Tessera at SEMICON West 2011

SAN JOSE, Calif. — (BUSINESS WIRE) — July 6, 2011 — Tessera Technologies, Inc. (Nasdaq: TSRA) will be exhibiting its advanced semiconductor packaging technologies at SEMICON West, July 12-14, 2011, at booth #6144 in Moscone Center’s North hall.

Tessera will also participate in a panel at the event.

   

WHO:

Charles Woychik, Director of Marketing and Technical Analysis, Invensas

Corporation, a wholly owned subsidiary of Tessera

 

WHAT:

Design and Manufacturing Panel: Stacking Effects; A look at how the global

supply chain will change in 2.5D and 3D

 

WHERE:

SEMICON West 2011
Moscone Center
NorthTwo TechXPOT

San Francisco, California

 

WHEN:

July 12, 2011
11:40am – 12:45pm
 

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