OCP-IP Announces Part 1 of Network On Chip Benchmarking Specification

BEAVERTON, Ore.—(BUSINESS WIRE)—March 3, 2008— OCP-IP today announced that part one of the Network On Chip (NoC) Benchmarking specification has entered member review. Part one of the specification details requirements and features for application programs, synthetic micro-benchmarks, and abstract benchmark applications. It discusses ways to measure and benchmark reliability, fault tolerance, and testability of the on-chip communication fabric.

This specification was completed with the collaboration of a number of world's most prestigious universities working on NoC research including: University of British Columbia, Carnegie Melon University, Royal Institute of Technology, Tampere University of Technology and Washington State University and was supported by cooperation and participation of industry members from the OCP-IP NoC Benchmarking Working Group (NoC BWG). These companies include: GreenSocs, Nokia, Sonics, Synopsys, Texas Instruments, and Toshiba.

Members wishing to review and comment on part one of the NoC spec or join the OCP-IP NoC Benchmarking Working Group are invited to immediately contact admin@ocpip.org. To download a free copy of OCP-IP's white paper discussing the topic of NoC Benchmarking, visit http://www.ocpip.org.

About OCP-IP

The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia (NYSE:NOK), Sonics Inc., Synopsys (SNPS), Texas Instruments (NYSE:TXN), and Toshiba Semiconductor Group (including Toshiba America TAEC). OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. For additional background and membership information, visit www.OCPIP.org.

NOTE: All trademarks and service marks are the property of their respective owners.

Contact:

OCP-IP
Ian Mackintosh, 408-761-5980
Email Contact
or
VitalCom
Joe Basques, 512-249-6264
Email Contact




Review Article Be the first to review this article
Aldec

Featured Video
Jobs
Senior Electrical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Principle Electronic Design Engr for Cypress Semiconductor at San Jose, California
Director, Business Development for Kongsberg Geospatial at Ottawa, Canada
Director, Business Development for Kongsberg Geospatial at remote from home, Any State in the USA
Upcoming Events
IPC Technical Education - PCB Layout - Place and Route at Del Mar Fairgrounds 2260 Jimmy Durante Blvd. Del Mar CA - May 2, 2018
IPC Technical Education at Wisconsin Center 400 W Wisconsin Ave. Milwaukee WI - May 8, 2018
IPC High Reliability Forum at Embassy Suites: Baltimore-At BWI Airport 1300 Concourse Drive Linthicum MD - May 15 - 17, 2018
DownStream: Solutions for Post Processing PCB Designs
TrueCircuits: IoTPLL
DAC2018



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise