Modeling and Optimization of Electronic PCB/Packaging for Signal and Power Integrity, Oct. 14

Using advanced layout import and complete solver technology to characterize the signal throughput and power distribution on PCBs and packages.

  • Location: Worldwide
  • Date: 14 Oct 2010
  • Time: 2PM Eastern, 11 AM Pacific
  • Duration: 45 Minutes
  • Register here

CST Microwave Studio makes working with complex PCBs and packages easy. It has powerful import filters for proprietary layout formats such as Cadence Allegro and Sip SI, as well as interchange formats such as ODB++, Gerber and DXF. The filters allow an engineer to directly import a full package or PCB, verify the stack up, materials and components and then extract the nets or areas of interest into the 3D environment This presentation will show how 3D simulation is becoming an essential part of the signal and power integrity workflow. Various PCB and package examples will be shown and a new backend simulation feature of Cadence tools will be described where the layout engineer stays in his familiar environment and the software runs 3D simulation in the background.

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