Now Available
Camtek Announces Definitive Agreement to Sell its PCB Business for up to $35 Million
STMicroelectronics Comments on False Media Speculation
Richardson Electronics Reports Fourth Quarter Fiscal 2017 Results and Declares Quarterly Cash Divid…
Aehr Test Systems Reports 30% Revenue Growth for Fiscal Year 2017 and Provides Financial Guidance for…
EIZO Announces Industry-First Rugged DisplayPort Video Format Converters for GPU Users Supporting Multiple…
Arrow Electronics to Help Accelerate the Growth of Internet of Things in Asia-Pacific with its Offerings…
Toshiba Wins a Stay for Temporary Restraining Order on Toshiba's Database Shutdown to Western Digita…
Gartner Says Worldwide Semiconductor Revenue to Reach $400 Billion in 2017
Toshiba Bluetooth Low Energy Product Lineup Supports New Bluetooth Mesh Standard
Silicon Labs' Bluetooth Mesh Solution Helps IoT Developers Cut Time to Market by Six Months
Macronix Launches AEC-Q100 Full Compliant NAND Flash Memory
TI introduces single-chip buck-boost battery charge controllers enabling USB Type-C™ and USB Power…
Microsemi and Tamba Collaborate on New PolarFire Devices to Deliver Industry-Leading Low Power FPGA-Based…
STMicroelectronics Partners with Kilopass For One-Time Programmable Anti-Fuse NVM Memory
GUC Opens New Korea Office
Faraday Monthly Consolidated Sales Report – June 2017
Veriest Solutions and CEVA Collaborate for Neural Network Signal Processing IP Project
TSMC Reports Second Quarter EPS of NT$2.56
Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development…
Toshiba Updates on the Preliminary Injunctive Relief Brought by Western Digital
Renesas Electronics Wins Patent Infringement Lawsuit Filed by Zond LLC
MagnaChip Selected as Foundry Partner by ELAN Microelectronics For World's First Fingerprint Sensor …
Green Hills Software INTEGRITY-178 tuMP Multicore Operating System Selected by Commercial & Military…
NGCODEC JOINS THE ALLIANCE FOR OPEN MEDIA
200mm Fabs Thriving; SEMI’s Updated 200mm Fab Report Now Available
TSMC June 2017 Revenue Report
THE FASTEST C-COMPILER FOR I251 IS NOW AVAILABLE WITH OUR FREE DISCOVERY LICENSE!
GUC Monthly Sales Report - June 2017
Western Digital’s SanDisk Subsidiaries Obtain Court Protection Against Toshiba in Preliminary Injunction…
GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks
Imagination announces MIPSfpga 2.0: a comprehensive set of materials for teaching CPU architecture
efabless Launches Open Source Hardware Development Framework for IC Designs
Micro-Power Voltage Detector from Diodes Incorporated Monitors Power Supplies in Computers and Digital…
Sigma Designs to offer HDR10+ in STV7803/4 UHD HDR Chipsets
Faraday Unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD Controller
VeriSilicon’s Vivante Vision Processor IP Enables ADAS for Mass Market
Xcerra Ships the 600th PAx Test System for Testing RF Front End Devices
Toshiba Introduces ESD Protection Diodes for High-Speed Interfaces in Mobile Devices
UMC Reports Sales for June 2017
ChipMOS REPORTS JUNE 2017 AND 2Q17 REVENUE
Video Series "New Product Discoveries with Randall Restle" Launched by Digi-Key for the Engineering …
Brian Rubow honored with other SEMI Standards leaders at SEMICON West 2017
PDF Solutions Adds Complete Device Traceability and Process Data Collection Through Assembly and Test…
IBM to Launch the Next Generation Intel® Xeon® Scalable Processors in the Cloud
Microsemi Expands Broad Clock Management Fanout Buffer Product Line With Seven New Devices
Viking Technology Ships Industry's Highest Capacity 50TB Solid State Drive
Supermicro Launches New X11 Family of Server and Storage Solutions Combining Breakthrough NVMe Performance…
RSF Elektronik Launches the MC 15 Encoder
Intersil Ships Automotive Industry's First Full HD LCD Video Processor
Alpha and Omega Semiconductor Debuts High Performance HV MOSFET αMOS5™ Platform
Aehr Test Systems to Showcase its FOX-XP™ Next Generation Test and Burn-in Systems at SEMICON West…
Helix Semiconductors' New eMpower HS100 Chipset Now Sampling
Intel Unveils Powerful Intel® Xeon® Scalable Processors, Bringing Next-Generation Business and Consumer…
Toshiba Memory Corporation Develops World's First 3D Flash Memory with TSV Technology
Orbotech's SPTS Technologies' Sigma® fxP PVD Solution Selected for imec's 3D System Integration Pro…
200mm Fabs Thriving; SEMI’s Updated 200mm Fab Report Now Available
Foresight announces sale of IoT technology business Simulity Labs Limited
AppoTech Ltd. Selects Andes Technology Corporation N968A CPU For Its Next Generation Audio Codec
Advanced Semiconductor Engineering, Inc. Announces Monthly Net Revenues
Flexera CEO Jim Ryan to Discuss Software Asset Management & the Dysfunctional Software Supply Chain …
Baidu Deploys Xilinx FPGAs in New Public Cloud Acceleration Services
Spectra7 Microsystems Inc. Announces Closing of $4.6 Million Bought Deal Financing and First Tranche…
eVaderis Joins FDXcelerator Program to Deliver Memory IP to GLOBALFOUNDRIES 22FDX Technology Platfor…
Perceptia Devices Appoints Vector and SMC as its Korean Representatives
ARM and Hyper Team to Bring Secure Container for IoT, Edge and 5G
New Smart Gate Driver Photocoupler from Toshiba Features Improved Desaturation Sensing Function
Qualcomm Files Patent Infringement Complaints Against Apple with International Trade Commission and …
IAR Systems Eases Development for Industrial Applications Based on Renesas' EC-1
NXP and Widex Bring Industry’s Most Power-efficient, Wireless Audio Streaming Hearing Aids to Mar…
Toshiba to Start Mass Production of ApP Lite™ Processor Family IC for Wearable Applications
Semblant Unveils New CircuitShield® Semiconductor Technology
Cypress Announces Settlement Agreement with T.J. Rodgers
Picosun's ALD Technology Gives a Boost to GaN Devices
Mitel Completes Acquisition of Toshiba Unified Communications Systems Business Assets
ViXS Systems Inc. Files Information Circular for Proposed Acquisition by Pixelworks, Inc.
TDK Showcases New Features of AFM 15 Flip Chip GGI Die Bonder at SEMICON West 2017
NVIDIA, Baidu Announce Partnership to Accelerate AI
ams Extends Magnetic Position Sensors Portfolio with Automotive-Grade and ISO26262 Safety-Compliant …
Spintrac Systems Books Repeat Order for Custom-Designed Photoresist Coater Tractrix™ System
Toshiba's Opposition to Motion for Preliminary Injunctive Relief Brought by Western Digital Is Now Available…
eASIC Recognizes Growth in Demand From China and Establishes eASIC Shenzhen WFOE
Argon Design joins AOM
Tessera Receives Favorable Notice of Initial Determination in Broadcom ITC Investigation
Intel FPGA Technology Supports NEC in Face Recognition Technology
MPEG LA Introduces License for EVS
Sanechips (ZTE Microelectronics) Licenses CEVA-X1 IoT Processor for NB-IoT Connected Devices
Calculus Capital invests in Blu Wireless Technology
Express Logic’s FileX® File Management System Certified For Use in Safety-Critical Embedded Systems…
Teledyne e2v delivers first space-grade commercial processors to Thales Alenia Space for use in a European…
Toshiba Launches Gate Driver Photocoupler with 2.5A Peak Output Housed in Low-height Package
Micron Technology, Inc., Reports Results for the Third Quarter of Fiscal 2017
ROHM’s Automated Machine Health Monitoring Solution
Semblant Unveils New CircuitShield(R) Semiconductor Technology and Latest Advancements in Protective…
Cypress and Arrow Electronic Announce IoT Development Platform Designed to Bring World-Class Wireless…
Sanmina Expands Its Technology Center in Southern California
Cypress Extends Scalability of Automotive MCU Portfolio with New Series for Secure, High-Speed Networking…
Thermo Fisher Scientific Adds Three New Products to Leading Semiconductor Portfolio
ON Semiconductor And PowerSphyr Announce Agreement To Accelerate Development Of Universally Compatible…
Microsemi Announces General Availability of Engineering Samples for its Lowest Power, Cost-Optimized…
Toshiba Launches CMOS Operational Amplifier with Industry-Leading Low Noise
STMicroelectronics and Security Platform Inc. to Combine Security Expertise for Safe, Trusted, and Easy-to-Use…
Peregrine Semiconductor's RF Switches Enable "Smart" Tuning in Monarch Antenna's New Prototype -- a …
Silicon Labs Launches Industry's Lowest Jitter Any-Frequency Crystal Oscillators
Next-Generation Bluetooth Low Energy Chip from STMicroelectronics Boosts the Boom of Connected Smart…
Winbond Introduces First Very-Low-Voltage Flash Memories
Exosite Collaboration with ARM Provides Secure, Full-Stack IoT Solution
Renesas Electronics America Expands Support for Linux HMI Application Development With New RZ/G Micr…
Qualcomm Snapdragon 450 Mobile Platform to Bring 14nm FinFET Process, Enhanced Dual-Camera Support and…
Qualcomm Announces Cutting-Edge Wearables Platform Supporting LTE IoT Categories M1 and NB1 for Next…
Qualcomm Delivers Premium Wi-Fi Experience with 2x2 11ac Wi-Fi Technology
Toshiba Develops World's First QLC BiCS FLASH 3D Memory with 4-Bit-Per-Cell Technology
Qualcomm Automotive Platforms Selected to Power Next Generation Infotainment for Fast-Growing Chinese…
Toshiba Memory Corporation Develops World's First QLC 3D Flash Memory
Toshiba Memory Corporation Announces 96-Layer 3D Flash Memory
Toshiba Files Lawsuit Against Western Digital Corporation
VeriSilicon Unveils Vivante 2 Teraflop “MESH” Architecture Compute IP Cores for Embedded Devices…
IC Insights Bulletin: Nonstop CMOS Image Sensor Sales Records Seen Through 2021
Cadence Elects Maggie Wilderotter to Board of Directors
Optomec Showcases Aerosol Jet Systems for 3D Printed Electronics at Sensors Expo
New MCU software eliminates an FPGA to achieve a sub-1 microsecond current loop in industrial system…
SolidRun Unveils the First ARM Based COM Express Type 7 Module for Enterprise and Telco Networking S…
Cavium Unveils Industry's Most Advanced 10/25/40/50Gbps Ethernet NIC Family
AMD Launches the World’s Fastest Graphics Card for Machine Learning Development and Advanced Visualization…
