Company Accelerates Transition to Scalable and Parallel System Simulation
MOUNTAIN VIEW, CA. – January 26, 2011 – Physware, a leading provider of scalable and parallel solutions for Signal Integrity (SI), Power Integrity (PI), Electromagnetic Interference (EMI) and Simultaneous Noise Integrity (SNI), today announced the appointment of Dr. Don MacMillen as Vice President of Engineering.
Don MacMillen, Ph.D, has over 25 years of experience in both the Semiconductor and EDA industries. He was with Synopsys in a variety of roles including Vice President of Engineering for Mixed Signal Simulation and Vice President of the Advanced Technology Group. After Synopsys, he was Vice President of Software Engineering at Stretch, a fabless semiconductor company focused on applications of reconfigurable computing to video encoding. Dr. MacMillen had also previously worked at VLSI Technology, Sierra Semiconductor and Inmos Corporation. Don received his M.S. and Ph.D. degrees in Theoretical Chemistry from University of Rochester in New York.
“I am thrilled to join the Physware team and to help build next-generation technologies that harness the cloud for scalable and secure solutions for chip-package-system co-design”, said Dr. MacMillen. “Physware has a proven track record of delivering superior solutions and the company is well-positioned to offer the most unique and robust design solutions for the shifting scalable and secure computing requirements.”
“Don brings enormous experience in building enterprise class design and simulation Software and is the perfect candidate to navigate Physware towards the next stage of growth”, said Physware CEO Dr. Raul Camposano. “He will be instrumental in helping Physware deliver superior parallel computing EDA solutions to meet the ever-changing needs semiconductor companies face in today’s era of massive designs and cloud computing.”
Physware technology leverages the ongoing trend towards pervasive parallel computing, in particular multi-core CPUs and Cloud Computing. The company’s patent-pending, physics-aware technology tightly couples analysis and design methods to the underlying Maxwell’s and circuit equations, enabling efficient chip-package-system co-design and robustness and efficiency at every step of the design cycle while significantly reducing time to market. Physware’s accelerated technology delivers unprecedented capacity, handling in 3DIC, package and system simulations.
Physware provides high-speed and high-capacity 3D electromagnetic signal integrity, power integrity and EMI analysis field solutions for the microelectronics industry. Physware’s accelerated technology delivers unprecedented capacity handling, significantly faster speed than current methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising Maxwell accuracy.
Physware is a venture-backed, privately-held company led by an experienced management team. The technology is based on multiple industry publications and patented methodologies. For additional information, please visit www.physware.com.
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Bala Vishwanath, Physware, 800-686-5213, email@example.com