May 27, 2005
EDA Week in Review
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May 20-24, 2002
Vic Kulkarni Named President and CEO of Sequence Design
Topping the news this week was Sequence Design, Inc.'s appointment of Vic Kulkarni to the role of president, CEO and a member of the Sequence Design board of directors. Kulkarni was formerly chief operating officer of Sequence and replaces Alain Labat, former chairman, president and CEO, who resigned to pursue other opportunities which were not elaborated on by the company. Bob Russo, formerly senior vice president of worldwide field operations and general manager, was named to the position of chief operating officer.
In other management changes, Lanny Ross became chairman of the Sequence board of directors, and is a member of Broadcom's board of directors, managing director of Mountain Shadow Ventures, LLC, and retired president of the Rockwell International Telecommunications Group.
According to the company, since joining Sequence five years ago from Avant! Corp., as chief operating officer, Kulkarni has had an active role in all of the company's core business and product decisions. In addition to overseeing the overall operations of the company, he managed Sequence's research & development arm that now holds 7 patents, with an additional 12 filed. Prior to joining Sequence, Kulkarni held executive management positions with Avant!, where he headed the Silicon Business Unit. He has nearly a quarter-century of experience in the semiconductor and EDA industries, beginning his career with National Semiconductor.
Russo, formerly Sequence senior vice president of worldwide field operations, moves into the chief operating officer slot vacated by Kulkarni. Prior to joining Sequence, Russo was a senior vice president at Synopsys.
In other news, Monterey Design Systems announced version 2.1 of its Dolphin physical implementation system, which extends the simultaneous optimization capabilities of Dolphin to include all of the implementation, extraction, and analysis capabilities needed to transform a gate-level netlist into a manufacturing-ready tapeout for a multi-million gate 0.13-micron chip. The newly enhanced Dolphin 2.1 is built upon Dolphin 2.0, which is in production use by numerous semiconductor companies worldwide, the company said.
According to the company Dolphin 2.1 extends the crosstalk analysis capabilities of the tool with new built-in crosstalk noise analysis that can detect and report potential functional failures. In addition, Dolphin has been enhanced to avoid crosstalk problems by evaluating the waveforms of aggressor and victim nets that occupy common switching windows and applying statistical models to identify crosstalk-sensitive nets before they are routed. These nets are automatically allocated special wire spacing rules during global and detailed routing in order to reduce or eliminate the effects of crosstalk delay and noise.
Also, Dolphin 2.1 has a built-in 2.5D extractor that claims to give results that are accurate to within 5 percent of a full 3D extractor on 95 percent of the nets on a large design. It is fast enough to be run in real time during physical implementation, rather than as a post-process, Monterey said.
Ansoft Corp. released a new version of its Maxwell software, an integrated simulation environment dedicated to solving complex electromechanical, power-electronic, and mechatronic system designs commonly found in the transportation, aerospace, and power industries.
Maxwell 9.0 is capable of solving 3D applications that involve voltage or current sources with arbitrary waveforms important for the design of Non-Destructive Evaluation, MRI, and power-transformer equipment. Version 9 also introduces the ability to calculate core loss, including the eddy, excess, and hysteresis loss of materials. This is an extremely useful feature for engineers who develop advanced electromagnetic brakes and clutches used in the transportation industry.
New 3D thermal capabilities provide steady-state thermal analysis capability, including convection and radiation and one-way coupling between Maxwell's AC Magnetic module and thermal field analysis. Engineers may use power- and core-loss information obtained in the AC Magnetic solver as an input source for the thermal solver to obtain the complete thermal profile of a device.
Magma Design Automation, Inc. announced that the Beijing National IC Design Industrialization Base in China has adopted Magma's solution for deep submicron advanced system-on-chip (SoC) IC designs.
Magma Chairman and CEO Rajeev Madhavan delivered a keynote address at April's Beijing Microelectronics International Forum in Beijing and reached an agreement with Feng He, director general of the Beijing Economic Commission. "With its rapidly growing demand and large domestic market for electronics products, China is building its semiconductor manufacturing and IC design capability," Madhavan said. "Magma's integrated RTL-to-GDSII solution will enable Chinese IC companies to create the next-generation SoC designs."
The Ministry of Science and Technology has recognized the Beijing National IC Design Industrialization Base because of its forward-looking mission and technical expertise. The Magma RTL-to-GDSII design solution will be used in the Beijing National IC Design Industrialization Base to train IC designers in the Beijing area and from other national IC design bases. "The Magma IC design solution can potentially help China's IC design community catch and leapfrog other countries in a shorter time," Mr. Feng said.
Malaysia-based 1st Silicon appointed William John Nelson, PhD, to the new position of COO. Nelson, who is based in Kuching, reports to Claudio G. Loddo, CEO.
site in Tianjin, China, driving completion in less than two years.
From 1994 until 1996, Nelson was based in New York as senior VP of worldwide operations of General Instruments' semiconductor division. Nelson's other experience includes positions as wafer fabrication operations manager at Unitrode and Fairchild Semiconductor, as well as various wafer fabrication engineering posts at Analog Devices. Nelson earned both a Bachelor of Science degree with honors and a PhD in physics from the University of Ulster, Ireland.
Altra Broadband, a subsidiary of Ansoft Corp. announced its inception into the 10-Gigabit Small Form-factor Pluggable (XFP) Module Group, a module Multi Source Agreement (MSA) association. The purpose of the group is to develop a common specification for multi-sourcing application-agnostic, ultra-small form factor, 10-Gigabit per second (Gb/s) modules for the telecommunications, data communications and storage area network (SAN) markets. The XFP association has experienced significant growth since its debut in March 2002, with 44 companies currently participating in the group.
Participation in the XFP Group allows Altra Broadband to gain valuable insight into the needs of the industry. Participation will allow Altra to build strategic alliances with industry leaders, especially the XFP Founding-member companies Broadcom, Brocade, Emulex, Finisar, JDS Uniphase, Maxim Integrated Products, ONI Systems, ICS (a Sumitomo Electric company), Tyco Electronics and Velio. The company believes that these strategic relationships are essential for sustained growth and development of its technology offering.
Altra Broadband is participating in the Group to promote the company's expertise in high-speed digital communications and to promote application of Ansoft products for 10 Gb/s printed circuit board (PCB) design. The XFP Group will benefit from Altra Broadband's contribution of an accurate channel model for the electrical interconnect between the transceiver ASIC and the XFP module.
Antrim Design Systems, Inc. launched its Design Characterization & Modeling (DCM) software, which automates the creation of analog and digital behavioral models. DCM automatically calibrates the model to, and verifies the model against, the original circuit design. These Silicon Calibrated Behavioral Models, dramatically improve simulation performance by up to 100X with less than 1 percent accuracy loss from the original transistor-level simulation.
The designer selects the required block on a schematic and enters a minimal amount of high-level information and from that, Silicon Calibrated Behavioral Models can be created for Verilog-AMS, Verilog-D, and Synopsys.Lib (for delay calculation and synthesis). The designer does not need to learn new languages or file formats and is free to focus on designing. DCM automates the creation, calibration and verification of analog (VCO, Charge Pump, etc.), digital (divider, gates, latches, etc.), and CML cells.
The power of DCM is fully realized within Antrim Aptivia, as it automatically creates fully operational Aptivia projects containing the behavioral models, test benches, sweeps, model calibration, specification sheets (to verify the model against the original design), plans (to encapsulate the entire characterization, calibration and verification flow) and documentation.
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-- Jack Horgan, EDACafe.com Contributing Editor.
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