Lattice Semiconductor Delivers New Machine Learning and Sensor-to-Cloud Security Solutions for Intelligence…
New Enhancements to Microsemi's Imaging/Video Solution Enable Customers to Leverage Company's Low Power…
Advantest Introduces New T5822 System for Cost-Efficient, Wafer-Level Testing of Mixed Semiconductor…
Authentico Technologies and Intrinsic ID Announce Partnership to Develop Next-Generation Database Se…
Arastu Systems announces LPDDR3/4 Single Controller for optimal performance
SiTime Expands Global Presence with Opening of Netherlands Office
ICE-P3 EPU Integrates Temperature-Compensated Voltage And Frequency Control For Maximum Energy Savin…
ArterisIP and ResilTech Announce Strategic Partnership to Facilitate ISO 26262 Compliance for Complex…
UltraSoC announces industry’s first processor trace support for RISC-V
Sankalp Semiconductor announces availability of 16nm IO Libraries
GUC Successfully Rolls out HBM2 Total Solution
Rambus Launches JEDEC-Standard DDR4 NVRCD for Emerging NVDIMM Applications
Qiwo Chooses QuickLogic EOS S3 Multi-Core SoC for Voice Enabled Bluetooth Headset Designs
XYS Integrated Circuits Division Introduces a New Low Cost Dual 5A Gate Driver IC
Faraday Strives for MFP ASIC Development, Shipment Grew at a CAGR of 38%
Toshiba Adds Dual-Sided Cooling to Power MOSFETs for Motor Control, Power Supplies
Imagination announces extension of MIPS collaboration agreement with Sequans
Allwinner Technology Releases A63 High-Performance Tablet Processor
Sidense Exhibiting 1T-NVM Memory for Smart Connected Applications at Sensors Expo and Conference
IAR Systems Supports ARM DesignStart Program With Highly Optimizing and Reliable Development Tools
NXP and HARMAN Extend Partnership for Connected Car of the Future
Advantest Introduces Wave Scale MX Channel Card to Meet Testing Requirements for High-Resolution Converters,…
ARM CEO Simon Segars Joins SoftBank Group Board of Directors
AMD EPYC™ Datacenter Processor Launches with Record-Setting Performance, Optimized Platforms, and …
Silex Technology Introduces its Latest 802.11ac SDIO Wi-Fi System-in-Package (SiP)
Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process…
Eta Compute Announces New Reference Design for EtaCore™ ARM Cortex-M3™, the World’s Lowest Power…
NUMERIK JENA Develops Two New Absolute Linear Encoders With Small Size and Several Interface Options…
INTEMPORA Unveils RTMaps Embedded. A New Step Further Towards the Development of Autonomous Vehicles…
Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery
Barco Silex extends crypto offering with Chacha20/Poly1305 authenticated encryption
Andes Technology and M31 Technology Collaborated on Optimal Power Efficiency CPU Implementation for …
Arasan Announces Advanced Process Nodes for High Performance SD Card UHS-II Physical Layer Interface…
New Supermicro X11 SuperBlade® Boosts I/O Performance Featuring Intel® Omni-Path Fabric
Inspur Unveiled GX4, A New Flexible and High Scalability AI Accelerating Box at ISC 2017
Truechip Collaborates With OmniPhy for Verification of PCIe Gen4 IP Solution
Andes Technology Provides System Control Processor IP for Wave Computing's Revolutionary Dataflow Processing…
MagnaChip to Offer 0.13 micron BCD Process Technology with High-Density Embedded Flash
Truechip Announces First Customer Shipment of Ethernet 400G/200G VIP
GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC…
WPG Americas Inc. Announces Partnership with Lattice Semiconductor Corporation
Shanghai Frequen Licenses and Deploys CEVA Bluetooth Low Energy IP in New IoT Product Line
QuickLogic Establishes Wholly Foreign Owned Enterprise in China
Cypress Discloses Final Settlement Proposal to Resolve Proxy Context with T.J. Rodgers and CypressFi…
SEMI Europe Applauds New Semiconductor Manufacturing Investment
ARM, Enea, Marvell and PicoCluster announce world’s most compact OPNFV Pharos Lab
QuickLogic Taps Semiconductor Intellectual Property Veteran for Advisory Board
HDL Design House to Exhibit at DAC as ARM Approved Design Partner
UEFI FORUM APPOINTS ARM TO BOARD OF DIRECTORS FORTIFYING ITS COMMITMENTS TO FIRMWARE INNOVATION
Silab Tech Announces Release of XGS-PON SERDES IP Core
Analog Devices Reaches LTC Integration Milestone; Announces Senior Executive Team
Avery Design Systems Unveils MIPI I3C VIP Targeting Sensors in Smartphone, IoT, Automotive Designs
Qualcomm Receives Antitrust Clearance by the Taiwan Fair Trade Commission for NXP Semiconductors Acq…
IXYS Announces an Advanced GaAs/AlGaAs pHEMT MMIC High Power Amplifier for Wireless 4G/5G Infrastructure…
Samsung Ramps up 64-Layer V-NAND Memory Production to Accommodate Expanding Line-up of High-Performance…
Leti Announces Two New Tools for Improving Transportation Comfort, Safety and Efficiency
Anritsu Company Introduces OBSAI RF Analysis Capability for Handheld Analyzers to Create Comprehensive…
Intel Announces Approval Under Israel Restrictive Trade Practices Law for Proposed Acquisition of Mo…
MEDIA ALERT: Mobiveil to Exhibit at DAC in Avery Design Systems' Booth, Showcasing Portfolio of IP, …
Imagination launches the MIPS I6500-F, CPU IP designed for safety critical systems in an autonomous …
MEDIA ALERT: Andes Technology Presents its New 64-bit NX25 at DAC, the First RISC-V Implementation with…
Avery Design Systems Unveils DDR5 VIP Solution Targeting DDR5 Design Ecosystem
ReFLEX CES Partners with Orthogone Technologies to Provide Integrated Ethernet MAC/PCS IP Core Solutions…
Endgame Delivers First Converged Endpoint Protection Platform with Natural Language Understanding; Increases…
Broadcom Delivers High Performance Data Plane Programmability with new Trident 3 Generation of 10/25/100G…
Achronix Revenues to Grow 700% YoY and Exceed $100M in 2017
Advantest Ships 5,000th V93000 System to Address the Diverse Needs of Testing Mixed-Signal ICs
UMC Restructures Executive Team
Materials Accelerating Innovation at SEMI Strategic Materials Conference
Qualcomm Announces Highly Flexible Smart Speaker Platform with Unique Combination of Support for Voice…
II-VI Incorporated Introduces Acousto-optic Q-switch Modules for Diode Pumped Solid State Lasers
Media Alert: QuickLogic to Present at DAC 2017
Marvell Introduces Industry's First Wi-Fi, Bluetooth 5 and 802.11p Combo Solutions for Vehicle-to-Everything…
Maxim's Automotive LED Controller Eliminates Trade-Off Between Fast Response Time and Low EMI for Exterior…
GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks
GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology
eSilicon at DAC 2017: 2.5D/HBM2 FinFET ASIC & IP Solutions for High-Bandwidth Networking, Computing,…
Toshiba Expands Portfolio of Security Solutions with Addition of Mobile Zero Client and Smart Data Encryption…
Toshiba Announces Availability of New 14-Inch Tecra Laptop, Adds Thunderbolt™ 3 Dock and USB-C Adapters…
Rice Electronics Launches Connected Worker Solution with Intel® IoT Technology
Molex Micro-Fit TPA Receptacles and Cable Assemblies Eliminate Assembly Errors and Prevent Back-Outs…
Valens Introduces HDBaseT-IP Solution with New VSI1000 Chipset
TSMC May 2017 Revenue Report
MediaTek Announces Ultra HD TV SoC Supporting Dolby Vision and Hybrid Log Gamma (HLG)
SiTime Enables Industrial IoT Applications with Smallest, Lowest-Power, Precision MEMS Reference Clo…
Cypress Executive Chairman Ray Bingham Steps Down from Board
BT, Intercede and Imagination collaborate on IoT security
Renesas Electronics Announces Determination of Selling Price and Other Matters
TSMC Promotes Dave Keller to President, TSMC North America
Global Semiconductor Sales Increase 21 Percent Year-to-Year in April; Double-Digit Annual Growth Projected…
Record fab spending for 2017 and 2018
SEMI reports record quarterly billings of $13.1B
Rambus Appoints Emiko Higashi to Its Board of Directors
ChipMOS REPORTS MAY 2017 REVENUE
UMC Reports Sales for May 2017
ELSYS Eastern Europe Selected as ARM Approved Design Partner
Magewell to Launch Low-Power M.2 Capture Cards for OEM Applications at InfoComm 2017
Cadence Design Systems Corporate Senior Vice President & CFO, Geoff Ribar, to Present at Nasdaq 36th…
Valens Announces Availability of VA6000 Automotive Chipset for the Ultimate Infotainment Experience
STMicroelectronics Standardizes on Synopsys VC Formal for Faster Verification Closure of Leading Microcontroller…
AnaGlobe Technology Will Introduce Major Upgrades at the Design Automation Conference
Maxim's Dual IO-Link® Master Transceiver Ensures Robust Communications with 50% Lower Power for Industry…
InterDigital and Panasonic Mobile Communications Renew Their 4G Patent License
Uniquify's LPDDR4 Super Combo Interface IP in Volume Production at 28nm Low-power Node
Advanced Semiconductor Engineering, Inc. Announces Monthly Net Revenues
VeriSilicon’s Artificial Intelligence Engine Powers Multi-Sensory Experiences in NXP’s i.MX 8 Flagship…
Excellicon’s comprehensive timing constraints solution results in continued business growth for 2017…
NXP Releases the Industry’s Highest Power Density for RF LDMOS in Avionics
Sigma Designs, Inc. Reports First Quarter Fiscal Year 2018 Financial Results
MACOM Demonstrates “RF Energy Toolkit”: Accelerates Customers’ Time-to-Market with High Performance,…
Anokiwave Introduces World's First 39 GHz Silicon 5G Active Antenna ICs at IMS2017
Silego Introduces Next "Flexible Power Islands" Device with Low Drop-out Regulators
Peregrine Semiconductor Introduces High-Power Receiver Protection RF Switch
ON Semiconductor Improves Imaging Performance for High Resolution Industrial Applications
New family of Texas Instruments SoCs drives down cost of multi-protocol industrial Ethernet communic…
Toshiba Introduces New Photocouplers for Automotive Applications
Cypress Enables USB-C Proliferation in Notebook and Desktop PCs with Market's First Two-port USB-C Controller…
Media Alert: Cadence to Showcase System Design Enablement Innovations at DAC 2017
Lattice Semiconductor Introduces Ultra HD Wireless Solution to Deliver Blu-ray Quality Video
Keysight Technologies Selected by Qualcomm for 5G Test Solutions
