Panelists Include Industry Experts from Amazon, Texas Instruments, Synopsys, IBM, Physware and Cadence
SANTA CLARA, Calif. — (BUSINESS WIRE) — January 28, 2011 — Physware, Inc., a leading provider of high-speed and high capacity 3D electro-magnetic solutions for Signal Integrity (SI), Power Integrity (PI), Electromagnetic Interference (EMI) Integrity and Simultaneous Noise Integrity (SNI), today announced that Physware Founder and Professor of electrical engineering at the University of Washington, Dr. Vikram Jandhyala, will chair a panel on “Cloud Computing for Electronic Co-Design: Challenges and Opportunities” at DesignCon 2011 being held at the Santa Clara Convention Center, Santa Clara, CA between January 31 to February 3, 2011.
This panel brings together experts from Texas Instruments, IBM, Cadence, Synopsys, Amazon Web Services, and Physware who will impact and be impacted by cloud computing in EDA from very different viewpoints including as cloud and IT providers, EDA strategists, scalable code developers, electronic designers and cloud users.
The panel will focus on potentially disruptive opportunities and associated challenges in cloud computing for electronic co-design EDA including:
- Challenges in addressing the niche EDA market
- Challenges in early adoption and subsequent scaling
- Going beyond SaaS: Scalable EDA cloud computing
- Assuring IP protection and design security
- Role of virtualization software and software libraries
- Porting public cloud models to private cloud models
- Usability and functionality challenges and approaches
- Design benefits for end users
- Symbiotic business models
- Interoperability of cloud-based EDA flows from multiple vendors
- EDA license models and deployment and management on the cloud
Panelists include Dr. Bruce Archambeault, IBM, Dr. Dipanjan Gope, Physware, AJ Incorvaia, Cadence Design Systems, Dr. Souvik Mukherjee, Texas Instruments, Hasmkukh Ranjan, Synopsys, and Dr. Deepak Singh, Amazon Web Services. This promises to be an educational and entertaining panel, with panelists asked to comment on what they see as bottlenecks, how they perceive adoption over the next few years, and whether they view changes as disruptive or evolutionary.
When: Wednesday, February 2, 2011, 3.00pm – 3.50pm
Where: ChipHead Theater, Santa Clara Convention Center, Santa Clara, CA
Physware provides high-speed and high-capacity 3D electromagnetic signal integrity, power integrity and EMI analysis field solutions for the microelectronics industry. Physware’s accelerated technology delivers unprecedented capacity handling, significantly faster speed than current methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising Maxwell accuracy. Physware technology leverages the ongoing trend towards pervasive parallel computing, in particular multi-core CPUs and Cloud Computing. The company’s patented, physics-aware technology enables efficient chip-package-system co-design and robustness and efficiency at every step of the design cycle while significantly reducing time to market.
Physware is a venture-backed, privately-held company led by an experienced management team. The technology is based on multiple patented methodologies. For additional information, please visit www.physware.com or visit Physware at Booth #115 at DesignCon 2011.
Bala Vishwanath, Chief Marketing Officer