When: Monday, June 19 - Wednesday, June 21, 10am - 6pm
Where: QuickLogic booth number 2015
What: QuickLogic will demonstrate how its newest ArcticPro eFPGA technology is enabling developers to create SoC and ASIC platforms that can easily be tailored to serve multiple target applications. The company will also demonstrate how ultra-low power sensor fusion is implemented on an eFPGA to offload the CPU to maximize battery life and improve performance with standby current as low as 30uA and active power consumption of 125uA.
Who: Tim Saxe, QuickLogic's CTO
Title: "Minimizing IC Power Consumption: Top Down or Bottom up Design Methodology. What is the Starting Point?" - http://www2.dac.com/events/eventdetails.aspx?id=223-9
When: Monday, June 19, 3:30pm - 5:00pm
Where: Ballroom G
Who: Mao Wang, eFPGA Product Marketing Director
What: This presentation will outline the reasons why eFPGA IP is an ideal solution to address IoT and other fragmented markets. It's inherent post-fabrication flexibility delivers lower overall product costs, the ability to add or modify features and increase product differentiation.
Where: SMIC Booth # 1713
For more information, conference program schedules and exhibit hours, please visit https://dac.com
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Contact: Andrea Vedanayagam Veda Communications 408.656.4494 Email Contact