Analog Devices Lays Foundation for 4G to 5G Migration with Expanded RadioVerse™ Wireless Technology…
NI Announces Baseband Model of Second-Generation Vector Signal Transceiver to Address the Most Demanding…
Lattice Semiconductor to Showcase Its Smart Connectivity Solutions at CES Asia 2017
EnSilica develops sureCore’s new, Ultra-Low Power IoT reference platform
Cadence Design Systems Corporate Vice President Finance & Controller to Present at Baird 2017 Global…
Harvard Researchers Select Flex Logix's Embedded FPGA Technology To Design Deep Learning SoCs
17th Annual Chip Camp Includes a New Focus on Virtual Reality for 2017
Achronix to exhibit at the Design Automation Conference in Austin, Texas
Intrinsyc Announces Hardware Development Kit Featuring Qualcomm(R) Snapdragon 835 Mobile Platform, Providing…
Analog Devices’ Wideband GaN MMIC Amplifier Offers High Gain, Power and Efficiency in Compact Desi…
Lattice Semiconductor’s ECP5™ FPGA Enables Energy-Efficient Embedded Vision Systems at the Edge
Microsemi Expands MMIC Portfolio with New Family of Wideband Plastic Packaged and Bare Die GaAs MMIC…
Spectrum Instrumentation announces industry-leading, five-year warranty for its products
Comprehensive Lifetime Prediction for ICs in all Design Environments
ALTAIR SEMICONDUCTOR EMPLOYS SONICS’ NoC TO INTEGRATE BASEBAND IC OF ALT1250 IOT LTE CHIPSET
Atomic Rules announces DPDK-aware FPGA/GPP data mover
Programmable Battery Charger IPs For SoC Applications
Sankalp Semiconductor to Exhibit at DAC 2017
Western Digital Responds to Toshiba Statement Related to NAND Flash-Memory Joint Ventures
German Court Denies Broadcom Bid to Stay Invensas Patent Infringement Injunction
Delaware Court Rules Against Cypress Board Again and Orders a Delay of its Annual Meeting of Stockho…
STMicroelectronics and ZTE Team to Promote LoRa Technology and Applications in China
Toshiba’s Newly Developed Fully Isolated N-channel LDMOS Realizes High HBM Robustness and High Breakdown…
PLDA at the Epicenter of PCIe® 4.0 Wave of Adoption with Recent PCIe Design Conference Achievements…
Future Electronics and Maxim Integrated Sign Distribution Agreement
CAST Adds DO-254 Avionics Interface Cores Through New Partnership with Nolam
EDA pioneer Alberto Sangiovanni-Vincentelli joins UltraSoC advisory board
Qorvo® Enables Next-Generation 5G Wireless with First 39GHz Dual-Channel GaN FEM
Microsemi and Intrinsic ID Collaboration Delivers SRAM-PUF in PolarFire FPGAs, Providing Advanced Se…
NEC introduces its latest release of CyberWorkBench® C-to-RTL design tool at DAC, booth #1520 June …
Faraday Announces the World's First Automotive ASIC Qualified for AEC-Q100 and AEC-Q006
Toshiba Launches 4-channel H-bridge Motor Driver IC with Maximum Ratings of 40V and 3.5A
NXP Turns up the Volume with Industry’s First 12-Volt Smart Amplifier to Deliver Rich, Elevated Sound…
Marvell Introduces Industry's First 2.5 and 5 Gbps Octal Ethernet Transceiver
Cypress Streamlines the Design of Next-Generation USB-C Power Adapters and Chargers with New, Highly-Integrated…
Cadence Announces VirtualBridge Adapter for Palladium Z1 Emulator to Accelerate Software Bring-Up Time…
Fresco Logic and STMicroelectronics Co-Develop a Complete USB Power Delivery 3.0 TPCP/TPCM Solution
Flex Logix Delivers High-Performance, High-Density Embedded FPGA For Deep Learning, Data Center and …
TI enables the widest bandwidth and lowest phase noise for next-generation high-speed systems
Analog Devices Reports Second Quarter 2017 Results
TI Collaborates with HEIDENHAIN to Incorporate EnDat Interface in the Industry's First Industrial Drive…
QuickLogic Announces New EOS S3 Voice Barge-in Feature
QuickLogic Establishes eFPGA Support Center to Accelerate IP Licensing Model
MediaTek Launches Next Generation Wi-Fi Chipset Portfolio for IoT to Enhance Smart Home and Office D…
Toshiba's New ICs for Bluetooth® Smart Devices Offer the Industry's Lowest Class Current Consumption…
Analogix Introduces ANX7447 Family of USB-C Single-Chip Port Controllers With Power Delivery Version…
Co-founder and Chairman Ray Stata Accepts IEEE Award Recognizing Analog Devices for Innovation and Industry…
MediaTek Launches MT7622, World's First 4x4 802.11n/Bluetooth 5.0 System-on-Chip with Dedicated Network…
New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Bo…
Cypress Expands Industry-leading Wireless Connectivity Portfolio for the Internet of Things with New…
New high-speed cameras feature Camera Link interface and industry-leading SONY and ON-Semi image sen…
Diodes Incorporated Introduces World’s First Power Switch to Fully Support USB Type-C Power Delivery…
Renesas Electronics Delivers R9J02G012 Controller That Enables Device-to-Device Authentication in Support…
Toshiba Unveils NVMe SSDs Using 64-Layer, 3D Flash Memory
Microsemi Delivers AcuEdge Development Kit for Amazon Alexa Voice Service
Magewell to Introduce Versatile 12G-SDI 4K Capture Card at InfoComm 2017
Design and Performance Perfected: NVIDIA Introduces Max-Q for Gaming Laptops
Qualcomm Unveils Mesh Networking Platform and Reference Design to Usher Next Era of Whole-Home Conne…
UltraSoC attracts fresh investment as technology industry recognizes huge potential for embedded int…
Perceptia Joins GlobalFoundries FDXcelerator™ Program to Bring PLL Technology to Portable Devices
CypressFirst Comments On Latest Admissions In Third Cypress Semiconductor Disclosure
GIGABYTE Technology Announces Expansion of their ARM Server Portfolio based on Cavium's ThunderX2™…
Ingrasys Enables High Performance Computing and Hyperscale Workloads with New Class of Server Platforms…
Cavium FastLinQ® Ethernet Adopted by Major ODMs for Next-Generation Cloud and Telco Datacenters
Intrinsic ID Announces SPARTAN Authentication Family for IoT Device Security
ISRAEL’S VAYYAR IMAGING LICENSES SONICS NoC FOR USE IN 3D SENSOR CHIPS
New SHA-3 hashing IP from Barco Silex helps customers implement future-proof security
IPrium releases 40G LDPC I.6 Encoder/Decoder for DWDM systems
A NEW GENERATION OF 32-KHZ OSCILLATORS FOR IOT AND WEARABLE APPLICATIONS
Toshiba Unveils NVMe™ SSDs Using 64-Layer, 3D Flash Memory
Marvell Technology Group Ltd. Reports First Quarter of Fiscal Year 2018 Financial Results
Sensory and ARM Processors Enabling AI at the Edge
IXYS Introduces New 2.2kV, 5370A Fast Thyristor with Record Current Rating and 35% Better than Present…
StratEdge Expands CMC Base Laminate Packages to Include High-Power GaN Transistors & MMIC Devices
Toshiba Launches High Voltage Intelligent Power Device with 600V and 5A Rating
Toshiba Tec Unveils World's First Monochrome Multi-function Peripheral with Erasable Print Capabilit…
Cadence Custom/Analog, Digital and Signoff Tools Achieve Certification on Samsung 28FDS Process Tech…
Cadence Digital, Signoff and Custom/Analog Tools Enabled on Samsung's 7LPP and 8LPP Process Technolo…
Samsung Set to Lead the Future of Foundry With Comprehensive Process Roadmap Down to 4nm
Humavox and Asahi Kasei Microdevices Present New Health Tracking and Wireless Charging Chip for Wear…
Helix Semiconductors Opens Advanced Technology Design Center
Qualcomm Continues Inspiring Underrepresented Students to Explore STEM Education by Expanding the Reach…
Leti to Demo World’s First Wireless UNB Transceiver that Enables Apps for ‘Massive Internet of T…
T&VS Awarded Place On The UK Government G-Cloud 9 Procurement Framework To Provide Cloud Support Ser…
RFEL's Wideband Channeliser - ChannelCore Flex -- now available on the Ettus USRP X310 Platform
New Open Virtual Platforms Processor Models for ARM, Imagination Technologies, RISC-V and Renesas Accelerate…
Pasternack Expands Broadband Limiting Amplifier Line with New Models
Supermicro Announces Sample Systems Based on Upcoming Intel® Xeon® Processor Scalable Family
SST Announces Qualification of Smartbit™ OTP NVM Technology for ON Semiconductor’s 110 nm CMOS P…
Teledyne DALSA Releases its Best-in-Class CMOS Line Scan Sensors for Sale
Sidense SHF Memory Macros Target IoT and Other Very Low Power Applications in TSMC's 40ULP Process
Qualcomm Fuels IoT Growth by Currently Delivering More Than 1 Million Chips a Day into a Wide Range …
TI introduces the industry's smallest gate driver and power MOSFET solution for motor control
GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China
TDK Completes Acquisition of InvenSense
First Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record…
Moortec to exhibit at DAC 2017 in Austin
Alma Technologies Introduces an Online Tool for Comparison of Image Compression Standards as Implemented…
Amkor Technology Completes Acquisition of NANIUM
Astronics Test Systems Introduces New PXI Integration Platform
Keysight Technologies Enables Developers to Characterize Broadband Millimeter-Wave Designs with Greater…
NXP Licenses Advanced TMR Sensor Technology From Crocus
Analog Devices’ Small Isolated Gate Drivers Deliver Solutions for Next Generation Power Switch Tec…
New Cypress Evaluation Kit Enables Simplified Design that Leverages Solar Power to Drive a Wide Range…
Leti will demo world’s-first WVGA 10-µm pitch GaN microdisplays for augmented reality at Display …
ARM and CSNE from the University of Washington partner to develop brain-implantable chips
Novatek Reduces TV Boot Time with Data Decompression IP Core from CAST
Faraday Introduces UrLib+™ Add-on Library on UMC 40LP Process
Worldwide Semiconductor Revenue Grew 2.6 Percent in 2016, According to Final Results by Gartner
LIVE WEBINAR: HOW TO GET AN SOC POWER CONSUMPTION UNDER 0.5 µA IN SLEEP MODE
SiFive Unveils the first RISC-V-based Arduino Board at Maker Faire Bay Area
Toshiba's Low Power Consumption Photocoupler Achieves High Speed Communication in Automotive Applica…
Rambus and Cybertrust Partner to Secure Connected Devices
Qualcomm Demonstrates Dynamic Electric Vehicle Charging
Fairview Microwave Releases New Series of 1.0mm Flexible VNA Test Cables that Operate up to 110 GHz
Tektronix Raises the Standard for Isolated Measurements
