Winbond Adopts SpringSoft Laker Layout and Routing Systems for Design of High Performance, Low Power Memory Chips

Hsinchu, Taiwan, August 24, 2010 — SpringSoft, Inc., a global supplier of specialized IC design software, today announced that Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions headquartered in Taichung, Taiwan, has adopted the Laker™ Custom Layout Automation System including the Laker digital routing solution. With the deployment of Laker layout tools and design flows, Winbond has reduced development time by 70 percent for new memory chip designs targeting a variety of mobile memory applications, such as SDR, low power DDR, and cellular RAM.

Winbond’s major products include Specialty DRAM, Mobile RAM, NOR Flash and Graphic DRAM that feature the characteristics of high performance and high speed and are widely used by leaders in the consumer, communication, computer peripheral and automobile markets. The Laker system provides easy-to-use, automated tools including routing solutions that enable Winbond design teams to achieve significant time savings at both the block and chip level, schematic-driven layout (SDL) flow to increase user productivity, and built-in scriptable cells that dramatically reduce cell library development time.

“As a leading IC provider to the mobile memory market, Winbond strives to provide customer-driven memory solutions with high performance, high reliability products. SpringSoft provides our design teams with powerful layout automation technologies and highly flexible design flows that are backed by excellent technical support. Using Laker, our design teams have been able to drastically cut routing and verification cycles for 65-nanometer designs compared to other layout tools, while also continuously modifying designs to ensure the optimum power and highest quality implementation,” said Mu-Tsai Lo, deputy director of the DRAM Design Department III at Winbond.

“Companies around the globe rely on Winbond memory solutions across a broad range of applications and industries. For Winbond development teams, Laker’s focus on design excellence and saving time is key to meeting their aggressive product goals and delivery schedules,” said Duncan McDonald, director of custom IC product marketing at SpringSoft.

About Laker Custom IC Design
Laker custom IC design solutions offer the power of controllable automation and unmatched interoperability to achieve superior layout results with less effort for analog, mixed-signal, and custom digital designs. More than 300 companies, including many of the world’s leading semiconductor companies, have adopted the Laker layout system for designs down to 28 nanometers. For more information about Laker products, visit: http://www.springsoft.com/products.

About SpringSoft
SpringSoft, Inc. (TAIEX: 2473) is a global supplier of specialized automation technologies that accelerate engineers during the design, verification and debug of complex digital, analog and mixed-signal ICs, ASICs, microprocessors, and SoCs. Its award-winning product portfolio features the Novas™ Verification Enhancement and Laker Custom IC Design solutions used by more than 400 of today's leading IDM and fabless semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, and San Jose, California, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with more than 400 employees located in multiple R&D sites and local support offices around the world. For more information, visit www.springsoft.com.