Company's Unique PLAD Technology Enables Effective Surface-Mount TVS PackagingALISO VIEJO, Calif., Jan. 4, 2017 — (PRNewswire) —
ALISO VIEJO, Calif., Jan. 4, 2017 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of two new versions of its transient voltage suppressor (TVS) devices in its patented plastic large area device (PLAD) package. The 18-kilowatt (kW) MPLAD18KP and 36-kW MPLAD36KP TVS families meet today's demanding lightning protection requirements in aircraft, including the multi-strike lightning standard (RTCA DO-160E), which have grown in importance as a result of the introduction and growing use of composite body airframes.
Microsemi's new products are high power TVS devices in low-profile surface-mount packages with design features to minimize thermal resistance and cumulative heating. Microsemi's unique plastic large area device (PLAD) technology enables more effective surface-mount TVS packaging for the MPLAD18KP and MPLAD36KP, as it combines a large die size with an exposed bottom contact for heat sinking that improves power handling as compared to through-hole devices. In addition, the devices provide the capability of a bond wire-free part in high vibration environments, supporting high reliability in harsh conditions.
"Our new high power TVS devices are critical for addressing multiple-stroke and multiple-burst events on aircraft, and leverage our team's deep expertise in this important area of protection for customers," said Christophe Warin, director of strategic marketing for Microsemi. "In addition to enabling these customers to meet the rigorous RTCA DO-160 section 22 standard for aircraft design, the MPLAD18KP and MPLAD36KP TVS families offer an efficient low-profile package design in standoff voltage selections of 14 volts (V) to 40 V in either unidirectional or bidirectional construction."
The 18-kW MPLAD18KP and 36-kW MPLAD36KP TVS devices are designed for a variety of applications within the aerospace market, including engine control units, actuator controls, power distribution, power density improvements, environmental controls, communications and instrumental systems. These TVS products, together with the recently launched aerospace power core module with integrated field programmable gate array (FPGA) and hybrid power drive, form an integral part of the power drive electronics architecture on more electric aircraft. The release of these products further emphasizes Microsemi's continued development in intelligent power solutions to meet the demand for increased levels of reliability and integration in the area of power electronics.
The two new devices are complementary to Microsemi's transient voltage suppressor portfolio for avionics that features low capacitance TVS, standard unidirectional and bidirectional TVS (surface mount and through-hole), TVS array and low capacitance TVS array solutions. In addition, the MPLAD18KP and MPLAD36KP lightning and automotive load dump protection allow their utilization in applications serving the automotive and defense markets, as they can provide a wide range of suppression capability for varying threat requirements either in a single or multiple devices.
With aircraft electrification continuing to increase, Microsemi's new devices are ideal to capitalize on this market growth. According to market research firm Markets and Markets, the global power surge protection device market is expected to grow from an estimated $2 billion in 2014 to $2.7 billion by 2019, at a compound annual growth rate (CAGR) of 5.3 percent from 2014 to 2019. Addressing these growing trends, Microsemi's new TVS devices offer protection from switching transients and induced radio frequency interference (RFI), with the ability to suppress transients up to 36,000 watts at 10/1,000 μs. Offering the high reliability necessary for the demands of this market, all parts are surge tested and available with various screening and conformance inspection options.
Additional key features include:
- Wafer fabrication and assembly lot traceability
- Optional upscreening available
- Moisture classification of Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
- RoHS compliant versions available
- 3σ lot norm screening performed on standby current (ID)
- Lower voltage converter versus axial
- Large die and excellent die to base connection
- No wire bonds
- Tested in accordance with the Automotive Electronics Council (AEC) Q101 stress test
Microsemi: Continued Leadership in TVS Devices
Microsemi offers the industry's broadest portfolio of TVS devices for applications within the avionics, defense, industrial, automotive and communications markets. Microsemi's TVS devices have been specifically deployed to protect engine control, actuator control, environmental control, power distribution, communications and instrumentation subsystems across all major current commercial airframes as well as military airframes in use worldwide. For more information about Microsemi's TVS devices, visit http://www.microsemi.com/product-directory/discretes/682-transient-voltage-suppressors.
Microsemi's 18-kW MPLAD18KP and 36-kW MPLAD36KP TVS families are available now. For more information, visit http://www.microsemi.com/document-portal/doc_download/136468-mplad18kp7-0a-to-mplad18kp200ca-datasheet and http://www.microsemi.com/document-portal/doc_download/136469-mplad36kp14a-mplad36kp400ca-datasheet, respectively, or contact Email Contact.
Microsemi's Aviation Centre of Excellence
In February 2016, Microsemi announced the opening of its Aviation Centre of Excellence in Ennis to support the design, development and manufacturing of its new product line of high reliability aviation IPS. The facility not only provides access to a portfolio of highly integrated, flexible and scalable solutions, but customers also have access to a full technical service provider as an extension of their design teams. The facility's new research and development laboratory is fully resourced with modeling, simulation, analysis and algorithm development capabilities providing accelerated product innovation. The state-of-the-art measuring equipment enables extensive product testing while a dedicated reliability laboratory facilitates product qualification and long-term application specific life testing. The Aviation Centre of Excellence enables the company to offer a complete solution for high reliability aviation intelligent power solutions from design to manufacturing.
Microsemi Giving Wings to Innovation in Commercial Aviation Electronics
Microsemi offers an industry-leading range of high reliability products and solutions for flight critical avionics and power conversion applications addressing the evolving needs of the aviation industry. Microsemi provides best-in-class field programmable gate array (FPGA) and system-on-chip (SoC) technology for low power and single event upset (SEU) immunity, broadest range of TVS solutions for lightning protection, high performance power discrete technology such as silicon carbide (SiC) MOSFETs, diodes and their ruggedized power modules, a comprehensive analog and mixed-signal integrated circuit (IC) capability including high temperature SiC transistor drivers and sensor interface ICs, Ethernet and networking technologies, radio frequency (RF) diodes, power transistors, MMICs, modules and subsystems, and advanced packaging services including high temperature (HT) Polymer packaging technology. For more information on Microsemi's aviation products and technologies, visit http://www.microsemi.com/applications/commercial-aviation.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the availability of two new versions of its transient voltage suppressor (TVS) devices in its patented plastic large area device (PLAD) package, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs in implementing the company's acquisitions and divestitures strategy or integrating acquired companies, uncertainty as to the future profitability of acquired businesses and realization of accretion from acquisition transactions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.