ActiveState® Collaborates with Intel to Offer Intel® Math Kernel Library (Intel® MKL) Performance-Optimizations…
AirTies and Broadcom Form Strategic Alliance to Deliver Managed Wi-Fi Mesh Solutions to Service Providers…
Xilinx Invests in Machine Learning Pioneer DeePhi Tech
Toshiba Launches Smart Gate Driver Photocoupler with Improved Desaturation Sensing Function
MediaTek Launches Chipset Supporting the Google Assistant and Android Things
Maxim's Himalaya Step-Down DC-DC Converters Enable Rapid Compliance of Safety Standards for Industrial…
Xilinx Announces Integration of 56G PAM4 Transceiver Technology into its Virtex UltraScale+ FPGAs
Microsemi and Analog Devices Collaborate on Scalable SiC MOSFET Driver Solutions to Accelerate Customer…
Qualcomm Files Breach of Contract Complaint against Apple's Manufacturers for Non-Payment of Royalti…
TowerJazz Announces Annual Technical Global Symposium (TGS) Events to be held in Europe, Japan, Korea…
Optimal+ IoT World Talk Navigates to Zero PPM for Automotive Semiconductors and Electronics
STMicroelectronics and Allystar to Cooperate on GNSS Applications and Solutions
Toshiba's SO6L Package IC Photocouplers Now Have Option for Wide Leadform
AMD Unveils Expanding Set of High-Performance Products and Technologies Propelling Next Phase of Gro…
AMD Raises Expectations for Server Performance, Unveils EPYC Processor Brand for the Datacenter
ROHM Expands Its Full SiC Power Module Lineup
ROHM Expands Its Full SiC Power Module Lineup
Compact, Efficient SCALE-iDriver™ IC Family from Power Integrations Supports 1700 V IGBTs
Rambus to Demonstrate CryptoManager IoT Device Management with STMicroelectronics
Avnet Unveils its ‘Smart Neighborhood’ at Internet of Things World
TI unveils the world's most precise single-chip millimeter wave sensor portfolio available today
Xilinx and IBM First to Double Interconnect Performance for Accelerated Cloud Computing with New PCI…
IXYS Introduces New 4.5kV Press-Pack IGBT with Record Current Rating and Record Power Density
inTEST Announces Death of Co-Founder and Executive Chairman, Alyn R. Holt
Gate Drivers from Diodes Incorporated Simplify the Switching of MOSFETs and IGBTs in Motors and Power…
1200V SiC Schottky Diodes from Littelfuse Are First Products from New Platform, Offer Lower Switching…
Renesas Electronics America Addresses Cybersecurity for Medical Device Design at MEDSec 2017
Akoustis Announces Its First 5.8GHz Single-Crystal Resonators For BAW RF Filters
Cypress Expands Long-term Collaboration with Bosch Automotive into Next Generation ADAS Platforms with…
Faraday Introduces UrLib+(TM) Add-on Library on UMC 40LP Process
Toshiba Expands Line-Up of Photorelays in DIP8 Packages by Adding Mid-Voltage Range Products
Wolfspeed Achieves Industry’s First All-SiC 1.2kV power Module Reliability Benchmark for Harsh Environment…
eMemory Taps into IoT Markets with its Game-Changing Security IP
Intersil Introduces Smallest Footprint and Highest Efficiency PMIC for Application Processors, GPUs,…
Sondrel Agrees to Acquire IMG Works Division of Imagination Technologies
IBM Scientists Use Lab-on-a-Chip Nanochannel Technology Designed to "Stretch" DNA to Help Detect Dis…
Media Alert: World’s Brightest Young Innovators Take Center Stage at the Intel International Science…
Renesas Electronics America Expands Renesas IoT Sandbox to Accelerate the Path from IoT Design Prototyping…
Cypress Sets the Record Straight on T.J. Rodgers' Misleading Allegations
Lattice Semiconductor to Showcase Its Smart Connectivity Solutions at CES Asia 2017
STMicroelectronics, IMECAS, and EPOCH Cooperate on Electric-Vehicle Battery-Management Systems
Bel Power Solutions Introduces the First-Ever AC-DC Power Supply Using Transphorm GaN FETs
Western Digital’s SanDisk Subsidiaries Initiate Arbitration with Toshiba in International Chamber …
Reactive Group acquires Arraid, a US-based legacy data storage specialist, and revamps products for …
Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology
TSMC April 2017 Revenue Report
Logic Fruit and Accelize Announce Strategic Partnership to deliver Next Gen IP cores
VESA Forms Special Interest Group Focused on Emergent Virtual and Augmented Reality Markets
Renesas Electronics Announces Consolidated Forecasts and Forecasts of Cash Dividends
Renesas Electronics Announces Absorption-Type Merger (Simplified/Short-Form Merger) with Consolidated…
Renesas Electronics Reports Financial Results for the First Quarter Ended March 31, 2017
Maxim Power Corp. Announces 2017 First Quarter Financial and Operating Results
Xilinx Debuts Industry-First P4_16 to FPGA Compilation and Introduces New P4-NetFPGA Workflow for Networking…
MYIR Released the Ultra Low-cost MYS-6ULX Single Board Computer
ON Semiconductor Highlights a Diverse Array of Pivotal Technologies at IoT World 2017
InterDigital Issues Revenue Guidance for Second Quarter 2017
RTI Presents "IoT Panel Webcast - Biggest IoT Security Threats and How to Address Them" Complimentary…
Pixelworks Unveils Third Generation Iris Display Processor for Smartphones and Tablets
Linear LED Drivers from Diodes Incorporated Increase Efficiency in LED Strips
ChipMOS REPORTS FIRST QUARTER 2017 RESULTS
QuickLogic Reports Fiscal 2017 First Quarter Results
Rambus Joins Microsemi’s SoC Partner Program
NVIDIA Launches Revolutionary Volta GPU Platform, Fueling Next Era of AI and High Performance Comput…
NVIDIA Advances AI Computing Revolution with New Volta-Based DGX Systems
NVIDIA Ushers in New Era of Robotics, with Breakthroughs Making It Easier to Build and Train Intelligent…
NVIDIA Launches GPU Cloud Platform to Simplify AI Development
NVIDIA and Toyota Collaborate to Accelerate Market Introduction of Autonomous Cars
Intel Editorial: Driverless Cars Need Assorted Processors, Like Golfers Need Many Clubs
Imagination announces first PowerVR Series8XT IP core based on new Furian GPU architecture
ON Semiconductor Showcases its Growing Strength in Power Semiconductor Technology at PCIM 2017
MACOM to Showcase Industry Leading RF and Microwave Portfolio at IMS 2017 in Honolulu, Hawaii
Algo-Logic Systems Launches Third Generation FPGA Accelerated CME Tick-To-Trade System
Toshiba Introduces 40V/45V N-Channel Power MOSFETs with Industry-Leading Low On-Resistance
Cypress' Four-Chip Dock Solution Brings USB-C Connectivity and Power Delivery to Samsung DeX
Micron Accelerates All-Flash Storage Speed, Performance and Value with New Flexible Petabyte-Scale Enterprise…
Coventor Launches CoventorMP 1.0, a New Unified Environment for Designing MEMS for IoT Devices
SMIC Transitions CEO Responsibility to Dr. Haijun Zhao While Dr. Tzu-Yin Chiu Stays as Vice Chairman…
SMIC Reports 2017 First Quarter Results
ChipMOS REPORTS APRIL 2017 REVENUE
Toshiba Adds 60V and 100V Products to High Current Photorelays with S-VSON4, the Industry's Smallest…
New “Thought Leadership Pass” Unlocks What’s Smart at SEMICON West 2017
Microchip Technology Announces Record Net Sales for Fourth Quarter and Fiscal Year 2017
MaxLinear, Inc. Announces First Quarter 2017 Financial Results
NVIDIA Announces Financial Results for First Quarter Fiscal 2018
Lattice Semiconductor Reports First Quarter 2017 Results
Diodes Incorporated Reports First Quarter 2017 Financial Results
Sonics And Northwest Logic Partner On High Throughput Memory Subsytem Solutions
Cavium QLogic Accelerates NVMe over Fabrics Adoption
Enea Adds Support for Xilinx Zynq UltraScale+ MPSoC Devices
Rambus to Showcase New Off-the-Shelf LED Light Guides at LIGHTFAIR International 2017
Analog Devices Chooses Anaqua for Intellectual Property Management
Microsemi and Aquantia Announce Production-Ready Multi-Rate Switch Reference Platform
Xilinx Spartan-7 FPGAs Now in Production
Seoul Semiconductor Introduces World’s Smallest 24W DC LED Drivers at LIGHTFAIR International 2017…
LED Engin Showcases its Versatile LuxiTune™ Family of Tunable Light Engines at LIGHTFAIR International…
Sankalp Semiconductor Strengthens Management Team
China Mobile, ARM, Cavium and Enea Sign Agreement for Cooperation in China Mobile Open NFV Testlab
Qualcomm Snapdragon 660 and 630 Mobile Platforms Drive Advanced Photography, Enhanced Gaming, Integrated…
UMC Reports Sales for April 2017
Falcon Computing Solutions Closes $8 Million Series B Round Led by Intel Capital
Teledyne LeCroy Introduces MIPI®M-PHY UniPro/UFS Protocol Analyzer/Exerciser
Credo Unveils Robust Portfolio of 56G and 112G PAM-4 PHY Connectivity Solutions
Toshiba Demonstrates Latest 64-Layer BiCS FLASH™ on Client NVM Express™ SSD at Dell EMC World
TowerJazz Reports First Quarter 2017 Results: Record Free Cash Flow Resulting from Strong Year over …
Advanced Semiconductor Engineering, Inc. Announces Monthly Net Revenues
ON Semiconductor Reports First Quarter 2017 Results
Aldec unveils the newest Xilinx Zynq-based TySOM Embedded Prototyping Board at Embedded Vision Summit…
Lattice Semiconductor Releases New Embedded Vision Development Kit Targeted for Mobile-Influenced Applications…
eASIC and Comcores Announce Support for CPRI V7.0
Cadence Unveils Industry’s First Neural Network DSP IP for Automotive, Surveillance, Drone and Mobile…
inTEST Reports 2017 First Quarter Financial Results
SiFive Launches CPU IP Industry into the Cloud with New RISC-V Cores and an Easy Online Business Mod…
Intel to Discuss Smart Home Technologies at CONNECTIONS(TM): The Premier Connected Home Conference
MIPI Alliance Forms Birds of a Feather Group to Define Embedded Security Considerations for Mobile and…
CypressFirst Releases New Investor Presentation
Teledyne Technologies Reports First Quarter Results
NXP Semiconductors Reports First Quarter 2017 Results
Achronix to Present at 6th RISC-V Workshop in Shanghai May 8-11, 2017
MagnaChip Reports First Quarter 2017 Financial Results
FormFactor, Inc. Reports First Quarter Results
Alpha and Omega Semiconductor Reports Financial Results for the Fiscal Third Quarter of 2017 Ended March 31,…
Intel Editorial: Intel Will Succeed in Autonomous Driving - I Bet My Career on It
