InterDigital Licenses 3G Modem Technology to Leading Asian Semiconductor Company

KING OF PRUSSIA, Pa.—(BUSINESS WIRE)—February 27, 2008— InterDigital, Inc. (NASDAQ: IDCC) announced it has licensed its 3G modem technology to a leading Asian fabless semiconductor company. InterDigital's SlimChip(TM) Mobile Broadband Modem IP, high-performance WCDMA/HSDPA/HSUPA baseband designs and protocol stack software, has been selected for integration in the company's dual mode chips. Under the licensing agreement, InterDigital will provide complete UMTS 3GPP Release 6 modem technology and customer support.

"Licensing our SlimChip 3G modem technology to a leading Asian semiconductor manufacturer accelerates our participation in the world's largest mobile market," commented Mark Lemmo, Executive Vice President, Business Development for InterDigital. "In addition to this new relationship, our SlimChip solutions generated a great amount of interest at the recent Mobile World Congress in Barcelona as a very attractive way to participate in the rapidly growing market for mobile broadband devices."

InterDigital's family of SlimChip(TM) solutions include, high performance baseband ICs, broadband modem IP, and complete reference platforms. SlimChip products feature advanced receiver technology with receive diversity, providing superior interference mitigation resulting in higher data speeds and better coverage. In pre-customer trials on live networks and in the lab, the SlimChip Reference Platform in an Express Card form factor has delivered true mobile broadband performance with data speeds of up to 7.2 Mbps in the downlink and 1.5 Mbps in the uplink. The SlimChip design supports speeds of up to 10 Mbps in the downlink and 5.7 Mbps in the uplink, respectively.

About InterDigital

InterDigital designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip(TM) high performance mobile broadband modem solutions, consisting of Baseband ICs, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.

For more information, visit:

InterDigital and SlimChip are trademarks of InterDigital, Inc.


InterDigital, Inc.
Media Contact:
Jack Indekeu, +1 610-878-7800
Email Contact
Investor Contact:
Janet Point, +1 610-878-7800
Email Contact

Review Article Be the first to review this article


Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Acquiring Mentor: Four Good Ideas, One Great
More Editorial  
SENIOR ASIC Design Engineer for TiBit Communications at Petaluma, CA
Sr. staff ASIC Design Engineer -2433 for Microchip at San Jose, CA
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
Upcoming Events
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
2016 International Conference On Computer Aided Design at Doubletree Hotel Austin TX - Nov 7 - 10, 2016
ICCAD 2016, Nov 7-10, 2016 at Doubletree Hotel in Austin, TX at Doubletree Hotel Austin TX - Nov 7 - 10, 2016
Electric&Hybrid Aerospace Technology Symposium 2016 at Conference Centre East. Koelnmesse (East Entrance) Messeplatz 1 Cologne Germany - Nov 9 - 10, 2016
DownStream: Solutions for Post Processing PCB Designs
Verific: SystemVerilog & VHDL Parsers

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy