"Licensing our SlimChip 3G modem technology to a leading Asian semiconductor manufacturer accelerates our participation in the world's largest mobile market," commented Mark Lemmo, Executive Vice President, Business Development for InterDigital. "In addition to this new relationship, our SlimChip solutions generated a great amount of interest at the recent Mobile World Congress in Barcelona as a very attractive way to participate in the rapidly growing market for mobile broadband devices."
InterDigital's family of SlimChip(TM) solutions include, high performance baseband ICs, broadband modem IP, and complete reference platforms. SlimChip products feature advanced receiver technology with receive diversity, providing superior interference mitigation resulting in higher data speeds and better coverage. In pre-customer trials on live networks and in the lab, the SlimChip Reference Platform in an Express Card form factor has delivered true mobile broadband performance with data speeds of up to 7.2 Mbps in the downlink and 1.5 Mbps in the uplink. The SlimChip design supports speeds of up to 10 Mbps in the downlink and 5.7 Mbps in the uplink, respectively.
InterDigital designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip(TM) high performance mobile broadband modem solutions, consisting of Baseband ICs, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.
For more information, visit: www.interdigital.com
InterDigital and SlimChip are trademarks of InterDigital, Inc.