Rambus Introduces Off-the-Shelf LED Light Guides
Alliance Memory Appoints TJ Mueller as Vice President of Marketing
Andes Technology Corporation Records a Cumulative 2.0 Billion SoC Shipments Containing Its CPU IP Since…
Micron Unleashes the Full Power of NVMe Storage, Unlocking Unused Capacity and Performance
Lattice Semiconductor to Release 1Q17 Financial Results on May 9
Mouser Electronics global distribution network picks up the Plessey ORION™ Beam Forming Module
Vishay Intertechnology Announces ‘Super 12’ Featured Products for 2017
Cadence Introduces First Interface and Verification IP Solution for CCIX to Advance New Class of Datacenter…
Toshiba Introduces Compact Photorelays with Improved Isolation Voltage of 3.75kV
50V MOSFET Gate-Driver ICs from Diodes Incorporated Address Demand for Driving Battery-Powered BLDC …
Toshiba Data Center SATA Solid State Drives Expand NetApp SolidFire All-Flash Array Offerings
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
IDT Introduces Family of SPDT Reflective RF Switches with Wide Frequency Range, Low Distortion, and …
Village Island, in partnership with NHK, simplifies 8K video transport and SDI cabling using TICO te…
Barco Silex and Intrinsic ID to Integrate Security Technology
FLIR Systems Announces Hiring of Chief Human Resources Officer
AMD Reports First Quarter 2017 Financial Results
ProTek Devices Intros Two Series of Automotive TVS Components for Circuit Protection
AVX Releases New MS Series MOS Capacitors for DC -- 20GHz Operation
Lattice Semiconductor Releases New Embedded Vision Development Kit Targeted for Mobile-Influenced Applications…
Renesas Electronics America, Intrinsic ID, and Medium One Introduce Complete Sensor-to-Cloud Platform…
Cadence Unveils Industry's First Neural Network DSP IP for Automotive, Surveillance, Drone and Mobile…
eASIC and Mobiveil Announce Flash Reliability Platform
NEURALA PATENTS ‘WHOLE BRAIN’ APPROACH TO AI, THE BASIS OF THE NEXT GENERATION OF AI
Visual Processors and CNN—the next generation supercomputer
DMP AI Processor IP “ZIA™ DV700” Enables AI at the Edge
CREONIC STARTS WIDEBAND SATELLITE INITIATIVE WITH LAUNCH OF NEW DVB-S2X IP CORES
Apple Continues to Improperly Interfere with Qualcomm's Agreements with Contract Manufacturers
Advanced Semiconductor Engineering, Inc. Reports Unaudited Consolidated Financial Results for the First…
Teledyne e2v granted two keynote presentations at China's Electronic Design Innovation Conference (EDI…
Creonic Starts Wideband Satellite Initiative with Launch of New DVB-S2X IP Cores
Cypress Reports First Quarter 2017 Results
Microsemi Reports Second Quarter 2017 Results
Amkor Technology Reports Financial Results for the First Quarter 2017
Power Integrations Reports First-Quarter Financial Results
National Instruments Reports Record Revenue for a First Quarter of $300 Million
Pixelworks Reports First Quarter 2017 Financial Results
Faraday Exhibits Total IP Solutions and IoT SoC Platform at ESC 2017
Micron Appoints Sanjay Mehrotra as President and Chief Executive Officer
Achronix Semiconductor Corporation joins Embedded Vision Alliance
MIPI Alliance Hosts First Plugfest for Companies Adopting MIPI I3C Sensor Interface Specification
Cabot Microelectronics Corporation Reports Strong Results for Second Quarter of Fiscal 2017
RISC-V Gains a Software Development Solution from Imperas
STMicroelectronics Reports 2017 First Quarter Financial Results
STMicroelectronics Appoints Jean-Marc Chery as Deputy CEO and Names new Executive Team
Imperas Software Selects eSOL TRINITY for Distribution Partnership in Japan
Teradyne Reports 6% Revenue Growth Year on Year in First Quarter 2017; Expects Sequential Revenue and…
Xilinx Sales Grow For 6th Consecutive Quarter; Dividend Raised For 12th Consecutive Year
Monolithic Power Systems Announces Results for the First Quarter Ended March 31, 2017
Teledyne LeCroy and Protocol Insight leverage expertise to address MIPI® M-PHY Gear4 for UniPro/UFS…
Automotive support and a new cache analyzer headline latest release of the SLX Tool Suite
MACOM Announces Wideband Low Noise Amplifier with Superior Noise Figure Performance Enabling Test and…
Silicon Labs Announces First Quarter 2017 Results
UMC Reports First Quarter 2017 Results
Swissbit: High-end flash memory solutions with outstanding US-customer support
Power Integrations and Weltrend Semiconductor Announce 18 W USB PD Rapid-Charger Reference Design for…
TI reports 1Q17 financial results and shareholder returns
MACOM Reports Fiscal Second Quarter 2017 Financial Results
ROHM's New Car Audio Sound Processor Supports High Resolution Sound Sources
The Electronic System Design Alliance Welcomes SoC Solutions as Newest Member
Imagination shatters price barriers to SoC embedded software development
T.J. Rodgers Files Lawsuit Against Cypress Semiconductor Board of Directors For False and Misleading…
Chroma Releases the Newest Semiconductor Test Solution
Micron and Microsoft Announce Collaboration to Help Improve Internet of Things Security
Analog Devices’ MEMS Accelerometers Deliver Compelling Noise Performance for Condition Monitoring …
Modular Design of New Aitech Remote I/O Unit Offers Fine-tuned Functionality for Aerospace and Defense…
Accelize Integrates Amazon EC2 F1 Instance into its QuickPlay/QuickStore Framework
CEVA, Inc. Appoints Ran Soffer as Vice President of Marketing and Corporate Development
Arastu Systems Ethernet 10G Digital Switch IP Soft Core for Time-Critical Applications
Inside Secure Partners With ContentArmor To Address Hollywood Studios’ Higher Security Requirements…
Cambricon Licenses Arteris FlexNoC Interconnect IP for Machine Learning SoCs
Imperas Presents at the Agile for Embedded Conference
Primecom Technologies, LLC Partners with Telairity for H.264/AVC Encoders
intoPIX Releases New TICO Encoder and Decoder Cores Supporting UHDTV2 and 8K up to 60fps
Maxim Integrated Reports Results For The Third Quarter Of Fiscal 2017
Avnet and Xilinx Expand Global Channel Relationship
Xilinx Delivers Broad Deployment of Dynamic Reconfiguration Technology
Xilinx Announces General Availability of Virtex UltraScale+ FPGAs in Amazon EC2 F1 Instances
Macronix MX25R Ultra Low Power QSPI Memory Selected by STMicroelectronics for New Low-Power STM32L4 …
NXP Semiconductors Divests Stake in Advanced Semiconductor Manufacturing Corporation Ltd.
Alpha and Omega Semiconductor Launches 5A EZBuck™ DC-DC Regulator with Ultra Pulse Energy Mode (U…
Broadcom Introduces First Fully Compliant TSN Ethernet Switch
New Silexica SLX Automotive Design Tools Feature Infineon TriCore Models
MACOM Expands 12.5Gbps Digital Crosspoint Offering with New Switch Family
Faraday Delivers V-by-One HS PHY & Controller IP on UMC 28HPC(U) Process
Toshiba's New Stepping Motor Driver IC Has an Anti-Stall Feedback Architecture
Samsung Completes Qualification of Its 2nd Generation 10nm Process Technology
FEKO Student Competition Now In Its 15th Year
Cypress Resolves Lawsuit Brought by Departed CEO T.J. Rodgers
Broadcom’s New 100G Ethernet Multi-host Controller Accelerates Machine Learning, NFV, and Enterprise…
The Industry's First DC/DC Converter Capable of DC Fan Motor Speed Control
CAST Becomes Member of ESD Alliance
Broadcom Ships World’s Fastest NVMe/SAS/SATA RAID Solutions to Server and External Storage OEMs
Molex Nano-Pitch I/O™ 8X Interconnect Increases Port Density and Speed
Toshiba Launches H Bridge Driver IC for Low-Voltage 2.5V Drive
Rambus Expands Cryogenic Memory Collaboration With Microsoft
SII Semiconductor Corporation Introduces a New Hall Effect Switch IC with Magnet Polarity Discrimina…
Toshiba Launches High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC
Moortec and UltraSoC collaborate to enable next-generation “smart” PVT sensors
Over 100,000 Wafers Embedded with eMemory’s NeoEE IP Shipped
Qualcomm Files Answer and Counterclaims to Apple Lawsuit
TSMC March 2017 Revenue Report
MEDIA ALERT: Visit Andes Technology at the SMIC Advanced Technology Workshop 2017
Pasternack Releases New Low Phase Noise Amplifiers from 1.5 GHz to 18 GHz
Digi-Key Seamlessly Integrates After Analog Devices and Linear Technology Acquisition
Hull Street Energy, LLC Completes Acquisition of Maxim Power (USA) Assets
Best-in-Class Active OR’ing MOSFET Controller from Diodes Incorporated Supports Power Supplies up …
UMC Files Form 20-F for 2016 with US Securities and Exchange Commission
Magewell to Unveil Powerful Video Input-Output Card Family at 2017 NAB Show
Aehr Test Systems Announces Pricing of Public Offering of Common Stock
TSMC Files Annual Report on Form 20-F for 2016
Toshiba Expands Line-up of ARM® Cortex®-M-Based Microcontrollers
Xilinx Announces Multi-Year Succession Plan and New COO
MACOM Announces Reference Design Supporting All Requirements for Next Generation CoaXPress 2.0 Stand…
Toshiba Launches Industry's Smallest 1.3A LDO Regulator
TowerJazz and Aisin Seiki Announce Mass Production of New Generation Automotive Body Products
ViXS Sells Legacy MoCA Business to MaxLinear, with IP License
Fuji Electric Expands Semiconductor Portfolio with Power Supply Control ICs
Seoul Semiconductor has filed a patent infringement lawsuit in Germany asserting infringement of its…
MACOM’s Portfolio, Collaborations and Experts are Leading the Way to 4K and Beyond at NAB 2017 in …
Eta Compute Debuts with World’s Lowest Power Microcontroller IP Targeting Energy Harvesting Segmen…
Worldwide Release of AMD Ryzen 5 Desktop Processors for Gamers and Creators Marks Arrival of Market's…
Analog Devices and Renesas Electronics Collaborate on 77/79-GHz Automotive RADAR Technology to Improve…
Swarm64 Releases Swarm64SDA to Empower Real-Time Big Data Analytics for High Velocity Data
Microsemi Announces Libero SoC v11.8 Software Providing FPGA Designers Mixed Language Simulation and…
Media Alert: QuickLogic to Partcipate in SMIC Advanced Technology Workshop 2017
Renesas Electronics Unveils the Renesas autonomy™, Open, Innovative and Trusted Platform to Further…
Kester to Exhibit & Present at SMTA China East/NEPCON China
