UMC's Embedded DRAM, URAM(TM) Proven in 65nm Customer Silicon

HSINCHU, Taiwan—(BUSINESS WIRE)—August 4, 2008— UMC (NYSE:UMC)(TSE:2303), a leading global semiconductor foundry, today announced that it has produced functional 65nm customer products incorporating URAM, the companys patented embedded DRAM (eDRAM) technology. URAM enables higher performance, lower power consumption, and reduced chip size compared to traditional embedded 6T SRAM or external DRAM. URAM, which is the only available proprietary embedded DRAM solution in the pure-play foundry industry, is already in production at UMC for 90nm customer products.

Raymond T. Leung, vice president of memory IP development at UMC, said, The advanced products that power todays digital economy require sophisticated technology solutions to satisfy the rigorous demands for lower power consumption, higher performance, and smaller form factor. UMCs URAM effectively addresses the needs of SoC designs for a broad range of applications, including storage media, communications, and graphics and imaging systems, by providing a high-density memory that delivers up to a 50 percent area reduction over standard 6T SRAM.

About UMCs URAM

URAMs ultra high density, 1/4 to 1/5 the size of 6T SRAM with a macro area of approximately 1/2 to 1/3 times the size of SRAM, allows for smaller overall form factor so that designers can fit more functions within a smaller chip area. Customers utilizing URAM on either UMCs standard or low-leakage processes will be able to design for higher bandwidth, thus increasing operating speed while reducing power consumption due to fewer I/O drivers.

URAMs logic process compatibility, scalable trench cell architecture and SRAM-like interface enable seamless integration into customer designs and existing IP. Since URAM is a proprietary UMC-developed technology, the foundry provides comprehensive, dynamic design support for customers utilizing URAM for their designs. For more information, please contact Email Contact.

About UMC

UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced system-on-chip (SoC) designs for applications spanning every major sector of the IC industry. UMCs SoC Solution Foundry strategy is based on the strength of the companys advanced technologies, which include production proven 90nm, 65nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.



Contact:

KJ Communications
Eileen Elam, 408-927-7753 (USA)
Email Contact
or
UMC
Alex Hinnawi, (886) 2-2700-6999 ext. 6958 (Taiwan)




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