Quantum Leap Packaging Acquires Connector-in-Package (CiP) Technology from Silicon Bandwidth

New Technology Complements Existing Product Portfolio and Broadens Customer Base for Next Generation Semiconductor Packaging Solutions

WILMINGTON, Mass.—(BUSINESS WIRE)—Oct. 24, 2005— Quantum Leap Packaging, a leading provider of high-performance electronic component packaging utilizing a proprietary Quantech(TM) Liquid Crystal Polymer (LCP) compound, today announced its purchase of the Connector-in-Package (CiP) product line from Silicon Bandwidth Inc. of San Jose, California. The new technology will complement and broaden Quantum Leap's current product portfolio to include applications utilizing Liquid Crystal on Silicon (LCOS). Quantum Leap will obtain all IP rights and assume direct customer support and manufacturing responsibility. Financial terms of the deal are not being disclosed.

CiP Technology combines semiconductor packaging with built-in connector systems, resulting in significant advantages over traditional chip-on-flex and chip-on-board solutions. Application benefits include higher overall yield and lower applied costs. A key product application utilizing CiP technology is for Liquid Crystal on Silicon (LCOS) packages which are used in projection displays, biomedical equipment and biometric sensors.

"This technology complements our existing product line, fits nicely within our target markets and will serve to broaden our customer base," said Jim LaCasse, CEO of Quantum Leap. "The acquisition has enabled Quantum Leap to simultaneously strengthen our portfolio while continuing to offer industry-leading, next generation semiconductor packaging solutions into the market place."

About Quantum Leap Packaging

Quantum Leap Packaging designs and manufactures electronic component packaging utilizing proprietary Quantech(TM) Liquid Crystal Polymer (LCP) compounds. Quantum Leap's unique material system meets the critical design and manufacturing requirements of a variety of applications such as Semiconductor, Medical and Optical devices, RF-Microwave and LDMOS, either in hermetic or non-hermetic configurations. As a packaging replacement for traditional metal or ceramic materials, Quantum Leap's Quantech(TM) compound delivers significant performance enhancements with a far greater cost of ownership. Incorporated in December 2002, Quantum Leap is headquartered in a 32,000 square foot facility at 200 Research Drive, Wilmington, MA 01887. For more information, please visit our website at www.qlpkg.com.

Quantum Leap Packaging, Quantech, and UltraSeal are trademarks of Quantum Leap Packaging, Inc. All other brands, products, or service names may be trademarks or service marks of the companies with which they are associated.



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