Valens Raises $60M to Boost Growth, Innovation in Automotive Industry
ArterisIP Advances Machine Learning SoC Design with Ncore 2.0 Cache Coherent Interconnect and Resilience…
Fortemedia Introduces Industry's Lowest-power VID Processor iM501 for Wearables, IoT, and Smart Home…
Pasternack Introduces New Series of 1.0 mm Flexible VNA Test Cables Operating up to 110 GHz
CypressFirst Mails Definitive Proxy Statement And Sends Letter To Cypress Semiconductor Stockholders…
NXP Announces New 65 V LDMOS Technology that Speeds RF Power Design
AMD Expands Technology Portfolio to Drive Immersive Computing Vision with Acquisition of Wireless Virtual…
Renesas Electronics Introduces Industry-Leading Small Design Class Inverter Kit Solution for HEV and…
ChipMOS REPORTS MARCH 2017 AND 1Q17 REVENUE
UMC Reports Sales for March 2017
SEMI Reports 2016 Semiconductor Photomask Sales of $3.3 Billion
Solido Launches Machine Learning (ML) Characterization Suite
Arteris is now ArterisIP
Samsung joins HEVC Advance
Sunplus Technology Licenses Netspeed Orion IP to Accelerate Design of Automotive SoCs
Ittiam accelerates open source VP9 encoder in partnership with Netflix and Google
Alpha and Omega Semiconductor Introduces First USB Type-C Load Switch
Shanhai Capital Completes Acquisition of Analogix Semiconductor
Analog Devices Expands GaN Power Amplifier Portfolio with Two Broadband 6-GHz Modules
Microsemi and Athena Announce the TeraFire Hard Cryptographic Microprocessor for PolarFire "S Class"…
PLDA Launches PLDA Design Day Event In Shanghai, China, a First-of-Its-Kind Event, 100% Focused on PCIe…
Richardson Electronics Reports Third Quarter Fiscal 2017 Results and Declares Quarterly Cash Dividen…
MACOM Extends Diode Leadership with the Addition of Three Industry Leading Integrated AlGaAs PIN Diode…
IBM First to Deliver Latest NVIDIA GPU Accelerator on the Cloud to Speed AI Workloads
MaxLinear, Inc. Completes Acquisition of G.hn Home Networking and Access Business from Marvell Technology…
MIPI Alliance Expands Popular CSI-2 Camera Specification Beyond Mobile
Autoroad and STMicroelectronics Showcased Innovative Automotive Radar Solutions
Renesas Electronics Enables Security and Safety for Next-Generation Connected Cars With Embedded Virtualization…
Pasternack Releases New Line of IQ Mixers with RF and LO Frequency Bands Ranging from 4 GHz to 38 GH…
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
LDA Technologies Unveils NeoMux™: the Ultimate Muxing Solution with Ultra-low 42ns Latency
Open-Silicon Unveils Industry's Highest Performance Interlaken Chip-to-Chip Interface IP
ON Semiconductor Unveils High Performance 5.1 Megapixel Imaging Solution for High-End Security Camera…
DSP Group and Emza Visual Sense Partner to Create Commercially Available Ultra-Low Power, Always-On …
Leti Announces EU/South Korean Project for World’s First 5G-system Prototype
AMPHION appoints AVANT Technology as its distributor for the China and Taiwan markets
Silicon Genesis Has Focused Its Technology Development Efforts into the Emerging 3DIC Application Ma…
Maxim Power Corp. Closes Sale of Maxim Power (USA), Inc. to Hull Street Energy
Gregg Lowe Joins Silicon Labs' Board of Directors
ON Semiconductor Demonstrates Advanced Technologies for Automotive Systems at SAE World Congress
Ambarella Introduces the S5L Family of 4K SoCs for Professional, Consumer and Battery-Powered IP Security…
Microsemi's New Smart Storage I/O Controllers Unlock Flash Performance in Data Center Servers
SII Semiconductor Corporation Introduces the S-85S1A and S-85S1P Series with the World's Lowest Current…
JEDEC DDR5 & NVDIMM-P Standards Under Development
SEMI Reports 2016 Global Semiconductor Materials Sales of $44.3 Billion
Intersil Fills Out 12V Synchronous Buck Regulator Portfolio
EEMBC® Benchmark Reveals True Energy Cost of Using Bluetooth® LE for the Internet of Things
C-SKY MICROSYSTEMS SELECTS DOLPHIN INTEGRATION’S ENERGY MANAGEMENT OFFERING FOR SMART VOICE-INTERACTED…
SMIC 2016 Annual Results Announcement
GUC Appoints System CTO
Faster time-to-market and on-chip data protection enable rapid innovation
Barco Silex Partners With Accelize, Enabling Encryption-as-a-Service and More for Cloud Service Prov…
CypressFirst Comments on Cypress Semiconductor Analyst Day
Toshiba Launches Multi-bit TVS Diodes for Protection of High-speed Interfaces in Mobile Devices
Maximize Battery Run-Times with Maxim's High Accuracy, Low Quiescent Current Fuel Gauge
Acromag's New AcroPack® Carrier Cards Offer More I/O Options for VPX, XMC and PCI Express Embedded …
Analog Devices Acquires Broadband GaAs and GaN Amplifier Expert OneTree Microdevices to Enable Complete…
Faraday Announces World's Smallest Footprint 40eHV and 40LP SRAM Compiler
Leti Marking 50 Years of Pioneering Innovation with Events and Workshops in France, Japan, Taiwan and…
Mike Bartley on Exclusive List of Top 50 Entrepreneurs Honoured at House of Commons
Argon Design signs up first licensee for Argon360 real-time video stitching IP
MaxLinear to Acquire Exar in All-Cash Transaction
Extreme Networks To Acquire Brocade's Data Center Networking Business
Intel Appoints Chief Strategy Officer
ONE Media 3.0 and Saankhya Labs Agree to ATSC 3.0 Chipset Development
efabless, X-FAB Announce Results of First Analog-on-Demand Design Challenge
SMIC exploring opportunities in IoT boom (DigiTimes)
TDK's Subsidiary TDK-Micronas to Acquire ASIC Specialist ICsense to Further Grow Its Sensor Business…
GlobalSign Joins ARM mbed IoT Device Platform Partnership
PLDA Announces Multiple Corporate-Wide Licenses For Their XpressSWITCH™ PCIe®4.0 Switch IP
TowerJazz and TPSCo Release Enhanced up to 200V 180nm BCD on SOI Power Management Process
Aura Semiconductor Announces Partnership with Mindtree to Deliver Advanced Wireless Personal Area Network…
Arteris FlexNoC Interconnect IP is Licensed by Samsung for its Foundry Customers
Village Island releases world-wide the VICO-4, the “4K over single 3G-SDI” appliance empowered by…
Inside Secure delivers Application Protection to defend against malicious attacks on Android Java de…
BrainChip Advances its Position as a Leading Artificial Intelligence Provider with an Exclusive License…
ARM DynamIQ: Expanding the possibilities for artificial intelligence
Leti Presented Advances in Propagation Modeling and Antenna Design at EuCAP in Paris
CypressFirst Issues Statement Regarding Elimination Of Cumulative Voting At Cypress Semiconductor
Cypress Stockholders Approve Consent Solicitation to Eliminate Cumulative Voting
Micron Technology, Inc., Reports Results for the Second Quarter of Fiscal 2017
QuickLogic Corporation Announces Pricing of $15.0 Million Public Offering of Common Stock
Samsung and eSilicon Taped-Out 14nm Network Processor With Rambus 28G SerDes Solution
High-performance, high-bandwidth IP platform for Samsung 14LPP process technology
MACOM Enables 600G on a Single Wavelength for Long-haul/Metro Applications with 64 Gbaud Surface Mount…
Comcores announces commercial availability of a complete Radio-Over-Ethernet and L1 offload solution…
GUC PCIe 3 PHY IP & PLDA EP Controller Combo Passes Compliance Test
MACOM Enabling Rapid Transition to 400G for Cloud Data Centers with L-PICTM Chipset
MACOM Announces PAM-4 Technology Chipset for Single Lambda 100G, 200G and 400G Data Center Optical C…
STMicroelectronics Teams with Wurth Elektronik to Enhance Its Online Design Environment for Power-Supply…
IXYS Introduces a New Range of Ultra-Compact ‘Wespack’ Rectifier Diodes with Record Current Rating…
GigPeak Announces Introduction of Complete 200Gbps Chipset Ethernet Product Portfolio for Short Reach…
Micron to Establish its Center of Excellence for DRAM in Taiwan
Arteris Ncore Cache Coherent Interconnect and FlexNoC IP are Licensed by ZTE
Andes Technology Corporation Goes IPO On the Taiwan Stock Exchange
Innovium Raises $38.3M in Oversubscribed Series C Funding and Announces Advisory Board
Kalray Announces the Release of an Efficient Manycore Processing Solution Dedicated to Deep Learning…
ARM’s new RTOS gets visualization from Percepio
MACOM Announces the Industry’s Most Integrated Laser Driver for 28G SFP28 Optical Modules at OFC 2…
Broadcom Unveils Industry’s Most Comprehensive Dual 100G MACsec PHY with 256-bit AES for Secure Network…
Industry's first multiphase bidirectional current controller from TI
Peregrine Semiconductor, A Murata Company, Acquires Arctic Sand Technologies
Cavium and Elenion Technologies Collaborate to Offer Silicon Photonics Enabled End-to-End Server-to-Switch…
Semtech Demonstrates New 53GBaud PAM4 Linear Driver and Transimpedance Amplifier at OFC 2017
Luxtera Debuts Duplex 100G-CWDM2 Optical Transceiver Module at OFC 2017
MaxLinear Introduces MxL9162 64Gbaud Linear Transimpedance Amplifier for Next-Generation 400Gbps / 600Gbps…
TowerJazz Announces H5: a Leading 300GHz SiGe Technology Optimized for 400GbE Communications
QuickLogic Corporation Announces Proposed Public Offering of Common Stock
Qualcomm 205 Mobile Platform Brings 4G Connectivity to More People in More Places
Source Photonics and MACOM Demonstrate 53Gbaud PAM-4 Optical Link with Compact TOSA and ROSA
Optical Gigabit Ethernet Becomes IEEE Standard
Imagination and Intercede demonstrate the power of the Trust Continuum in securing the IoT
GREENWAVES TECHNOLOGIES SELECTS DOLPHIN INTEGRATION’S LOW POWER VIRTUAL COMPONENTS FOR THE INDUSTRY’S…
eSOL’s eMCOS Scalable RTOS Platform Supports Xilinx Zynq UltraScale+ MPSoC for Next-Generation ADAS…
eT-Kernel Real-Time Operating System Supports ARM®v8-M Architecture for Next-Generation ARM® Cortex®-M…
Moortec to exhibit at the 2017 TSMC NA Technology Symposium in Santa Clara
Maxim Power Corp. Announces 2016 Financial and Operating Results
Keysight Technologies to Help Accelerate Deployment of IoT Technology Using Qualcomm™ Technologies’…
MaxLinear Launches MxL9142 45Gbaud Linear Transimpedance Amplifier for Telecom and Data Center Coherent…
ChipMOS PROVIDES 1Q17 CONSOLIDATED FINANCIAL FORECAST
