SEMATECH to Host 3D IC Workshop on Manufacturing and Reliability

ALBANY, N.Y. & AUSTIN, Texas—(BUSINESS WIRE)—August 18, 2008— SEMATECH will host global experts representing a broad spectrum of the semiconductor industry at a workshop designed to explore manufacturing and reliability challenges for three-dimensional integrated circuit (3D IC) products. The forum, entitled Manufacturing and Reliability Challenges for 3D ICs using TSVs, will be held in conjunction with the Advanced Metallization Conference, September 25 and 26, at the Del Mar Fairgrounds in San Diego, California.

The workshop will feature informative sessions on applications, manufacturing processes, and reliability issues of through silicon via (TSV) technology. Participants from various disciplines will have the opportunity to address and actively discuss challenges of 3D IC integration with TSV, including physical design, processing options, failure mechanisms, and practical issues that impact cost, schedule, and performance.

We are very excited to support the growth of this enabling technology by bringing together some of the industrys leading researchers and practitioners to stimulate discussion on the real-world manufacturing and reliability challenges of TSVs, said Larry Smith, committee chairman and SEMATECHs 3D reliability and product interlock expert. Our goals are to identify key challenges so that 3D IC products can be introduced on schedule with the expected cost, performance and reliability.

The workshop curriculum includes technical presentations and a poster session led by key representatives from IBM, Qualcomm, Atotech, TechSearch, SUSS MicroTech, Alchimer, AllVia, University of Texas at Austin, Rensselaer Polytechnic Institute, Fraunhofer IZM, SINTEF, NXP Semiconductors, Ebara, Tango, Air Products, STS, Applied Materials, EV Group and PVA-Tepla.

3D ICs using TSV have the potential to play a very important role in semiconductor manufacturing. TSVs can improve electrical performance, lower power consumption, enable the integration of heterogeneous devices, shrink device size, and reduce cost. SEMATECH hosts a variety of forums to accelerate the adoption of these technologies and to drive industry consensus on the different 3D options. SEMATECHs 3D program encompasses equipment evaluations, unit processes, integration and metrology.

Registration for this event is open to both SEMATECH members and the general public. For more information on the September workshop, including registration and other relevant information, please visit: http://www.sematech.org/meetings/announcements/8510/.

About SEMATECH:

For 20 years, SEMATECH® ( www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.



Contact:

SEMATECH
Erica McGill, 518-956-7446
Email Contact




Review Article Be the first to review this article

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
H-1B Visa: de Geus’ tragedy looms large
Peggy AycinenaIP Showcase
by Peggy Aycinena
IP for Cars: Lawsuits are like Sandstorms
More Editorial  
Jobs
Lead Java Platform Engineer IOT-WEB for EDA Careers at San Francisco Area, CA
Staff Software Engineer - (170059) for brocade at San Jose, CA
Mechanical Designer/Engineer for Palo Alto Networks at Santa Clara, CA
Technical Support Engineer EU/Germany/UK for EDA Careers at N/A, United Kingdom
Technical Support Engineer for EDA Careers at Freemont, CA
ASIC/FPGA Design Engineer for Palo Alto Networks at Santa Clara, CA
Upcoming Events
2017 IoT Developers Conference at Santa Clara Convention Center California - Apr 26 - 27, 2017
Embedded Systems Conference ESC Boston 2017 at Boston Convention & Exhibition Center Boston MA - May 3 - 4, 2017
2017 GPU Tech Conference at San Jose McEnery Convention Center 150 West San Carlos Street San Jose CA - May 8 - 11, 2017
High Speed Digital Design and PCB Layout at 13727 460 Ct SE North Bend WA - May 9 - 11, 2017
DAC2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy