Mindspeed Executive to Address System-on-Chip (SoC) Base Station Processor Technology at Linley Tech Carrier Conference

CTO James Johnston to Discuss Latest Advances for Supporting the Explosive Growth of Mobile Data and Video

NEWPORT BEACH, Calif. — (BUSINESS WIRE) — June 6, 2011Mindspeed Technologies, Inc. (NASDAQ: MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that the company’s chief technical officer, James Johnston, will serve as a featured speaker and panelist at the Linley Tech Carrier Conference, June 7 and 8, 2011, at the Doubletree Hotel in San Jose, CA.

The Linley Tech Carrier Conference covers system design for wired and wireless infrastructure, including carrier Ethernet, optical transport, broadband infrastructure and wireless base stations. Johnston will serve as a panelist during a Wednesday, June 8, session on 4G mobile infrastructure demand, from 9:00 a.m. to 11:15 a.m. He also will participate in the question and answer portion of a session on Tuesday, June 7, from 10:20 a.m. to noon, which will be focused on wireless infrastructure trends.

“To accommodate the explosive growth of mobile data and video, mobile operators are migrating to a heterogeneous network environment featuring a broad distribution of macrocells, microcells, picocells and enterprise femtocells,” Johnston said. “During the Linley Tech Carrier Conference, I will be presenting the latest developments in network SoC solutions that are designed to overcome the computational complexities of 4G, while enabling this diverse new generation of base station platforms.”

Johnston will highlight the strategic differentiators of Mindspeed’s Transcede® family of processors for original equipment manufacturers (OEMs) that are considering new 3G and 4G small cell architectures. Mindspeed’s Transcede 4000 SoC, which features 26 programmable processors in a single device, including two ARM® Cortex A9® multi-core symmetric multiprocessing (SMP) reduced instruction set computer (RISC) processors, 10 CEVA® digital signal processors (DSPs) and 10 DSP accelerators, was named “Best Mobile Technology Breakthrough” at the 2010 Mobile Excellence Awards (MEA).

About Mindspeed Technologies

Mindspeed designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes enterprise networks, broadband access networks (fixed and mobile), and metropolitan and wide area networks. We have organized our solutions for these interrelated and rapidly converging networks into three families. Our communications convergence processing (CCP) products include ultra-low-power, multi-core digital signal processor (DSP) system-on-chip (SoC) products for the fixed and mobile (3G/4G/LTE) carrier infrastructure and residential and enterprise service platforms. Our high-performance analog (HPA) products solve difficult switching, timing and synchronization challenges in next-generation optical networking, enterprise storage and broadcast video transmission applications. Our wide area networking (WAN) communications portfolio helps optimize today's circuit-switched networks. Mindspeed's products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment which serves these markets.

To learn more, please visit www.mindspeed.com. News and company updates are also posted at www.twitter.com/mindspeed.

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company's expectations, goals or intentions, including, but not limited to product features and their benefits. These forward-looking statements are based on management's current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward-looking statements. These risks and uncertainties include, but are not limited to: fluctuations in our operating results and future operating losses; constraints in the supply of wafers and other product components from our third-party manufacturers; worldwide political and economic uncertainties and specific conditions in the markets we address; fluctuations in the price of our common stock; loss of or diminished demand from one or more key customers or distributors; successful development and introduction of new products; cash requirements and terms and availability of financing; our ability to attract and retain qualified personnel; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; the expense of and our ability to defend our intellectual property against infringement claims by others; pricing pressures and other competitive factors; lengthy sales cycles; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company's actual results to differ from those set forth in any forward-looking statement are discussed in more detail under "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations" in the company's Quarterly Report on Form 10-Q for the quarter ended April 1, 2011, as well as similar disclosures in the company's subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

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