Microsemi Delivers Scalable Fronthaul Solution for 4G and 5G Mobile Networks
AMD Ryzen 5 CPUs to Power Performance Desktop PCs Starting April 11 Worldwide
Green Hills Software And Imagination Announce INTEGRITY RTOS Support For MIPS I6400 CPU
Lynx Software Technologies reveals first ARM port for LynxSecure
Xilinx Debuts Industry-First Solutions at OFC 2017 and Further Expands High Speed Data Center Interconnect…
SMIC Signs License Agreement For Invensas' DBI(R) Technology
Accelerate product expansion and maximize software investment with the new SimpleLink™ MCU platfor…
Faststream Technologies Unveils Solutions for IoT Ecosystem With NB-IoT/LTE-M
ICE-G3 EPU Adds Cluster Controller To Save More Energy For Complex Chip Power Architectures
Leading Independent Proxy Advisory Firm Glass Lewis Recommends Cypress Semiconductor Stockholders Vote…
Luxtera to Offer High-Performance Silicon Photonics Platform with TSMC
STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments
Performance-IP Introduces Silicon IP to Increase Memory Performance in SoC Designs
Lynx Software Technologies reveals first ARM port for LynxSecure
Cree Second Generation Extreme High Power LED Delivers Unmatched Efficacy & Lumen Density
GigPeak Announces 64Gbaud SMT Quad Linear Modulator Driver for Next-Generation Coherent Systems
ARM’S new RTOS gets visualization from Percepio
Percepio Tracealyzer new for ThreadX from Express Logic
RISC-V Enters Mainstream at Embedded World 2017
TSMC February 2017 Revenue Report
Industry-First 1800W Auto-Compliant Transient Voltage Suppressor Launched by Diodes Incorporated at …
NXP Announces ARM Cortex-M4-based MCU with Industry’s Largest Embedded SRAM Memory, Optimized for …
NXP Unveils Advanced TSN-Enabled SoC for Industrial IoT
Power Conversion Technology from Helix Semiconductors First to Achieve Control of 400V+ Circuits Using…
The Industry's First MCUs with Built-In LCD Driver Optimized for Data Loggers
OVH and Accelize Partner to Deliver FPGA Acceleration-as-a-Service through OVH RunAbove Lab
Cypress Semiconductor Independent Stockholders Should Decide Whether or Not To Eliminate Cumulative …
IXYS Introduces a New High Performance 1.7 kV Press-Pack IGBT with Record Power Density
STMicroelectronics and ClevX Expand Collaboration, Introducing Highly Secure Encryption-Technology …
UnitySC Pushes the Boundaries of Measurement With New Nanotopography Metrology Platform
QuickLogic Announces Amazon "Alexa" Voice Trigger for Connected Home and Mobile Applications
Renesas Expands Renesas Synergy™ Platform and Reaches Unprecedented Software Quality Levels
Continental Selects Cypress Automotive MCUs to Drive Next-Generation Body Electronics Platform
Lattice Semiconductor to Showcase Latest Advancements in Smart Connectivity Solutions at Embedded World…
Cypress Expands its Leadership in Wireless Connectivity with New 802.11ac Solutions that Pave the Way…
New Wireless Gecko SoCs Help Developers Tackle Multiprotocol IoT Design Challenges
IAR Systems Delivers Major Update of ARM Development Tools
Barco Silex and Imagination collaborate on SoC security
Out-of-the-Box Solutions from ON Semiconductor Enable Engineers to Accelerate Cloud-Based IoT Development…
CAST Expands CAN Bus Solutions Suite with New PHY Daughter Card
Leti to Release Versatile SensiNact Internet of Things Platform for Open-Source Development
Kester Launches WP601-ZH Solder Paste
Intersil Unveils Highly Integrated Multi-Cell Battery Pack Monitor
Arteris Announces PIANO™ 2.0 Automated Interconnect Timing Closure Technology
Achronix Semiconductor Corporation Joins the OpenCAPI Consortium
Aldec Introduces End-to-end HW/SW Co-verification for Xilinx Zynq SoC FPGAs at Embedded World 2017
NEC and AIST Develop LSI with NanoBridge® Technology Featuring High Radiation Tolerance for use in …
Imagination shows latest technologies for IoT, automotive and security at Embedded World 2017
Renesas Electronics Accelerates Industrial Networking Application Development with RZ/N Series of Mi…
Silicon Creations Delivers 12.7G SERDES PMA for TSMC 40LP Process and PLL IP for TSMC 7nm Process
STMicroelectronics Teams with DSP Concepts to Give STM32 Users Free Access to Advanced Audio Design …
GreenWaves Technologies Partners with Open-Silicon to Develop Industry's First IoT Processor Based on…
PLDA Announces XpressRICH4-AXI™ PCIe® 4.0 IP, Providing a High Performance and Reliable AXI Bridge…
Automotive-Compliant Dual MOSFETs from Diodes Incorporated Minimize Power Losses to Deliver Cost-Effective…
Cypress Unveils PSoC 6, the Industry's Lowest Power, Most Flexible MCU Architecture, Setting a New Standard…
MagnaChip Unveils New 0.18 Micron RFSOI 2.5V Process With Enhanced Switching Performance
Marvell Introduces Groundbreaking Modular Approach to 10GbE and 25GbE Deployment in the Data Center
Maxim's nanoPower Boost Regulator Delivers Industry's Longest Battery Life and Smallest Solution Size…
T.J. Rodgers Provides Investor Presentation for Cypress Stockholders Titled "Do What's Right for Cyp…
Semiconductor Solutions from STMicroelectronics Selected by Nintendo for Nintendo Switch
QuickLogic Releases Aurora Software for Evaluation of ArcticPro eFPGA IP
Open-Silicon Announces IoT Gateway SoC Platform
MEDIA ALERT: Credo Demonstrates Single-Lane 112G and 56G PAM4 SerDes IP at TSMC Technology Symposium…
Analog Bits Announces Mixed Signal Design Kits for 7nm at TSMC Technology Symposium
Innovation in Diverse, Fast Moving and High-Profile Sectors for ON Semiconductor at Embedded World
Silicon Mobility Announced OLEA® LIB and OLEA® APP, software content favoring longer battery range,…
TowerJazz Expands Support for its Fast Growing Base of Chinese Customers with Leading SiGe BiCMOS Technologies…
Linde invests over EUR 110 million in China to strengthen position as supplier of choice for electronics…
Xilinx Expands into Wide Range of Vision-Guided Machine Learning Applications with reVISION
Arrow Chameleon96 Community Board Features Quantum-Resistant IoT Authentication & Data Protection Solutions…
New embedded chip from Socionext features PowerVR Series8XE GPU from Imagination
Imagination Technologies and Express Logic announce expansion of ThreadX RTOS support for MIPS CPUs
RISC-V enters the mainstream at Embedded World 2017
ULTRA-LOW POWER MEMORY GENERATORS SILICON PROVEN AT TSMC 55 NM ULP AND ULP EFLASH
Linaro Announces Fujitsu’s Collaboration to Accelerate High Performance Computing on ARM
Additional unlicensed spectrum needed to deliver future Wi-Fi® connectivity
HXT Semiconductor Joins Linaro to Accelerate Advanced Server Development on ARM
Cypress Closes Sale of Minnesota Wafer Fabrication Facility
Analog Devices Completes Acquisition of Linear Technology
Codasip and TVS Deliver Advanced RISC-V Verification Solutions
inTEST Reports 2016 Fourth Quarter and Year-End Financial Results
SOITEC : SOITEC BEGINS RAMPING UP PRODUCTION OF 200-MM SOI WAFERS IN CHINA AT SOI MANUFACTURING PARTNER'S…
Ultra-Low-Current LDO from Diodes Incorporated Handles Loads up to 150mA with 1% Accuracy
Toshiba Introduces Low Reverse-Current Schottky Barrier Diodes for Voltage Boosting Circuits
Easily Implement Efficient Public-Key Crypto to Protect IoT Devices and Data Paths with Maxim's Embedded…
Cypress and Arrow Electronics Expand Collaboration to Deliver Leading IoT Solutions
NXP Launches the World’s Smallest Single-chip SoC with Integrated Microcontroller for Drones, Robots,…
Renesas Electronics Partners with Data I/O and Secure Thingz to Provide Secure Firmware Flash Programming…
InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Techno…
Microsemi's Space Products Support Iridium® NEXT Satellite Program
ChipMOS REPORTS FOURTH QUARTER AND FULL YEAR 2016 RESULTS
Silexica Expands Tools to Support Automotive Innovation
UMC Reports Sales for February 2017
Embedded World: ReFLEX CES Introduces the 1st Arria 10 SoC System-On-Module, Named “Achilles”
AMD Collaborates with Microsoft to Advance Open Source Cloud Hardware
Cavium Collaborates with Microsoft to Showcase SONiC Compatibility at OCP US Summit 2017
Eutelsat and STMicroelectronics Announce Low-Cost, Low-Power System-on-Chip for Interactive Satellite…
Imagination’s new PowerVR Furian GPU architecture will deliver captivating and engaging visual and…
STMicroelectronics Announces Volume Production of Industry-Unique Satellite Demodulator with Lead Customer…
MEDIA ALERT: Andes Technology Will Demonstrate How its System Control Processor Can Simplify SoC Design…
Greenvity Wideband PLC Chips Provide True Energy Savings for Next Generation of Smart Meters
Edgecore Networks Contributes Designs to OCP for Scalable 25G and 100G Data Center Networks and Open…
Qualcomm Collaborates with Microsoft to Accelerate Cloud Services on 10nm Qualcomm Centriq 2400 Plat…
AnaGlobe to Exhibit at TSMC North America Technology Symposium 2017
T.J. Rodgers Files Preliminary Consent Information Statement Regarding Cypress Semiconductor Consent…
STMicroelectronics and Prove & Run Provide Scalable Security Platform for IoT Devices
Sidense Exhibiting at TSMC 2017 North American Technology Symposiums
Aricent Announces ConvergedOS, an Open Hardware Operating System that Supports Inventec's OCP Compliant…
Everspin Expands MRAM Ecosystem with Xilinx FPGAs
MACOM Announces Sampling of X-Gene® 3 Server-on-a-Chip® Solution
Toshiba to Launch SIP Series of SCiB™ Lithium-ion Rechargeable Battery Module for Automated Guided…
TI introduces industry's first 4-20mA DAC with integrated buck/boost converter that operates off of …
Next Generation X-Gene® 3 Server Processor Showcased at OCP U.S. Summit 2017
Toshiba Expands Line-up of Illumination LED Driver ICs with a Single-Wire Input
Toshiba Launches 600V/500V High Voltage Intelligent Power Devices in Small-size Packages for Fan Mot…
NVIDIA Jetson TX2 Enables AI at the Edge
Industry leaders form the Embedded Tools Alliance
JBC exhibits at productronica China 2017
Socionext Develops World's First Graphics Display Controller with OpenVX Compliant Hardware Accelera…
