11 French High-Tech Organizations to Present Latest Technologies At SEMICON West

Will Join SEMI Europe Grenoble Office Booth, No. 1045, South Hall

GRENOBLE, France — (BUSINESS WIRE) — July 9, 2010 — SEMI Europe Grenoble Office announced today that eleven French semiconductor equipment and solution providers will present their latest technologies at SEMICON West in its booth, No. 1045, South Hall.

Alpsitec

Alpsitec will present its new E460 E, an updated version of the E460 chemical and mechanical planarization R&D line, whose special carrier arrangement is designed for processing single 2-to-8 inch wafers, and even portions of a single wafer as small as 12-inch or 10 square millimeters. The E460 E also accommodates in-situ, ex-situ conditioning, maximum flexibility, multi-step recipes, integrated end-point detection, and easy-and-fast reconfiguration for various processes and various wafer sizes.

http://www.alpsitec.com/cmpenglish/index.php

CEA-Leti

CEA-Leti is a global R&D institute focused on micro- and nanotechnologies and their applications, ranging from wireless devices and systems to biology, healthcare and photonics. It collaborates with leading research organizations worldwide to develop new technologies and partners with companies in order to increase their competitiveness through technological innovation and transfers.

http://www-leti.cea.fr/en

DelfMEMS

DelfMEMS is a leading provider of stand-alone SPDT (Single Pole Double Throw) RF switches products built by combining DimSYS technology, silicon wafer-level packaging and through-via metal interconnections. The company’s switches enables customers to increase bandwidth while minimizing size, cost and consumption. Applications include instrumentation, ATE, mobile and space and defense, that will replace SS, Reed and EM relays. The company’s IP includes a free flexible membrane and an active pull-out system that solves many of the reliability issues associated with MEMS switches.

http://www.delfmems.com/

EOLITE Systems

EOLITE Systems produces high-power pulsed-fiber lasers for a variety of fine-technology micro-machining applications, including cutting, engraving, ablation, drilling, annealing, printing, scribing, patterning and LIBS. BOREAS HF, based on the company’s proprietary fiber-laser design, achieves unequalled performances for a short-pulse, high-beam- quality fiber laser at high repetition rate. The Octopus laser provides up to 16 fibers delivery diffraction-limited channels. BOREAS HF-G60 is the most powerful solution to achieve in the required time multiple processes in c-Si solar cells such as edge isolation, selective emitters engraving and diffusion process.

http://www.eolite.com/

FOGALE Nanotech

FOGALE nanotech, a globally recognized reference in the field of high accuracy dimensional metrology, is introducing MEMSCAN, the first inspection and metrology solution fully dedicated to MEMS manufacturing. Developed in partnership with MEMS manufacturers, MEMScan fits perfectly with MEMS manufacturing requirements for surface micromachining and wafer-level packaging process control. Both metrology and IR inspection are performed in one shot with one tool.

http://www.fogale.fr/~fogaleco/pages/home.php

IBS

IBS recently introduced PULSION®, the next-generation of plasma immersion ion implanter (PIII). Its unique polarization mode and pulsed-plasma configuration, using dual region chamber (CR) technology, delivers process stability, ultra-low energy and high throughput for advanced memory and logic applications. These applications include ultra-shallow junctions, without energy contamination; thin dielectric modification; nano- precipitates synthesis, hydrogen implantation, trench doping or conformal doping, and solar cells. IBS is partnering with Axcelis to deliver world-class support for PULSION.

http://www.ion-beam-services.com/

LCP’S Consultants

LCP’S Consultants is a company created in 1996 to support SMEs, large enterprises and other organizations in establishing and following up on R&D projects. They concentrate on microelectronics, micro- and nanotechnologies both for manufacturing and applications.

Presto Engineering

Presto helps IDMs and fabless customers improve new device predictability and speed to market by complementing their internal resources with comprehensive chip test and analysis. Supported by unique technical skills and extensive industry experience, Presto’s product-engineering services include RF and 3D integration and state-of-the-art ATE, reliability testing, failure analysis and fault isolation.

http://www.presto-eng.com.

Riber

Riber develops and manufactures molecular beam epitaxy (MBE) systems and evaporation sources and cells essential for manufacturing compound semiconductor materials used in numerous industrial, scientific and consumer applications, including new information technologies, OLED screens and new-generation solar cells.

The company’s MPVD 300 offers all the benefits of the molecular beam deposition technology: atomic control, abrupt interfaces and low thermal budget for silicon-based novel devices. MPVD 300 also allows an innovative solution for introducing new materials and developing new structures to further improve CMOS-based silicon devices.

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