Zarlink Optical Engine Slashes Size and Power Requirements for Green Data Center Interconnect

OTTAWA, ONTARIO, CANADA -- (MARKET WIRE) -- Mar 22, 2010 -- Zarlink Semiconductor Inc. (TSX: ZL)

- Zarlink Optical Engine (ZOE) meets power, performance and cost
  requirements for "green" data centers and computer clusters 
- To be demonstrated at OFC 2010 (Zarlink booth #519).  

Zarlink Semiconductor (TSX: ZL) announced that it is sampling ZOE (Zarlink Optical Engine), a speed-scalable family of multi-channel optical sub-assemblies that enables manufacturers to implement lower power, more efficient interconnects for data centers and computer clusters. ZOE is being demonstrated at OFC 2010 (San Diego Convention Center, March 23-25, Zarlink booth #519).

"Data center and computer cluster operators are demanding lower power optical products for equipment interconnect that support higher data rate performance," said Bertil Kronlund, product line manager with Zarlink's Optical Products Group. "Our ZOE platform is a precise flip chip array optical sub-assembly that is ultra-compact in size and form factors delivering per-channel data rates to 14 Gbps and supporting a clear technology path to 25 Gbps per channel for up to 300 Gbps aggregate of full bidirectional data traffic. The products deliver significant signal integrity, power per bit and cost per bit advantages over any previous data center interconnect products."

The ZOE optical sub-assembly comprises a 4- or 12-channel optical light source and detector, array electronic transmitter, and receive ICs precision-mounted on a flip-chipable glass subcomponent carrier with an external array-fiber coupler in an ultra compact 7x7 mm footprint. The platform includes products that terminate 40-120 Gbps full bidirectional optical links or array unidirectional (e.g. HDMI) or serial function while supporting leading signal integrity, data density and power efficiency. For example, in 4x10 Gbps applications the ZOE platform consumes less than 0.5W while delivering the industry's highest footprint density per gigabit.

Lead customers are currently sampling the first ZOE 40G products, with full commercial release planned for first half of this calendar year. ZOE evaluation kits are available now through Zarlink's optical product group sales team (

Editor's Note: A high-resolution photo of the ZOE platform and simplified block diagram are available at

About Zarlink Semiconductor

For over 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths including voice and data networks, optoelectronics and ultra low-power communications. For more information, visit

Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Regulatory Authorities, should visit the Company's web site at or contact Investor Relations.

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to integrate any business, technologies, product lines or services that we have or will acquire; our dependence on revenue generation from our legacy products in order to fund development of our new products; current market conditions, including the lack of liquidity in the markets and economic slowdown, may increase our operating costs or reduce our revenue, thereby negatively impacting our operating results; our ability to operate profitably and generate positive cash flows in the future; the impact of the current economic crisis on our suppliers and customers and our ability to transfer parts to other suppliers; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; our substantial indebtedness could adversely affect our financial position; the cost and accounting implications of compliance with new accounting standards; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing.

Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

Zarlink Semiconductor Inc
Ed Goffin
Media Relations and Investor Relations

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