D’Crypt to include Barco Silex IP for public key cryptography in cutting-edge communication chip
Peregrine Semiconductor Introduces SP6T, SP8T and SP12T High Performance RF Switches with Extended Temperature…
Cypress 802.11ac Wireless Connectivity Solution Enables Robust Multiplayer User Experience for Nintendo…
TechCode and Silicon Catalyst Collaboration to Rev Up Semiconductor Start-Up Ecosystem
Toshiba is the Fastest Growing HDD and SSD Vendor of 2016
ON Semiconductor Establishes Advanced Sensor Design Center in Europe
Molex µPDB Custom Sealed Modules Offer Space-Conscious, Cost-Effective Solution
Integrated Device Technology, Inc. Commences Previously Announced Cash Tender Offer to Acquire GigPeak,…
Advanced Semiconductor Engineering, Inc. Announces Monthly Net Revenues
SII Semiconductor Corporation Introduces New 2-to-4-Cell Lithium-Ion Battery Second Protection ICs with…
TSMC Joins Semiconductor Research Corporation
Autotalks Turns to Athena for its Truly Secure V2X Solution
Aldec unveils Xilinx UltraScale FPGA-based prototyping board enabling Simulation Acceleration and Emulation…
NetSpeed Gains ISO 26262 Certification, ASIL-D Ready, for Its Interconnect IP
Terminus Circuits and Truechip partner for comprehensive verification of High Speed Serial Protocols,…
Enhanced Micrium OS and New Platform Builder Accelerate Embedded Design
Rambus Signs License Agreement with Western Digital
Richardson Electronics, Ltd. and Exxelia Sign Exclusive North American Distribution Agreement
Brazil’s Unitec licenses MIPS CPU from Imagination Technologies for chip targeting smart cities
Aehr Test Systems Introduces new FOX-XP™ System with Singulated Die/Module Test Configuration at Burn-in…
Atomera Collaborates with Synopsys to Model MST(R) in Sentaurus TCAD
ON Semiconductor Expands Automotive Sensing Portfolio with Radar Technology
AMPHION releases 2 extended performance variants of its highly successful HEVC/H.265 ‘Malone’ video…
Analog Devices Announces Final Regulatory Approval and Closing Date for Acquisition of Linear Technology…
Micron chooses Hyperstone to provide a high-reliability eUSB 3.1 storage solution for telecommunication…
Dream Chip Technologies Demonstrates Automotive ADAS SoC using Arteris FlexNoC IP at Mobile World Co…
CEVA and ASTRI Unveil Dragonfly NB1, a Licensable NB-IoT Solution For Cost and Power-Sensitive LTE IoT…
Nigel Toon Appointed as Advisor to Moortec Board
Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC
Spreadtrum launches 14nm 8-core 64-bit mid- and high-end LTE SoC platform
Cypress Semiconductor Files Definitive Consent Solicitation to Eliminate Cumulative Voting, Protecting…
Renesas Electronics America Announces Changes in President of U.S. Operations
RFEL supplies two HALO Rapid Prototype Development Systems to the Defence Science and Technology Laboratory,…
Luxoft launches Symtavision 4.0 timing design, analysis and verification tool suite
Marvell Technology Group Ltd. Reports Fourth Quarter and Fiscal Year 2017 Financial Results
II-VI Incorporated Introduces 25 Gb/s Detector Chip Arrays for Active Optical Cables Deployed in Dat…
Broadcom Delivers Industry’s First 16nm Nx56G PAM-4 PHYs for Wired Network Infrastructure
Velocity Micro(R) Announces the Shipment of Desktops Powered by AMD Ryzen(TM) 7 Processors
Texas Multicore Technologies Announces Full Support for ARM Processors
Seoul Semiconductor Europe Introduces Reference Modules for Its Wicop LEDs
Semiconductor Manufacturing’s Next Big Thing at ASMC 2017
Imperas Software Presents at Embedded World 2017
Kester To Exhibit at Upcoming SMTA Texas Expos
Keysight Technologies Introduces Ultra-Low Cost Oscilloscope Series
Toshiba Introduces New Series of Gate Drive Photocouplers
TI empowers design engineers at APEC 2017
Next Generation X-Gene® 3 Server Processor Showcased at OCP U.S. Summit 2017
NVIDIA Announces GameWorks DX12
NVIDIA Introduces the Beastly GeForce GTX 1080 Ti -- Fastest Gaming GPU Ever
Protected: T&VS and BugFinders Announce Strategic Partnership
ON Semiconductor Unveils Innovative Modular Automotive Imaging Platform
UPDATE: Merger Agreement Approved by Shareholders of Lattice Semiconductor
Maxim's Defibrillation and ESD Protection Device Safeguards Medical Applications with 100x Less Leakage…
Alpha and Omega Semiconductor Introduces a Highly Versatile DrMOS Power Module
Media Alert: QuickLogic CTO to Present at the Wearable Technology Show in London
Menlo Micro Reinvents the RF Switch – Greater than 10X Performance Gain
MaxLinear Showcases Wireless Backhaul Product Portfolio Strength with 20 Gbps Millimeter Wave Modem …
Microsemi Announces Open Source Switchtec PCIe Switch Linux Drivers Enabling Rapid, Open Development…
TowerJazz and Cavendish Kinetics Deliver High Volume RF MEMS with Unprecedented Reliability
Advantest Launches New Module, Extending EVA100 Measurement System’s Capabilities for High-Resolution,…
SecureRF and BaySand Collaborate to Provide Quantum-resistant Security for ASIC-powered IoT Devices
CommSolid Unveils Market’s First Integration-Ready NarrowBand-IoT Modem IP Solution
Goke Licenses SonicsGN and MemMax Products for STB SoC Platform
Cobham Gaisler LEON3FT Processor Technology Launch Aboard Iridium NEXT
Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi D…
Neowine selects Barco Silex public key cryptography IP as most efficient hardware block
Altair's CAT-1 IoT Chipset Certified For Operation On T-Mobile's 4G LTE Network
CEVA's Bluetooth® 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected…
Silicon Labs Announces Proposed Private Offering of $350 Million of Convertible Senior Notes
Digi-Key and Analog Devices Broaden Product Selection Offering
Qualcomm Expands Industry's First Announced 5G Modem Family to Support 5G NR with Integrated Gigabit…
Renesas Electronics Completes Acquisition of Intersil
Intersil Announces Single-Chip Rad Hard 32-Channel Driver with Integrated Decoder for Satellite Appl…
HIPPEROS adds innovative features to its multicore RTOS for high performance embedded systems
Silab Tech wins The SME of the Year Award at the Small Enterprise Business Awards 2016
Blu Wireless Technology secures backing from ARM
Waves Audio and CEVA Partner for Far-Field Voice Pick Up and Psychoacoustic Sound Enhancement
SAVE TIME DURING THE EVALUATION OF SILICON IPS THANKS TO MYDOLPHIN!
Inside Secure announces strong 2016 results following completion of strategic transformation
PRO DESIGN Launches Intel® Stratix® 10-based High-Speed Multi FPGA Prototyping Solution
MediaTek Unveils Helio X30 to Power Premium Mobile Experiences
MediaTek Announces CorePilot 4.0 Technology to Deliver Ultimate Processing Power and Power Efficiency…
MediaTek and Nokia Collaborate to Enable First Wave of 5G Networks and Devices
STMicroelectronics, DSP Group, and Sensory Create Keyword-Smart Microphone for Voice-Controlled Devi…
NXP Advances Secure Connections by Delivering Automotive NFC Technology to 5 Leading Car OEMs
Imagination’s PowerVR graphics provide huge performance boost and power savings in MediaTek’s new…
Samsung Introduces New Gear VR With Controller, Expanding Gear VR Ecosystem to Make VR Experiences Easier,…
Toshiba Now Shipping Samples of 64-Layer, 512Gb 3D Flash Memory
Sequans Integrates Think Silicon GPU Technology in New LTE for IoT System-on-Chip
Qualcomm Introduces Snapdragon 835 Virtual Reality Development Kit
Qualcomm Technologies and Nokia Announce Multi-band Femtocell Platform for SOHO Environments
T.J. Rodgers And Candidates Camillo Martino And J. Daniel McCranie Deliver Letter To Cypress Board Of…
Qualcomm and LG Bring 5G and Cellular-V2X Communications Into Vehicles
STMicroelectronics Works with Sigfox to Extend Plug-and-Play IoT Security to Industrial and Consumer…
InterDigital Reports Fourth Quarter and Full Year 2016 Financial Results
ViXS Appoints Fred Shlapak to the Board of Directors
Vubiq Networks Selects MaxLinear for Advanced 10 Gbps V-Band Millimeter Wave Radio Link
MaxLinear Showcases 5G & Backhaul Leadership with New Family of Broadband Microwave Transceivers
Sequans and Orion Labs Partner to Develop First LTE-enabled Wearable with Monarch LTE-M Chip
Wolfspeed Expands Industry-Leading, Third-Generation MOSFET Platform to 1200V
ON Semiconductor Sampling Industry’s Lowest Power Bluetooth® Low Energy SoC for IoT and Connected…
UCSD and TowerJazz Demonstrate Best in Class 5G Mobile Transmit-Receive Chips with Greater than 12 Gbps…
UMC Enters Mass Production for 14nm Customer ICs
CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for …
Samsung Launches Premium Exynos 9 Series Processor Built on the World's First 10nm FinFET Process Te…
Rambus to Showcase the Future of Mobile Payments and Smart Ticketing at MWC 2017
Haddington Dynamics Releases Entire Source Code for Dexter Open-Source Robot, Invites Global Collabo…
Cypress Semiconductor's Largest Individual Stockholder, T.J. Rodgers, Nominates Two Highly Qualified…
MEDIA ALERT: Breker Verification Systems to Demonstrate Portable Stimulus Tools at DVCon
Sengled Element LED Bulbs Connect to the IoT with Silicon Labs Zigbee Technology
STMicroelectronics' Latest Time-of-Flight Ranging Sensor Brings Multi-Object Detection and Multi-Array…
NXP Launches Multi-Standard Programmable Family of System on Chip Solutions
Innovation and Competition Return to High-Performance PCs March 2nd with Worldwide AMD Ryzen 7 Avail…
ip.access to Develop Next Generation IoT Small Cells on the Path to 5G in Collaboration with Intel
Renesas and Intersil Announce Final Regulatory Approval for Renesas' Acquisition of Intersil
Qualcomm, ZTE and China Mobile Announce Collaboration on 5G NR Trials at 3.5 GHz to Accelerate Wide-scale…
Toshiba Now Shipping Samples of 64-Layer, 512-gigabit 3D Flash Memory
Anyka Microelectronics Selects Allegro DVT's Multi-format Video Encoder IP
Leti to Present Latest R&D Results on Three Alternatives to EUV and 193nm Lithography at SPIE Meeting…
American Standard Circuits Acquires a new EMMA Flying Probe Electrical Tester
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