Tessera at SEMICON West 2011

SAN JOSE, Calif. — (BUSINESS WIRE) — July 6, 2011 — Tessera Technologies, Inc. (Nasdaq: TSRA) will be exhibiting its advanced semiconductor packaging technologies at SEMICON West, July 12-14, 2011, at booth #6144 in Moscone Center’s North hall.

Tessera will also participate in a panel at the event.



Charles Woychik, Director of Marketing and Technical Analysis, Invensas

Corporation, a wholly owned subsidiary of Tessera



Design and Manufacturing Panel: Stacking Effects; A look at how the global

supply chain will change in 2.5D and 3D



SEMICON West 2011
Moscone Center
NorthTwo TechXPOT

San Francisco, California



July 12, 2011
11:40am – 12:45pm

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