3rd Asia Symposium on Quality Electronic Design (ASQED) Announces Program; Convenes July 19-20, Kuala Lumpur, Malaysia

SAN JOSE, CA and KUALA LUMPUR, MALAYSIA -- (MARKET WIRE) -- May 18, 2011 -- The third Asia Symposium on Quality Electronic Design ( ASQED) today announced its 2011 program consisting of several keynotes by industry leaders and university experts, tutorials and over 50 technical presentations

ASQED is being held on July 19-20, 2011 in Kuala Lumpur, Malaysia. ASQED plays a critical role in promoting quality-based electronic design and manufacturing in Asia and plans to be an integral part of establishing a communication link between semiconductor, nano-electronic, bio-electronic, MEMS (microelectromechanical) and NEMS (nanoelectromechanical) systems, and photovoltaic (PV) technologies and disciplines such as design, manufacturing, test and packaging.

Powerful Keynotes Headline Conference
ASQED keynote sessions are sponsored by Synopsys and include:


  • Nanotechnology and the Challenges Facing Designers of Circuits and Systems
    Prof. Arokia Nathan
    Chair of Nanotechnology, London Centre for Nanotechnology,
    University College London, England

  • Electronics for Energy Management
    Dr. Bernard Courtois
    Director of CMP and TIMA, France

  • The Packaging Technology Domain
    Prof. Younggap You
    Dean of College of Electrical and Computer Engineering, Chungbuk National University, Korea

  • Challenges in Interconnection
    Dr. ChoonHeung Lee
    Head of Corp. Technology, Amkor, Korea

  • Advances in High Density Interconnections-Promoting Innovations and Lower Costs
    Happy Holden
    Chief Technical Officer, Foxconn Advanced Technology, Taiwan

ASQED is pleased to offer the following tutorials by industry experts:


  • A Tool Box for Successful 3D Integration
    Mark Scannell
    Program Director, 3D Integration
    CEA - Léti, France

  • Modern 3D Packaging Technologies Driving the Need for IC, Package and Printed Circuit Board (PCB) Co-Design Methodologies
    John Park
    Methodology Architect
    Mentor Graphics, USA

  • Memory Packaging Challenges and Approaches for the Evolving World of the Portable Client and Cloud
    Richard Crisp
    Principal Technologist
    Tessera, USA

  • 3D Silicon Interposer and Through Silicon Via (TSV): Application, Requirement, Infrastructure and Technologies
    Farhang Yazdani
    President and CTO
    BroadPak Corporation, USA

Technical Sessions
The ASQED technical sessions consist of over 50 papers by engineers and researchers worldwide.

ASQED is the third event organized by the International Society for Quality Electronic Design ( www.ISQED.com) in Asia. Conference proceedings are published by the IEEE.
Please visit http://www.asqed.com for more information and to register.

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Press Contact:
Georgia Marszalek
ValleyPR LLC for ASQED

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