Company's Newest High-Performance, Low-Power Microcontroller Ideal for High Performance, Low Power, General Purpose Applications
According to Andrew Burt, vice president of the Imaging and Communications Marketing Group at TAEC, "The TMPM330FDFG delivers high-code efficiency for better memory storage, exceptional interrupt handling and low power consumption. The device can achieve the cost/performance equivalent of a 16-bit core, but with 32-bit performance. This is an exceptional device and we intend to add similar products to our microcontroller lineup to support different markets."
At no extra cost to the customer, the TMPM330FDFG also features a CEC (Consumer Electronic Control), which is a device control method standardized for HDMI (High-Definition Multimedia Interface). With CEC, signal processing is performed in hardware, which simplifies software processing and conserves memory utilization, peripheral functions and CPU resources, freeing those resources for other functions.
With an operating frequency of 40MHz, the TMPM330FDFG achieves the lowest power consumption in its class, about 15mW, and the fastest programming/erasing speed, approximately two seconds, for its class in the industry. The TMPM330FDFG has an integrated 12-channel A/D converter to enable high-speed conversion of analog data from various sensors in 1.15 microseconds. Other features include:
-- Power voltage: 2.7V to 3.6V -- On-chip ROM/RAM: 512-KB FLASH ROM; 32-KB RAM -- Built-in functions: 16-bit timer: 10 channels, -- I2C/SIO: 3 channels -- SIO/UART: 3 channels -- UART channels can operate in three modes: 7-bit, 8-bit and 9-bit -- CEC: 1 channel which can be disabled in software if desired -- 1.25 DMIPS/MHZ performance -- Implements the ARM architecture V7 M -- Optimized design using low power consumption library -- Ultra-low power consumption modes -- Fast interrupt response for critical real-time applications. -- Package: LQFP100 (14mm x 14mm, 0.5mm pitch)
Pricing and Availability
Pricing for the TMPM330FDFG is $6 each in 10K quantities. Samples will be available in December 2008 and mass production is scheduled to begin in March 2009.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue Ranking, April 2008). For additional company and product information, please visit http://www.toshiba.com/taec/.
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Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.chips.toshiba.com, or from your TAEC representative.